JPH0425232U

JPH0425232U -

Info

Publication number: JPH0425232U
Application number: JP6547590U
Authority: JP
Priority date: 1990-06-22
Filing date: 1990-06-22
Publication date: 1992-02-28
Anticipated expiration: 2004-02-16
Also published as: JPH066506Y2

Description

[Brief explanation of drawings]

第１図は本考案の実施による平面自動研削盤の
プリポジシヨン装置の要部を現した概要説明図で
ある。Ａ……半導体ウエハ、１……プリポジシヨン、
２……基体、３……中心部材、４……給水孔、５
……環状ストツパー、６……給水制御部材、６ａ
……胴部、６ｂ……流量制御孔、７……通水小孔
、８……ウエハ載置台、９……貯水部、１０……
外周部材、１１……支持管。 FIG. 1 is a schematic explanatory diagram showing the main parts of a preposition device for a surface automatic grinding machine according to the present invention. A...Semiconductor wafer, 1...Preposition,
2...Base body, 3...Central member, 4...Water supply hole, 5
...Annular stopper, 6...Water supply control member, 6a
...Body part, 6b...Flow rate control hole, 7...Water passage small hole, 8...Wafer mounting table, 9...Water storage part, 10...
Outer peripheral member, 11... support tube.

Claims

[Scope of Claim for Utility Model Registration] A hollow support pipe for water supply and support is installed upright at the position of the pre-position device, and a cylindrical central member is provided protruding from the lower surface of the center side of the disc-shaped base body. A water supply hole is drilled through the central part of the center member and the base, and an annular stopper having an L-shaped longitudinal section is planted on the inner periphery of the water supply hole at a height slightly higher than the lower end, and the annular stopper A water supply control member having a short cylindrical body and a flow rate control hole therein is fitted upwardly with a gap slightly higher than the bottom surface of the base, and the flow rate control member is inserted into the gap. A plurality of small water passage holes are drilled in communication with the holes, and a disk-shaped wafer mounting table is provided at the top so as to bulge out from the outer periphery of the body, and the periphery of the base body is at least supplied with water. The pre-position is provided with an outer circumferential member having a water storage portion for positioning the semiconductor wafer on the wafer mounting table, and the base of the pre-position, the outer circumferential member, the flow control hole, and the plurality of small water passage holes are different in size. A plurality of sets of prepositions each having a diameter suitable for the semiconductor wafer to be processed are formed, and the water supply hole of each preposition has the same diameter as the outer periphery of the upper end side of the support tube. Pre-position device for automatic surface grinding machine.