JPH0425775A - Method and device for inspecting wiring board - Google Patents
Method and device for inspecting wiring boardInfo
- Publication number
- JPH0425775A JPH0425775A JP2130811A JP13081190A JPH0425775A JP H0425775 A JPH0425775 A JP H0425775A JP 2130811 A JP2130811 A JP 2130811A JP 13081190 A JP13081190 A JP 13081190A JP H0425775 A JPH0425775 A JP H0425775A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- conductor
- circuit
- metal plate
- inspected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 25
- 239000004020 conductor Substances 0.000 claims abstract description 40
- 239000000523 sample Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 230000007547 defect Effects 0.000 claims abstract description 18
- 238000007689 inspection Methods 0.000 claims abstract description 12
- 239000012212 insulator Substances 0.000 claims abstract description 6
- 238000012360 testing method Methods 0.000 claims description 9
- 238000005259 measurement Methods 0.000 abstract description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、配線板の回路欠陥を検出する方法およびその
方法に使用する装置に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for detecting circuit defects on a wiring board and an apparatus used in the method.
（従来の技術）
配線板は、金属箔を絶縁基材に貼り合わせた積層板の不
要な金ｒＩｋｔＩ３をエツチング除去し、必要な回路導
体を形成する方法や、絶縁基材の表面に必要な回路導体
を無電解めっき等によって形成する方法によって製造さ
れている。いずれにしても、必要な回路導体を形成する
際に、必要な回路導体の形状をネガフィルムやスクリー
ン印刷用版等の治具を用いるのであるが、このような治
具自体の欠陥、あるいは、積層板や絶縁基材の表面の欠
陥によって、必要とする回路導体に欠陥を生しることが
あるのは周知のとおりである。(Prior art) Wiring boards are manufactured by etching away unnecessary gold rIktI3 from a laminated board made by bonding metal foil to an insulating base material to form the necessary circuit conductors, and by etching the necessary circuit conductors on the surface of the insulating base material. It is manufactured by a method in which the conductor is formed by electroless plating or the like. In any case, when forming the necessary circuit conductor, a jig such as a negative film or a screen printing plate is used to shape the necessary circuit conductor, but defects in the jig itself or It is well known that defects on the surface of laminates or insulating substrates can cause defects in necessary circuit conductors.
このような回路欠陥を検査する方法としては、大きく分
けて、電気的に調べる方法と、物理的形状を調べる方法
とがあり、電気的に調べる方法としては、対象となる回
路導体の一方の端から他方の端へ一定の電流を流しその
間の電位差を測って必要とする抵抗値となっているか否
かを調べる方法や、対象となる回路導体の一点に電位を
与え、対向するように金属板を設置してその間の静電容
量を調べ必要な静電容量となっているか否かを調べる方
法があり、また、物理的形状を調べる方法としては、回
路形状をネガフィルムのような治具と比較する方法や、
回路導体の形状をＴＶカメラ等ムこよってデータ化し、
必要とする形状となっているか否かを調べる方法等が知
られている。Methods for inspecting such circuit defects can be roughly divided into two methods: electrical testing and physical shape testing. There is a method of flowing a constant current from one end to the other end and measuring the potential difference between them to check whether the required resistance value is achieved. There is a method of installing a circuit and checking the capacitance between them to see if it has the required capacitance.Also, there is a method of checking the physical shape of the circuit by measuring the circuit shape with a jig such as negative film. How to compare and
The shape of the circuit conductor is converted into data using a TV camera, etc.
There are known methods for checking whether the desired shape is achieved.
（発明が解決しようとする課題）
ところで、配線板は、電子機器の発達に伴って、高性能
化されつつあり、配線密度においても高度となってきて
いる。(Problems to be Solved by the Invention) By the way, with the development of electronic devices, the performance of wiring boards is becoming higher, and the wiring density is also becoming higher.
したがって、回路欠陥の検出にあたっても、高密度化さ
れた回路形状に対応するものが必要となってきているが
、従来の技術では、装置が大規模となったり、あるいは
、検査速度が低）するという問題が発生している。Therefore, when detecting circuit defects, there is a need for something that can handle highly dense circuit shapes, but conventional techniques require large-scale equipment or have low inspection speeds. This problem has occurred.
例えば、前記の対象となる回路導体の抵抗値を調べる方
法では、その両端に接触させるプローブが必要であり、
高密度となればプローブの直径の小さなものが必要とな
る。ところが、直径の小さなプローブではＩ！械強度が
小さく、検査するごとに取り替えるうようがあり、また
、直径の小さなプローブではプローブ自体の抵抗値が大
きくなるので、検査の誤差が大きくなるという問題があ
った。また、測定自体も敏感なものとなり、時間がかか
るという問題も発生した。For example, the method of checking the resistance value of the target circuit conductor described above requires probes that are brought into contact with both ends of the conductor.
Higher density requires smaller diameter probes. However, with a small diameter probe, I! The mechanical strength of the probe is low, and the probe must be replaced every time it is inspected.Furthermore, with a small diameter probe, the resistance value of the probe itself becomes large, resulting in a large error in inspection. In addition, the measurement itself was sensitive and time consuming.
静電容量を調べる方法では、静電容量が同じ価であって
も、欠陥が同時に複数存在する場合に、個々の欠陥につ
いて規格に納まっていることを確認する手段がなく、高
密度の配線を調べる場合に、重大な欠陥を検出できない
場合もあるという問題があった。With the method of checking capacitance, even if the capacitance is the same, if multiple defects exist at the same time, there is no way to confirm that each defect is within the standard, and it is difficult to conduct high-density wiring. There has been a problem in that serious defects may not be detected when inspected.
物理的形状を調べる方法においては、視覚による場合に
は、人の誤作業をなくすことができず、’ｌ” Ｖカメ
ラ等を用いる場合には、高密度の配線を検査するには、
商解像度で精密な装置が必要となり、装置が大きくなる
と共に、高価となるという問題があった。In the method of inspecting the physical shape, it is impossible to eliminate human errors when using visual inspection, and when using a 'l'' V camera etc., it is difficult to inspect high-density wiring.
This requires a precision device with a commercial resolution, which poses a problem in that the device becomes large and expensive.
本発明は、このような点を解決し、高密度の配線を効率
よく経済的に検査する方法と、その方法に使用する装置
を捷供するものである。The present invention solves these problems and provides a method for efficiently and economically inspecting high-density wiring, and an apparatus for use in the method.
（課題を解決するための手段）
本発明の検査方法は、その両面に複数の回８導体を有し
、かつその両面の回路導体を接続するための複数のスル
ーホールを有する配線板の回路欠陥を検査する方法にお
いて、被検査配線板を一定の厚さを有する絶縁体で覆わ
れた金属板の上に重ね、その金属板と向かい合った被検
査配線板上の回路パターンとの静電容量を調べ、予め欠
陥のないことを調べた基準となる配線板の同し箇所の静
電容量と比較することによって被検査配線板の金頭板に
面する側の回路欠陥を検出するとともに、被検査配線板
のもう一方の而の回路導体の導体抵抗を調べることによ
って被検査配線板の金属板に而していない側の回路欠陥
を検出することを特徴とする。(Means for Solving the Problem) The inspection method of the present invention detects circuit defects in a wiring board having a plurality of circuit conductors on both sides and a plurality of through holes for connecting the circuit conductors on both sides. In this method, the wiring board to be tested is placed on a metal plate covered with an insulator having a certain thickness, and the capacitance between the metal plate and the circuit pattern on the wiring board to be tested facing the metal plate is measured. By comparing the capacitance with the capacitance at the same point on the reference wiring board that has been previously checked to be defect-free, circuit defects on the side of the wiring board to be inspected facing the metal head plate are detected, and It is characterized by detecting circuit defects on the side of the wiring board to be inspected that is not connected to the metal plate by checking the conductor resistance of the other circuit conductor of the wiring board.
この場合に、この検査方法に引き続き、被検査配線板の
金属板に面する側と面しない側を交換して行えば、同し
回路を、静電容量値と抵抗値の二つの方法で調べること
ができ、検査の信顛性を高めることができる。In this case, if you continue with this testing method and replace the side facing the metal plate of the wiring board to be tested with the side that does not face the metal plate, the same circuit can be examined using two methods: capacitance value and resistance value. It is possible to increase the reliability of the test.
また、前記回路導体の導体抵抗を調べることにおいて、
前記被検査配線板上の一定の範囲の回路導体全てに一つ
の導体を接触させ、その導体とその接触している回路導
体の他方の端との導体抵抗を調べれば、ＩＣ等の一定の
端子配列を有する電子部品が搭載される箇所については
、プローブを大きくでき、他方のプローブを移動するか
、他方に複数のプローブを用意するだけでよく、能率よ
く検査することが可能である。Further, in examining the conductor resistance of the circuit conductor,
If one conductor is brought into contact with all of the circuit conductors in a certain range on the wiring board to be inspected and the conductor resistance between that conductor and the other end of the circuit conductor that is in contact with it is examined, it is possible to detect a certain terminal such as an IC. For locations where electronic components having an array are mounted, the probes can be made larger, and it is only necessary to move the other probe or prepare a plurality of probes for the other, allowing for efficient inspection.
本発明の検査方法に使用する装置は、第１Ｖに示すよう
に、金属板３と、一定の厚さを有する絶縁体２と、プロ
ーブ５と、プローブ１０と、金属板：３とプローブ５に
接続された静電容量検出器４と、前記プローブ５とプロ
ーブ】０に接続された抵抗検出器１１とを有することを
特徴とする。As shown in 1V, the apparatus used in the inspection method of the present invention includes a metal plate 3, an insulator 2 having a certain thickness, a probe 5, a probe 10, a metal plate 3 and a probe 5. It is characterized in that it has a capacitance detector 4 connected to it, and a resistance detector 11 connected to the probe 5 and the probe 0.
この場合に、第２図に示すように、抵抗値と静電容量を
同時に検査しないで、切換手段２１によってそれぞれ独
立に行えば、他方の検査への影響を減少することができ
、検査の信転性を高めることもできる。また、第３図に
示すように、前述のＩｃ等の一定の端子配列を有する回
路導体がある場合には、プローブ１０の形状としてその
端子全数に接触できるようなものを選択すれば、能率よ
く検査できる装置とすることもできる。In this case, as shown in FIG. 2, if the resistance value and capacitance are not tested at the same time, but each is performed independently using the switching means 21, the influence on the other test can be reduced, and the reliability of the test can be reduced. It can also increase conversion. Furthermore, as shown in FIG. 3, if there is a circuit conductor with a fixed terminal arrangement, such as the above-mentioned Ic, it is possible to efficiently It can also be a device that can be inspected.
また、本発明の装置は、第４図に示すように、予め欠陥
のない配線板の静電容量値および／または抵抗値を検出
し、その値を記憶する手段１２と、被検査配線板の静電
容量値および／または抵抗値とその記憶手段１２内の値
を比較する手段１３と、比較した結果を表示する手段１
４とを有することを特徴とする。Further, as shown in FIG. 4, the apparatus of the present invention includes a means 12 for detecting in advance the capacitance value and/or resistance value of a defect-free wiring board and storing the value; means 13 for comparing the capacitance value and/or resistance value with the value stored in the storage means 12; and means 1 for displaying the comparison results;
4.
また、予め欠陥のない配線板の静電容量値ぢよひ／また
は抵抗値を検出し、その値を記憶する手段１２に代えて
、予め計算によって算出した値を入力する手段１５を備
えれば、設計から最終検査までを、計算機を用いた工程
の管理ができ、配線板の製造において、経済的で、管理
能力に傍れた方法を採用することが可能である。Further, instead of the means 12 for detecting the capacitance value or resistance value of a defect-free wiring board in advance and storing the value, a means 15 for inputting a value calculated in advance may be provided. , it is possible to manage the process from design to final inspection using a computer, and it is possible to use an economical and management-friendly method in manufacturing wiring boards.
（作用）
配線板の一方の面の回路を静電容を値の測定によって検
査し、同時に他方の面の回路を抵抗値の測定によって検
査を行うので、検査速度が高く、また、精度が必要な場
合には、表裏を交換して行えばよく、また、各値を数値
データとして取り扱うこともできるので、コンピュータ
等の演算機能を有する装置を使用することができ、処理
速度、処理データの大規模化ができ、高密度の配線板に
おいても能率よく検査することができる。(Function) The circuit on one side of the wiring board is inspected by measuring the capacitance value, and the circuit on the other side is simultaneously inspected by measuring the resistance value. In some cases, it is sufficient to exchange the front and back sides, and since each value can be treated as numerical data, it is possible to use a device with arithmetic functions such as a computer, which increases the processing speed and the large scale of processing data. It is possible to efficiently inspect even high-density wiring boards.
実施例
第２図に示すように、表面実装用のＩＣの端子に全て接
触できるプローブ１０と、スルーホールに接触できる１
０−ブ５を用意し、２ｍｍのアルミニウム板に厚さ２５
μｍのポリイミドフィルムを貼り合わせた治具を用いた
。プローブ１０とプローブ５は、上下して接触させる位
置へ移動するアームとそのアームの駆動機構に搭載し、
そのアームの駆動機構を支持台に搭載し、その支持台は
、σり定位置へ移動するレールの上に動輪を介して置か
れ、その支持台を駆動するために支持台にモタを搭載し
、移動した位置を検出するホトエンコーダを搭載した。Embodiment As shown in FIG. 2, there is a probe 10 that can contact all the terminals of a surface-mounted IC, and a probe 1 that can contact the through holes.
Prepare 0-bu 5 and put it on a 2mm aluminum plate with a thickness of 25mm.
A jig with a μm polyimide film attached was used. The probe 10 and the probe 5 are mounted on an arm that moves up and down to a position where they make contact, and a drive mechanism for the arm.
The drive mechanism for the arm is mounted on a support stand, and the support stand is placed on a rail that moves to a fixed position via a driving wheel, and a motor is mounted on the support stand to drive the support stand. Equipped with a photo encoder to detect the moved position.
これら、位置検出エンコーダ、駆動モータ、駆動機構は
、それぞれ、マイクロコンピュータによって数値制御し
、また、そのマイクロコンピュータ内に、Ａ／Ｄコンバ
ータを設けて、静電容量値および／または抵抗価を数値
に変換して、予め検査された欠陥のない配線板のデータ
を読み込むことと、キーボードから設計値を入力するこ
との両方ができる構造とした。These position detection encoders, drive motors, and drive mechanisms are each numerically controlled by a microcomputer, and an A/D converter is provided within the microcomputer to convert the capacitance value and/or resistance value into numerical values. The structure allows both the conversion and reading of pre-inspected defect-free wiring board data and the input of design values from the keyboard.
第１図は本発明の一実施例を示す概略図、第２図〜第５
図は本発明の他の実施例を示す概略図である。
符号の説明
１、被検査配ＡＩｌ析 ２．絶縁体
：３．金属板 ４、静電容量計５、プローブ
６．スルーホール１０、プローブ １１．抵
抗計
１２、記憶する手段 １３．比較する手段１４、表示す
る手段 ＋５．入力する手段第
図
第
図
第
図
第
図Figure 1 is a schematic diagram showing one embodiment of the present invention, Figures 2 to 5
The figure is a schematic diagram showing another embodiment of the invention. Explanation of symbols 1. Analysis of test target AIl 2. Insulator: 3. Metal plate 4, capacitance meter 5, probe
6. Through hole 10, probe 11. Resistance meter 12, storage means 13. Means for comparing 14, means for displaying +5. Means for inputting
Claims (6)
回路導体を接続するための複数のスルーホールを有する
配線板の回路欠陥を検査する方法において、被検査配線
板を一定の厚さを有する絶縁体で覆われた金属板の上に
重ね、その金属板と向かい合った被検査配線板上の回路
パターンとの静電容量を調べ、予め欠陥のないことを調
べた基準となる配線板の同じ箇所の静電容量と比較する
ことによって被検査配線板の金属板に面する側の回路欠
陥を検出するとともに、被検査配線板のもう一方の面の
回路導体の導体抵抗を調べることによって被検査配線板
の金属板に面していない側の回路欠陥を検出することを
特徴とする配線板の検査方法。1. In a method for inspecting circuit defects in a wiring board having a plurality of circuit conductors on both sides and a plurality of through holes for connecting the circuit conductors on both sides, the wiring board to be inspected has a certain thickness. Lay it on a metal plate covered with an insulator, and check the capacitance between the metal plate and the circuit pattern on the wiring board to be inspected facing it, and check that there are no defects in advance. By comparing the capacitance at the spot, circuit defects are detected on the side of the wiring board to be inspected facing the metal plate, and by checking the conductor resistance of the circuit conductors on the other side of the wiring board to be inspected. A wiring board inspection method characterized by detecting circuit defects on the side of the wiring board that does not face the metal plate.
検査配線板の金属板に面する側と面しない側を交換して
行うことを特徴とする配線板の検査方法。2. 2. A method for inspecting a wiring board, which is performed subsequent to the method for inspecting a wiring board according to claim 1, by exchanging the side of the wiring board to be inspected that faces the metal plate and the side that does not face the metal plate.
記被検査配線板上の一定の範囲の回路導体全てに一つの
導体を接触させ、その導体とその接触している回路導体
の他方の端との導体抵抗を調べることを特徴とする請求
項１または２のうちいずれかに記載の配線板の検査方法
。3. In checking the conductor resistance of the circuit conductor, one conductor is brought into contact with all the circuit conductors in a certain range on the wiring board to be inspected, and the conductor between that conductor and the other end of the circuit conductor that is in contact with the circuit conductor is 3. The wiring board testing method according to claim 1, further comprising testing resistance.
と、プローブ（５）と、プローブ（１０）と、金属板（
３）とプローブ（５）に接続された静電容量検出器（４
）と、前記プローブ（５）とプローブ（１０）に接続さ
れた抵抗検出器（１１）とを有することを特徴とする配
線板の検査方法。4. A metal plate (3) and an insulator (2) with a certain thickness
, probe (5), probe (10), and metal plate (
3) and a capacitance detector (4) connected to the probe (5).
) and a resistance detector (11) connected to the probe (5) and the probe (10).
抵抗値を検出し、その値を記憶する手段（１２）と、被
検査配線板の静電容量値および／または抵抗値とその記
憶手段（１２）内の値を比較する手段（１３）と、比較
した結果を表示する手段（１４）とを有することを特徴
とする請求項５に記載の配線板の検査装置。5. means (12) for detecting the capacitance value and/or resistance value of a defect-free wiring board in advance and storing the value; 6. The wiring board inspection apparatus according to claim 5, further comprising means (13) for comparing the values in 12) and means (14) for displaying the comparison results.
抵抗値を検出し、その値を記憶する手段（１２）に代え
て、予め計算によって算出した値を入力する手段（１５
）を備えたことを特徴とする請求項５に記載の配線板の
検査装置。6. Instead of the means (12) for detecting the capacitance value and/or resistance value of a defect-free wiring board in advance and storing the value, a means (15) for inputting a value calculated in advance is provided.
) The wiring board inspection device according to claim 5, further comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2130811A JPH0425775A (en) | 1990-05-21 | 1990-05-21 | Method and device for inspecting wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2130811A JPH0425775A (en) | 1990-05-21 | 1990-05-21 | Method and device for inspecting wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0425775A true JPH0425775A (en) | 1992-01-29 |
Family
ID=15043264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2130811A Pending JPH0425775A (en) | 1990-05-21 | 1990-05-21 | Method and device for inspecting wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0425775A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5256975A (en) * | 1992-06-01 | 1993-10-26 | Digital Equipment Corporation | Manually-operated continuity/shorts test probe for bare interconnection packages |
| JPH06260799A (en) * | 1993-03-08 | 1994-09-16 | Daifuku Co Ltd | Circuit board inspecting method, and circuit board |
| US6201398B1 (en) | 1996-03-28 | 2001-03-13 | Oht Inc. | Non-contact board inspection probe |
| JP2001221824A (en) * | 2000-02-10 | 2001-08-17 | Oht Inc | Inspection instrument, method and unit |
| WO2001096890A1 (en) * | 2000-06-16 | 2001-12-20 | Oht Inc. | Device and method for inspection |
| JP2010204021A (en) * | 2009-03-05 | 2010-09-16 | Hioki Ee Corp | Apparatus and method for inspecting circuit board |
| CN104919324A (en) * | 2013-01-08 | 2015-09-16 | 三菱电机株式会社 | Device and method for confirming connection state of antenna and cable |
-
1990
- 1990-05-21 JP JP2130811A patent/JPH0425775A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5256975A (en) * | 1992-06-01 | 1993-10-26 | Digital Equipment Corporation | Manually-operated continuity/shorts test probe for bare interconnection packages |
| JPH06260799A (en) * | 1993-03-08 | 1994-09-16 | Daifuku Co Ltd | Circuit board inspecting method, and circuit board |
| US6201398B1 (en) | 1996-03-28 | 2001-03-13 | Oht Inc. | Non-contact board inspection probe |
| US6373258B2 (en) | 1996-03-28 | 2002-04-16 | Naoya Takada | Non-contact board inspection probe |
| JP2001221824A (en) * | 2000-02-10 | 2001-08-17 | Oht Inc | Inspection instrument, method and unit |
| WO2001096890A1 (en) * | 2000-06-16 | 2001-12-20 | Oht Inc. | Device and method for inspection |
| JP2010204021A (en) * | 2009-03-05 | 2010-09-16 | Hioki Ee Corp | Apparatus and method for inspecting circuit board |
| CN104919324A (en) * | 2013-01-08 | 2015-09-16 | 三菱电机株式会社 | Device and method for confirming connection state of antenna and cable |
| CN104919324B (en) * | 2013-01-08 | 2017-11-07 | 三菱电机株式会社 | Device and method for confirming connection state of antenna and cable |
| US9863995B2 (en) | 2013-01-08 | 2018-01-09 | Mitsubishi Electric Corporation | Antenna-and-cable connection-state verification device and verification method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5567884A (en) | Circuit board assembly torsion tester and method | |
| JP3285215B2 (en) | Conductor device inspection method and device | |
| US5789682A (en) | Circuit board assembly torsion tester and method | |
| JP2002156399A (en) | Device and method for inspecting circuit board | |
| JPH0425775A (en) | Method and device for inspecting wiring board | |
| KR101549454B1 (en) | Method and machine for multidimensional testing of an electronic device on the basis of a monodirectional probe | |
| JP4247076B2 (en) | Substrate inspection system and substrate inspection method | |
| JP2005315775A (en) | Four-terminal inspection method and single-terminal inspection jig using a single-sided moving probe | |
| US4328264A (en) | Method for making apparatus for testing traces on a printed circuit board substrate | |
| JP3784479B2 (en) | Circuit board inspection method | |
| JPH03210481A (en) | Movable probe type multipoint contact apparatus for inspecting printed circuit board | |
| JP2767291B2 (en) | Inspection device | |
| JPH10142271A (en) | Circuit board pattern capacitance measurement method | |
| JP4264305B2 (en) | Substrate inspection apparatus and substrate inspection method | |
| JPS61259597A (en) | Wiring of printed circuit board | |
| JP2002043721A (en) | Inspection method and inspection equipment for printed circuit boards | |
| JP4369002B2 (en) | Circuit board inspection equipment | |
| JP2004361249A (en) | Substrate inspection device | |
| KR100688870B1 (en) | Surface defect inspection apparatus for printed circuit boards and surface defect inspection method for printed circuit boards using the same | |
| JP3230857B2 (en) | Inspection method of printed wiring circuit | |
| JPH0821867A (en) | Printed wiring board insert kit test method | |
| JPS62282277A (en) | Continuity testing device | |
| CN218445594U (en) | Copper-clad plate resistivity detection clamp and copper-clad plate resistivity detection device | |
| JP7199675B1 (en) | Probe card inspection device | |
| JP4982543B2 (en) | Detection method for through-hole breakage in multilayer boards |