JPH0425094A - Multilayer interconnection substrate - Google Patents
Multilayer interconnection substrateInfo
- Publication number
- JPH0425094A JPH0425094A JP12783790A JP12783790A JPH0425094A JP H0425094 A JPH0425094 A JP H0425094A JP 12783790 A JP12783790 A JP 12783790A JP 12783790 A JP12783790 A JP 12783790A JP H0425094 A JPH0425094 A JP H0425094A
- Authority
- JP
- Japan
- Prior art keywords
- polyphenylene oxide
- resin
- hardening
- heat
- oxide resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 16
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 11
- 229920006380 polyphenylene oxide Polymers 0.000 claims abstract description 11
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 239000005062 Polybutadiene Substances 0.000 abstract description 5
- 229920002857 polybutadiene Polymers 0.000 abstract description 5
- 239000003505 polymerization initiator Substances 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract 2
- 239000004342 Benzoyl peroxide Substances 0.000 abstract 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 abstract 1
- 235000019400 benzoyl peroxide Nutrition 0.000 abstract 1
- 229920006037 cross link polymer Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 21
- 239000011521 glass Substances 0.000 description 7
- -1 polyphenylene Polymers 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000004744 fabric Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920000265 Polyparaphenylene Polymers 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical group C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012765 fibrous filler Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野〕
本発明は電子機器・電気機器、コンピューター、通信機
器等に用いられる多層配線基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a multilayer wiring board used in electronic/electrical equipment, computers, communication equipment, etc.
Ｃ従来の技術〕
従来の多層配線基板は所要枚数の内層材の上面及び又は
下面にエポキシ樹脂やポリイミド樹脂を含浸したガラス
布からなるプリプレグを所要枚数配し、更に最外層に片
面金属張積層板や金属箔からなる外層利を配設した積層
体を一体化してなるものであるが、内層材がファインパ
ターンになる程、回路間のＨ］脂充填性が低下し、且つ
高周波特性に欠ける問題があった。C. Prior art] A conventional multilayer wiring board has a required number of inner layer materials, a required number of prepregs made of glass cloth impregnated with epoxy resin or polyimide resin on the upper and/or lower surfaces, and a single-sided metal-clad laminate as the outermost layer. It is made by integrating a laminated body with an outer layer made of metal foil and metal foil, but the finer the pattern of the inner layer material, the lower the fat filling property between the circuits and the problem of lacking high frequency characteristics. was there.
従来の技術で述べたように、従来の多層配線基板では内
層回路間の樹脂充填性が低下し、高周波特性に欠ける問
題がある。本発明は従来の・技術における上述の問題点
に鑑みてなされたもので、その目的とするところは内層
回路間の樹脂充填性、高周波特性に優れた多層配線基板
を提供することにある。As described in the section on the prior art, conventional multilayer wiring boards have a problem in that resin filling properties between inner layer circuits are reduced, resulting in a lack of high frequency characteristics. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a multilayer wiring board with excellent resin filling properties between inner layer circuits and high frequency characteristics.
〔問題点を解決するための手段］
本発明は所要枚数の内層材の上面及び又は下面に熱硬化
性ポリフエニレンオギサイド樹脂フィルムを配し、更に
最外層に外層材を配設した積層体を一体化してなること
を特徴とする多層配線基板のため、フィルムにより内層
回路間の樹脂充填性が向上し、ポリフェニレンオキサイ
ド樹脂により高周波特性に向」ニさせることができたも
ので、以正本発明の詳細な説明する。[Means for Solving the Problems] The present invention provides a laminate in which a required number of inner layer materials are provided with thermosetting polyphenylene ogicide resin films on the upper and/or lower surfaces, and an outer layer material is further provided as the outermost layer. This is a multilayer wiring board characterized by being formed by integrating the above, so the film improves the resin filling between the inner layer circuits, and the polyphenylene oxide resin improves high frequency characteristics. Detailed explanation of.
本発明に用いる内層材としては、フェノール樹脂、エポ
キシ樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂、
熱硬化性ポリフェニレンオキサイド樹脂、弗素樹脂、ポ
リブタジェン樹脂、ポリフェニレンザルファイド樹脂、
ポリブチレンチレフクレート樹脂、ポリエチレンテレフ
クレーＩ・樹脂等の樹脂の単独、変性物、混合物をガラ
ス、アスヘスト等の無機繊維やポリエステル、ポリアク
リル、ポリビニルアルコール、ポリアミド、ポリイミド
等の有機合成繊維や木綿等の天然繊維からなる織布、不
織布、マット、紙又はこれらの組合せ基材に含浸してな
る樹脂含浸基材と銅、アルミニウム、鉄、ニッケル、亜
鉛等の金属箔からなる金属張積層板に回路を形成したも
のである。熱硬化性ポリフェニレンオキサイド樹脂フィ
ルムとしては、ポリ（２・６ジメチルト４フェニレンオ
キサイド）等のポリフェニレンオキサイドに対し、■・
２ポリブタジエン、■・４ポリブタジエン、スチレンブ
タジェンコポリマー、変性１・２ポリブタジエン（マレ
イン変性、アクリル変性、エポキシ樹脂１等）、トリア
リルイソシアヌレ−１・、ゴム類等の架橋性ポリマー、
ヘンヅイルパーオキサイト、２・５ジメチル２・５ジヘ
ンゾイルバーオキシヘキサン、クーシャリ−ブチルパー
オキシベンジェ−１・、ジクミルパーオギサイド等の重
合開始剤等からなる熱硬化性ボリフエニレンオキザイド
樹脂を厚さ０．０５〜０．５ ｍｍのフィルムにしたも
ので、必要に応して所要枚数用いることができ、更に必
要に応して熱硬化性ポリフェニレンオキサイド樹脂には
水酸化アルミニウム、タルク、シリカ、アルミナ、炭酸
カルシウム、炭酸マグネシウム等の無機充填剤やガラス
繊維ヂンプ・アスベスト、木粉、パルプ、綿粉等の繊維
質充填剤を添加することもできる。外層材としては片面
銅張ガラス布基材エポキシ樹脂積層板、片面銅張ガラス
布基材ポリイミド樹脂積層板等の各種片面金属張積層板
や銅箔、アルミニウム箔等の金属箔を用いるものである
。外層材には必要に応して接着性を向上させるための接
着剤層を設けておくこともてきる。積層体の一体化手段
としてはプレス、多段プレス、マルチロール、ダブルベ
ルト等の任意一体化手段を用いることができる。Inner layer materials used in the present invention include phenolic resin, epoxy resin, unsaturated polyester resin, polyimide resin,
Thermosetting polyphenylene oxide resin, fluororesin, polybutadiene resin, polyphenylene sulfide resin,
Single, modified products, and mixtures of resins such as polybutylene terephrate resin and polyethylene tereflex clay I/resin can be used with inorganic fibers such as glass and ashest, organic synthetic fibers such as polyester, polyacrylic, polyvinyl alcohol, polyamide, and polyimide, and cotton. A metal-clad laminate consisting of a resin-impregnated base material made by impregnating a woven fabric, non-woven fabric, mat, paper, or a combination of these natural fibers, and a metal foil of copper, aluminum, iron, nickel, zinc, etc. A circuit is formed. As a thermosetting polyphenylene oxide resin film, ■・
Crosslinkable polymers such as 2-polybutadiene, 1-4-polybutadiene, styrene-butadiene copolymer, modified 1-2-polybutadiene (malein-modified, acrylic-modified, epoxy resin 1, etc.), triallylisocyanure-1, rubbers,
A thermosetting polyphenylene compound made of a polymerization initiator such as hendyl peroxide, 2.5 dimethyl 2.5 dihenzoyl peroxyhexane, kushari-butyl peroxybenzyl benzene-1, dicumyl peroxide, etc. Nylene oxide resin is made into a film with a thickness of 0.05 to 0.5 mm, and the required number of films can be used as needed. Inorganic fillers such as aluminum, talc, silica, alumina, calcium carbonate, and magnesium carbonate, and fibrous fillers such as glass fiber dip/asbestos, wood flour, pulp, and cotton powder may also be added. As the outer layer material, various single-sided metal-clad laminates such as one-sided copper-clad glass cloth-based epoxy resin laminate, one-sided copper-clad glass cloth-based polyimide resin laminate, and metal foils such as copper foil and aluminum foil are used. . If necessary, the outer layer material may be provided with an adhesive layer to improve adhesiveness. Any means for integrating the laminate may be used, such as a press, multi-stage press, multi-roll, double belt, or the like.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
厚さ０．８ ｍｍの両面銅張ガラス布基材エポキシ樹脂
積層板の両面に電気回路を形成して内層材とし、次に該
内層材の上下面に厚み０．２ ｎ＋＋ｎの熱硬化性ポリ
フェニレンオキサイド樹脂フィルム（ポリフェニレンオ
キサイド樹脂４０重量部に対し、スチレンブタジェンコ
ポリマ−４０重量部トリアリルイソシアヌレート１２０
重量部、２・５ジメチル２・５ジターシャリ−ブチルパ
ーオキシヘキシン３を６重量部からなる樹脂フィルム）
を夫々配し、更に最外層に厚さ０．０３５ ｍｍの接着
剤付銅箔の接着剤側を内側にして配設した積層体を、成
形圧力２０ｋｇ／ｃＪ、２２０°Ｃで６０分間プレスで
成形して４層配線基板を得た。Electric circuits were formed on both sides of a 0.8 mm thick double-sided copper-clad glass cloth base epoxy resin laminate to serve as an inner layer material, and then thermosetting polyphenylene with a thickness of 0.2 n++n was formed on the upper and lower surfaces of the inner layer material. Oxide resin film (40 parts by weight of styrene-butadiene copolymer to 40 parts by weight of polyphenylene oxide resin, 120 parts by weight of triallyl isocyanurate)
parts by weight, 6 parts by weight of 2.5 dimethyl 2.5 ditert-butyl peroxyhexine 3)
A laminate with adhesive-coated copper foil of 0.035 mm thick placed on the outermost layer with the adhesive side facing inside was pressed at a molding pressure of 20 kg/cJ at 220°C for 60 minutes. A four-layer wiring board was obtained by molding.
実施例のフィルムを、厚さ０．２ ｍｍのエポキシ樹脂
含浸ガラス基材プリプレグに変更し、更に成形圧力を５
０ｋｇ／ｃｍ、１８０°Ｃで６０分間プレスで成形した
以外は実施例と同様に処理して４層配線基板を得た。The film of the example was changed to an epoxy resin-impregnated glass base prepreg with a thickness of 0.2 mm, and the molding pressure was further increased to 5.
A four-layer wiring board was obtained in the same manner as in the example except that it was press-molded at 0 kg/cm and 180° C. for 60 minutes.
実施例のフィルムを、厚さ０．２ ｍｍのエポキシ樹脂
含浸ガラス基材プリプレグに変更し、更に成形圧力を５
０ ｋｇ／ｃＩｆｌ、 １８０°Ｃで６０分間プレスで
成形した以外は実施例と同様に処理して４層配線基板を
得た。The film of the example was changed to an epoxy resin-impregnated glass base prepreg with a thickness of 0.2 mm, and the molding pressure was further increased to 5.
A four-layer wiring board was obtained in the same manner as in the example except that it was press-molded at 0 kg/cIfl and 180°C for 60 minutes.
実施例及び比較例の４層配線基板の性能は第１表のよう
である。Table 1 shows the performance of the four-layer wiring boards of Examples and Comparative Examples.
第 １ 表
〔発明の効果〕
本発明は」二連した如く構成されている。特許請求の範
囲に記載した構成を有する多層配線基板においては内層
回路間の樹脂充填性がよく、高周波
特性が向上する効果がある。Table 1 [Effects of the Invention] The present invention is structured in a two-part manner. In the multilayer wiring board having the structure described in the claims, resin filling properties between inner layer circuits are good, and high frequency characteristics are improved.
Claims (1)
性ポリフエニレンオキサイド樹脂フイルムを配し、更に
最外層に外層材を配設した積層体を一体化してなること
を特徴とする多層配線基板。(1) It is characterized by being formed by integrating a laminate in which a thermosetting polyphenylene oxide resin film is arranged on the upper and/or lower surfaces of the required number of inner layer materials, and an outer layer material is further arranged as the outermost layer. Multilayer wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12783790A JPH0425094A (en) | 1990-05-16 | 1990-05-16 | Multilayer interconnection substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12783790A JPH0425094A (en) | 1990-05-16 | 1990-05-16 | Multilayer interconnection substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425094A true JPH0425094A (en) | 1992-01-28 |
Family
ID=14969892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12783790A Pending JPH0425094A (en) | 1990-05-16 | 1990-05-16 | Multilayer interconnection substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425094A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160033765A (en) | 2013-10-31 | 2016-03-28 | 미츠비시 히타치 파워 시스템즈 가부시키가이샤 | Multistage pressure reduction device and boiler |
| US10352339B2 (en) | 2013-12-27 | 2019-07-16 | Mitsubishi Hitachi Power Systems, Ltd. | Low-noise decompression device and combustion device |
-
1990
- 1990-05-16 JP JP12783790A patent/JPH0425094A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160033765A (en) | 2013-10-31 | 2016-03-28 | 미츠비시 히타치 파워 시스템즈 가부시키가이샤 | Multistage pressure reduction device and boiler |
| US10352339B2 (en) | 2013-12-27 | 2019-07-16 | Mitsubishi Hitachi Power Systems, Ltd. | Low-noise decompression device and combustion device |
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