JPH04246830A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To equalize the levels of the bump electrodes formed on a semiconductor substrate without adjusting the semiconductor devices corresponding to individual thickness even if the thickness of multiple semiconductor substrates is differentiated. CONSTITUTION:The title semiconductor manufacturing device is provided with a fixing base 3 mounting a semiconductor substrate 1 whereon bump electrodes 2 are formed and a pressurizing jig 5 is arranged on the opposite side to the side wherein the bump electrodes 2 of the semiconductor substrate 1 are formed while the resions excluding the bump electrodes 2 between the surface of said semiconductor substrate 1 and the pressurizing jig 5 are held by compressible members 4 so that the pressurizing force of said jig 5 may be borne up by said compressible members 4 and said bump electrodes 2 so as to form the bump electrodes 2 at specific level on the semiconductor substrate 1.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus that uniformizes the height of protruding electrodes (bumps) on a semiconductor substrate by applying pressure.

0002

2. Description of the Related Art In recent years, assembly of semiconductor devices using the bump method has become widespread, and it is known that making the heights of the bumps uniform greatly affects the reliability of assembly.

Conventionally, when making the height of bumps on semiconductor substrates uniform, since the thickness of each semiconductor substrate was different, the height of the stopper or fixing table was adjusted according to the thickness of each semiconductor substrate. However, by keeping the distance from the stopper to the surface of the semiconductor substrate constant, the height of the bumps was made uniform.

FIG. 3 is a block diagram of a semiconductor manufacturing apparatus using a conventional leveling method. In FIG. 3, 1 is a semiconductor substrate, 2 is a bump, 3 is a fixing base, 5 is a pressing jig, and 8 is a stopper.

The operation of the semiconductor manufacturing apparatus constructed as described above will be explained below. The thickness of the semiconductor substrate 1 is measured at several points to find the average value, and the fixing table 3,
Stopper 8 was replaced and leveling was performed.

[0006]

[Problems to be Solved by the Invention] However, in the above-mentioned conventional configuration, the height of the stopper or fixing table is replaced or adjusted depending on the thickness of the semiconductor substrate, resulting in operational loss of the manufacturing equipment. Ta. In addition, it required a lot of man-hours, and the reliability of the work was lacking.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a semiconductor manufacturing apparatus that can easily uniformize the height of bumps even on semiconductor substrates having different thicknesses.

[0008]

[Means for Solving the Problems] In order to achieve this object, the present invention interposes a compressible member between a pressure jig and a semiconductor substrate, thereby applying pressure mainly by the compressible member. It is configured to receive the pressing force of the jig.

[0009]

[Operation] In the leveling method with this configuration, a compressible member is sandwiched between the semiconductor substrate and the pressure jig, so the pressure surface of the pressure jig is not affected by the thickness of the semiconductor substrate. and the surface of the semiconductor substrate can be kept constant in the compressible range. Therefore, even if the number of bumps increases or decreases or the thickness of a plurality of semiconductor substrates slightly differs, the distance from the surface of the semiconductor substrate to the top of the bump electrode can be kept constant.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a block diagram of a semiconductor manufacturing apparatus according to an embodiment of the present invention. In FIG. 1, 1 is a semiconductor substrate, 2 is a bump, 3 is a fixing base, 4 is a compressible member, 5 is a pressure jig, 6 is a universal joint, and 7 is a cylinder shaft.

The semiconductor substrate 1 is placed on a fixing table 3, and pressurized with a pressing jig 5 via a compressible member 4 installed in an area other than the bumps 2. The pressing jig 5 presses and compresses the bump 2 and the compressible member 4. By the above operation, the bumps 2 on the surface of the semiconductor substrate 1 can be efficiently leveled all at once, and the heights of the bumps 2 can be made uniform. At this time, the pressure jig 5 is connected to the cylinder shaft 7 by a universal joint 6, so that the surface of the pressure jig 5 is uniformly abutted against the compressible member 4 when pressurizing the bump. 2 can be finished to a predetermined height within the plane of the semiconductor substrate 1.

FIG. 2 shows a compressible member 4 attached to the surface of a pressing jig 5, and its operation is the same as that in FIG. 1. In this case, if the compressible member 4 has adhesive properties, the work efficiency will be improved, but if quality is a problem, the compressible member 4 can be applied in exactly the same way even if it does not have adhesive properties. Further, by automating the pasting of the compressible member 4, the number of man-hours is reduced. The compressible member 4 may be attached to the upper surface of the semiconductor substrate 1, and the pressurizing force may be applied by a hydraulic cylinder, a pneumatic machine, or an electric motor.

[0014]

Effects of the Invention As described above, the present invention makes it possible to make the height of bumps uniform even on semiconductor substrates having different thicknesses by using a compressible member, thereby reducing the number of man-hours and improving quality. Accordingly, it is possible to realize a semiconductor manufacturing apparatus that can improve reliability and reliability.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a configuration diagram of a semiconductor manufacturing apparatus according to another embodiment of the present invention.

[Figure 3] Configuration diagram of conventional semiconductor manufacturing equipment

[Explanation of symbols]

1 Semiconductor substrate 2 Bump (protruding electrode) 3 Fixed stand 4 Compressible members 5 Pressure jig

Claims (3)

[Claims] 1. A fixing table for mounting a semiconductor substrate on which a protruding electrode is formed, and a pressing jig disposed opposite to a side of the semiconductor substrate on which the protruding electrode is formed, the surface of the semiconductor substrate being pressed against the surface of the semiconductor substrate. A compressible member is sandwiched between the pressing jig and the area other than the protruding electrode, and the compressible member and the protruding electrode receive the pressing force of the pressing jig, and the protruding electrode on the semiconductor substrate is held at a certain level. Semiconductor manufacturing equipment that molds to different heights. 2. The semiconductor manufacturing apparatus according to claim 1, wherein a compressible member is attached to the pressing jig. 3. The semiconductor manufacturing apparatus according to claim 1, wherein a compressible member is attached to the upper surface of the semiconductor substrate.