JPH04258010A - Electronic component - Google Patents

Abstract

PURPOSE:To prevent deformation of a lead terminal of the electronic component and a damage due to the deformation or the like. CONSTITUTION:A cut and recessed part 7 is provided to a stem 1, from which a lead terminal 4 connected electrically to an element arranged on one major face and penetrated through with insulation and led out to the other major face is not projected, and furthermore, the cut and recessed part 7 is formed to be a slot prolonged toward the outer circumferential face as required, and the lead terminal 4 to be led out is fitted to a prolonged slot and bent and its tip is set to be placed in the inside of the outer circumferential face. Or the lead terminal 7 connecting electrically to the element arranged to one major side electrically, penetrated through the stem 1 with insulation and led out to the other major side is provided, the lead terminal 4 led out to the other major side of the stem 1 is bent along the other major side, and the projection of almost the same height as the height of the lead terminal arranged in bent form is provided.

Description

[Detailed description of the invention]

[Object of the invention]

0002

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic components, and more particularly to the structure of a lead terminal lead-out portion of a sealed electronic component.

0003

2. Description of the Related Art For example, surface acoustic wave devices are generally constructed or manufactured in the following manner. That is, L
A surface acoustic wave element with a pair of comb-shaped electrodes formed on a piezoelectric substrate made of iTaO3, LiNbO3, etc.
A base is placed on one main surface of a stem, which is often made of iron, via an adhesive member, and a bonding wire is used to connect the lead terminals that are insulatively buried (inserted through) this stem and the electrodes of the surface acoustic wave device. Connect electrically via. Thereafter, the shell, which is often made of iron, is positioned and crimped with a crimping jig to seal the surface acoustic wave element.

[0004] Usually, the lead terminal of the surface acoustic wave device is buried (penetrated) almost perpendicularly to the bottom surface (other main surface or back surface) of the stem. Therefore, when installing this surface acoustic wave device on a printed circuit board, etc., a hole is provided in the printed circuit board for inserting the lead terminal, and the lead terminal is inserted into this hole and the lead terminal and printed circuit board are connected. The surface acoustic wave device is mounted on a printed circuit board by soldering.

However, when mounting (attaching) chip components on a printed circuit board in a so-called surface mounting manner, it is necessary to separately provide a hole in the printed circuit board for this surface acoustic wave device. Therefore, the work becomes extremely complicated.

[0006] Japanese Patent Laid-Open No. 140442/1982 (Japanese Patent Application No. 281022/1982) proposes means aimed at improving this point. That is, FIG.
As shown in side view, an electronic component such as a surface acoustic wave device is mounted on a base, such as a stem 1 made of iron, and placed and fixed on one main surface of this stem 1 via an adhesive member (not shown). The surface acoustic wave device 2 is made up of a metal surface acoustic wave device 2, and a shell (lid body) 3 made of iron for hermetically sealing the surface acoustic wave device 2 by filling nitrogen gas therein. A lead terminal 4 for connection to an external circuit (not shown) is buried in the stem 1 and insulated with a sealing glass member 5, and is led out (through) to the other main surface (back surface) of the stem 1. inserted). Further, a groove 6 is formed on the other main surface of the stem 1, and the distal end side of the lead terminal 4 is bent and fitted along this groove 6, and extends almost parallel to the other main surface of the stem 1. ing. The electronic component having the configuration shown in FIG. 9 can be mounted on the printed circuit board without providing a hole for inserting a lead terminal, so there is no need to separately provide a hole on the printed circuit board. It is possible to eliminate operational complexity.

[0007]

However, the structure shown in FIG. 9 has the following problems. That is, since the tip of the lead terminal 4 is configured to protrude from the outer periphery of the stem 1, if an external force is applied to the lead terminal 4 during, for example, transportation, the tip of the lead terminal 4 may be damaged as shown in the side view in FIG. As a result, the lead terminal 4 may be deformed and come into contact with the end C of the other main surface (back surface) of the stem 1, causing damage. In order to avoid this, Japanese Patent Application Laid-Open No. 62-140442
The publication (Japanese Patent Application No. 60-281022) proposes a method of sealing and filling the groove 6 portion of the other main surface of the stem 1 with resin as an insulating agent. The problem is that it increases the number of steps.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an electronic component in which deformation of the lead terminal 5 of the electronic component and damage caused by this deformation are prevented. [Structure of the invention]

[0009]

[Means for Solving the Problems] In order to achieve the above object, in the electronic component according to the present invention, an element disposed on one main surface is electrically connected, and a base is insulatively inserted through the other. The main surface is characterized by having a cut portion that prevents the lead terminal from protruding from the other main surface, and if necessary, the cut portion is a groove extending toward the outer circumferential surface, and the lead terminal is It is set so that it fits into the extended groove and is bent so that its tip is located inside the outer peripheral surface.

Alternatively, the lead terminal may be electrically connected to an element disposed on one main surface, inserted through the base in an insulating manner, and led out to the other main surface. The lead terminal is bent along the other main surface, and a protrusion is provided on the surface to have approximately the same height as the bent lead terminal.

[0011]

[Operation] According to the above configuration, the lead terminal is connected to the back side of the stem (
Because the lead terminal is completely housed in the cut part, such as inside the hole on the other main surface, even if external force is applied to the electronic component during transportation, etc., no force is applied to the lead terminal itself, causing deformation of the lead terminal. can be easily and reliably prevented. Moreover, in order to avoid deformation of the lead terminal, an extra step such as pouring an insulating resin into the groove on the back surface of the stem becomes unnecessary in the manufacturing process of this electronic component.

0012

[Embodiments] Examples of electronic components according to the present invention will be described below.

First, a first embodiment will be explained with reference to FIGS. 1, 2, and 3. FIG. 1 shows a side view of the configuration of a surface acoustic wave device as an electronic component according to the present invention. ,
A base, for example, a stem 1 made of iron, a surface acoustic wave element 2 mounted and fixed on one main surface of the stem 1 via an adhesive member (not shown), and a surface acoustic wave element 2 filled with nitrogen gas to The basic component is a shell (lid) 3 made of iron for hermetically sealing the surface wave element 2. A lead terminal 4 for connection to an external circuit (not shown) is embedded (inserted) in the stem 1 using a sealing glass member 5 as an insulating layer and led out to the other main surface side. Also,
A hole 7 is formed around the lead terminal 4 on the back surface (other main surface) of the stem 1, and the tip of the lead terminal 4 is located inside this hole 7, and the bottom surface of the stem 1 Or it is cut inside from the back surface (other main surface). That is, the lead terminal 4 inserted through the stem 1 and led out to the other main surface side is completely housed inside the hole 7 on the back surface (other main surface) of the stem 1.

FIG. 2 shows a modification of the configuration shown in FIG. (not shown) and a shell (lid) 3 made of iron for hermetically sealing the surface acoustic wave element 2 by filling it with nitrogen gas. It is constructed as a basic component. And in the stem,
Lead terminal 4 for connecting to an external circuit (not shown)
is embedded (inserted through) the sealing glass member 5 as an insulating layer and led out to the other main surface side. In addition, a groove 6 is formed on the back surface (other main surface) of the stem 1 and includes the periphery of the lead terminal 4. The tip of the lead terminal 4 is located inside this groove 7, and the stem 1 It is cut on the inside of the other main surface. That is, the lead terminal inserted through the stem 1 and led out to the other main surface side is completely housed inside the hole 6 on the back surface (other main surface) of the stem 1.

FIG. 3 is a cross-sectional view of an example in which the surface acoustic wave device shown in FIG. 1 is mounted on a printed circuit board. While positioning the tips of the 10 lead terminals 4, the stem 1 is positioned on the other printed wiring 9b on the printed circuit board 8. After that, the lead terminal 4, the printed wiring 9a, and the back surface (other main surface or bottom surface) of the stem 1.
and the printed wiring 9b are respectively connected and mounted using solder 11 by a method such as reflow. This surface acoustic wave device can be easily mounted on the printed circuit board 8 without the need to make holes in the printed circuit board 8, as in the case of the conventional electronic component shown in FIG.

Next, a second embodiment of the electronic component according to the present invention will be described with reference to FIG.

FIG. 4 is a side view showing the configuration of a surface acoustic wave device as an electronic component according to the present invention, which includes a base, for example, a stem 1 made of iron, and an adhesive member ( (not shown) and a shell (lid) 3 made of iron for hermetically sealing the surface acoustic wave element 2 by filling it with nitrogen gas. It is constructed as a basic component. A lead terminal 4 for connection to an external circuit (not shown) is embedded (inserted) in the stem 1 using a sealing glass member 5 as an insulating layer and led out to the other main surface side. In addition, the stem 1
A groove 6 is formed on the back surface (other main surface) of the stem 1, and the lead terminal 4 extending in the outer circumferential direction is fitted into the groove 6. It is located on the inside. That is, the lead terminal 4 inserted through the stem 1 and led out to the other main surface side is completely housed inside the groove 6 on the back surface (the other main surface) of the stem 1.

Further, a third embodiment of the electronic component according to the present invention will be described with reference to FIGS. 5 and 6.

FIG. 5 shows a side view of another configuration of a surface acoustic wave device as an electronic component according to the present invention, and FIG. 6 shows a bottom view. A surface acoustic wave element 2 placed and fixed on one main surface of the surface acoustic wave element 1 via an adhesive member (not shown), and an iron for hermetically sealing the surface acoustic wave element 2 by filling nitrogen gas therein. It is constructed using a shell (lid body) 3 consisting of as a basic component. The stem 1 has a first stem in which a lead terminal 4 for connection to an external circuit (not shown) is embedded (inserted) through a sealing glass member 5 as an insulating layer and led out to the other main surface side. 1a and a second stem 1b having a notch 12 and a joining notch 13 into which the lead terminal 4 which is led out and bent is fitted. That is, the second stem 1b is arranged in a layered manner on the other main surface of the first stem 1a, and the joining notch 13 of the second stem 1b is filled with, for example, joining solder 14, so that the joining is performed integrally. It is structured as follows. Note that as the bonding solder 14, for example, paste solder can be used, but a solder having a higher melting point than the solder used when mounting this surface acoustic wave device on a printed wiring board is selected. Further, on the back surface (other main surface) of the first stem 1a constituting the stem 1, the lead terminal 4 is bent into a notch 12 extending in the outer circumferential direction by cutting out the second stem 1b. The tips of the lead terminals 4 are positioned within the notch 12 and inside the outer peripheral surface of the stem 1. That is, the lead terminal 4 inserted through the stem 1 and led out to the other main surface side is completely housed inside the groove-shaped notch 12 on the back surface (the other main surface) of the stem 1.

Further, a fourth embodiment of the electronic component according to the present invention will be described with reference to FIGS. 7 and 8.

FIG. 7 shows a side view of still another configuration of a surface acoustic wave device as an electronic component according to the present invention, and FIG. 8 shows a bottom view. A surface acoustic wave element 2 is placed and fixed on one main surface of the stem 1 via an adhesive member (not shown), and a surface acoustic wave element 2 is filled with nitrogen gas to hermetically seal the surface acoustic wave element 2. The main structural member is a shell (lid) 3 made of iron. A lead terminal 4 for connection to an external circuit (not shown) is embedded (inserted) in the stem 1 using a sealing glass member 5 as an insulating layer and led out to the other main surface side. Further, when the lead terminal 4 is bent and placed on the back surface (other main surface) of the stem 1, the height of the bent lead terminal 4 is Protrusion 1 that is almost the same height as the
5 is appropriately formed, and the tip of the lead terminal 4 forms a shape with this protrusion 14 as if it were disposed in a groove or recess. That is, the lead terminal 4 inserted through the stem 1 and led out to the other main surface side is completely housed inside the protruding end surface on the back surface (other main surface) side of the stem 1.

In the case of this structure, since the structure or shape of the stem 1 is relatively simple, there are also advantages in terms of, for example, accuracy in press working and the life of the press die.

[0023] In each of the surface acoustic wave devices shown as the second to fourth embodiments, holes are made in the printed circuit board, as in the case of each surface acoustic wave device shown in the first embodiment. There is no need for this, and both can be easily mounted on a printed circuit board. Furthermore, although a surface acoustic wave device is exemplified as the electronic component above, it may also be a surface-mounted electronic component having a structure in which the lead terminal penetrates the stem 1 and is led out to the other main surface side. .

[0024]

[Effects of the Invention] Since the electronic component according to the present invention adopts the above-described structure, even if force is applied from the outside during transportation of the electronic component, the lead terminals will not come into direct contact with the lead terminals. Deformation of the terminal can be prevented. Furthermore, during the manufacturing process of electronic components, there is no need to pour insulating resin into the groove provided on the bottom surface of the stem in order to prevent the lead terminal from coming into contact with the bottom surface (other main surface) of the stem. In other words, deformation of the lead terminals and damage caused by this deformation can be easily avoided, which not only eliminates the need for shaping the lead terminals during mounting, but also greatly contributes to highly reliable electronic components.

[Brief explanation of the drawing]

FIG. 1 is a side view schematically showing a configuration example of an electronic component according to the present invention.

FIG. 2 is a side view schematically showing another configuration example of an electronic component according to the present invention.

FIG. 3 is a cross-sectional view schematically showing a state in which an electronic component according to the present invention is mounted on a printed wiring board surface.

FIG. 4 is a side view schematically showing still another configuration example of the electronic component according to the present invention.

FIG. 5 is a side view schematically showing another configuration example of the electronic component according to the present invention.

FIG. 6 is a bottom view of the electronic component shown in FIG. 5.

FIG. 7 is a side view schematically showing still another configuration example of the electronic component according to the present invention.

FIG. 8 is a bottom view of the electronic component shown in FIG. 7.

FIG. 9 is a side view schematically showing the configuration of a conventional electronic component.

FIG. 10 is a side view conceptually showing a case where a lead terminal of a conventional electronic component is deformed.

[Explanation of symbols]

Claims (4)

[Claims] Claim 1: A device comprising a base on which an element is disposed on one main surface, and a lead terminal electrically connected to the element, inserted through the base in an insulating manner, and led out to the other main surface. , a cutting part is provided on the other main surface of the base to prevent the lead terminal from protruding from the other main surface, and the lead terminal is cut inside the other main surface of the base. Featured electronic components. [Claim 2] - Comprising a base on which an element is arranged on the main surface, and a lead terminal electrically connected to the element, inserted through the base in an insulating manner, and led out to the other main surface. , the other main surface of the base is provided with a cut-out portion that prevents the lead terminal from protruding from the other main surface, and the cut portion that prevents the lead terminal from protruding from the other main surface is a groove extending to the outer peripheral surface side. An electronic component in which the lead terminal is bent by fitting into an extended groove, and the tip of the lead terminal is located inside the outer peripheral surface. 3. In claim 2, the first base includes a first base through which the lead terminal is insulatively inserted and led out to the other main surface side, and a second base having a cut portion that prevents the lead terminal from protruding. It is a joined body with the base, and the lead terminal is bent by fitting into the cutting part of the second base, and the lead terminal is bent by fitting into the cut part of the second base.
An electronic component, characterized in that the electronic component is joined to the first base by a sealing member embedded in a notch provided substantially in the center of the base. 4. The device comprises a base on which an element is arranged on one main surface, and a lead terminal electrically connected to the element, inserted through the base in an insulating manner, and led out to the other main surface. , characterized in that the other main surface of the base is provided with a protrusion that allows the lead terminal to be bent along the other main surface and has a height that is approximately the same as the height of the lead terminal that is bent and arranged. electronic components.