JPH04258200A - Electronic part mounting equipment - Google Patents

Abstract

PURPOSE:To stick a suitable amount of flux on a transfer bottle by a method wherein a bottle containing flux is inclined to make the position for taking out the flux by means of the transfer pin higher than the smooth position made by a squeegee so that the liquid surface of the flux is stabilized at the position of taking-out. CONSTITUTION:A container is arranged with inclination so that the position (a) of taking out of the transfer pin 12 on a transfer head 3 is set higher. The container rotates in the direction of the arrow N, the liquid surface of the flux 23 is smoothed by a stage 26. Where the position (a) for taking-out is higher than the smooth position (b). Thus, the liquid surface of the flux 23 is changed so that the amount of transfer by means of the transfer pin 12 will not be scattered.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus, and more particularly to the structure of a flux supply apparatus for supplying flux to transfer pins.

0002

[Prior Art] An electronic component mounting apparatus includes a sub-transfer head that transfers electronic components from an electronic component supply section to a correction stage, and a positioning section that positions the electronic components whose positional deviations have been corrected and observed on the correction stage. It is equipped with a transfer head that transfers and mounts the electronic components onto the substrate, and a transfer head that transfers the flux provided in the flux supply device to the substrate.While these three heads are moved back and forth in the lateral direction, it is possible to correct the misalignment of electronic components. Correction, mounting electronic components on the board,
Also known are devices in which flux is applied to solder formed on a substrate.

This type of flux supply device is equipped with a container in which flux is stored in an annular liquid reservoir, and while this container is horizontally rotated by a motor, the surface of the flux is smoothed with a squeegee, and the smoothed liquid is removed. The lower end of the transfer pin of the transfer head is immersed in the surface, flux is attached to the lower end, and the attached flux is transferred onto the circuit pattern of the substrate positioned in the positioning section.

0004

[Problems to be Solved by the Invention] The flux stored in the annular storage portion has low viscosity and high fluidity. For this reason, when rotating the container horizontally and smoothing the liquid surface with a squeegee, the flux flows back from the smoothing position to the sampling position of the transfer pin, causing the liquid level at the sampling position to fluctuate, and as a result, the transfer There was a problem that the amount of flux that adhered to the pins tended to vary.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus that solves the above-mentioned problems.

[0006]

[Means for Solving the Problems] The present invention is an electronic component mounting apparatus of this type, in which a container for storing flux is tilted so that the position at which the flux is collected by the transfer pin is higher than the position at which the flux is smoothed by the squeegee. be.

[0007]

[Function] According to the above configuration, the liquid level at the flux sampling position is higher than the liquid level at the smooth position, so the flux does not flow backward from the smooth position to the sampling position, and the flux at the sampling position is higher than the liquid level at the smooth position. Since the surface is stable, an appropriate amount of flux can be stably attached to the transfer pin.

[0008]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus, which is equipped with three heads: a sub-transfer head 1, a transfer head 2, and a transfer head 3. Each head 1-3
is a multi-head equipped with multiple nozzles and transfer pins, and uses the nozzles and transfer pins selectively depending on the size of the electronic component. 4, 5, 6, 7 are each head 1-
The electronic component supply unit, correction stage, and
These are the positioning part and the flux supply part. The supply unit 4 consists of a turntable 8 and a support plate 9 attached to the turntable 8, and the support plate 9 is equipped with a wafer 10. A die ejector 11 pushes up electronic components on the wafer 10 with pins.

The correction stage 5 is a stage that mechanically corrects the positional deviation in the XYθ directions of the electronic component transferred from the wafer 10 by the sub-transfer head 1 using a positional deviation correction member (not shown). The positioning unit 6 is composed of XY tables 13, 14, a clamp member 15, etc., and positions the substrate 17 transferred by the conveyor 16, and moves this substrate 17 in the XY direction.

Reference numeral 19 denotes a camera disposed above the positioning section 6, which observes the positional deviation of the pattern on the substrate 17. The three heads 1 to 3 are reciprocated in the lateral direction by driving means (not shown), and the sub transfer head 1 transfers and mounts the electronic components of the wafer 10 on the correction stage 5, and the transfer head 2
The electronic components whose positions have been corrected on the correction stage 5 are transferred to the board 17.
The transfer head 3 transfers the flux stored in the container 21 to the substrate 17.

FIGS. 2 and 3 show details of the flux supply device 7, in which reference numeral 20 denotes a support stand, on which a container 21 is placed. This container 21 is disc-shaped, and has an annular liquid reservoir 22 recessed in the shape of a groove for storing flux 23 . 24 is a motor provided at the bottom of the support base 20, and horizontally rotates the container 21. Reference numeral 26 denotes a squeegee, the lower end of which is inserted into the liquid reservoir 22, and when the container 21 rotates horizontally, the surface of the flux 23 is smoothed. Reference numeral 27 denotes a holding rod for the squeegee 26, which is supported by a bracket 28. 29
is a micrometer and controls the height of the squeegee 26.

35 is a syringe serving as a flux supply unit in which flux is stored; 36 is a support member installed upright on the support base 20; 37 is a compressor; 38 is a tube; when air is fed to the syringe 35 under pressure, the lower end of the syringe is Flux is discharged from the needle 39 in the section. Syringe 35
is provided between the flux 23 sampling position a by the transfer pin and the smoothing position b by the squeegee 26.

FIG. 3 is a developed view of the container 21, and FIG. 4 is a side view of the same. As shown, the container 21 is connected to the transfer head 3.
The transfer pin 12 is arranged at an angle so that the sampling position a is higher. The container 21 is rotated in the direction of arrow N, and the surface of the flux 23 is smoothed by a squeegee 26. At this time, as shown in the figure, the liquid level 23a of the flux 23 rises on the back of the squeegee 26, and the flux 23
tries to flow in the direction of arrow A, but since the sampling position a is higher than the smoothing position b, the flux 23 flows backward to the sampling position a, and the liquid level of the flux 23 at the sampling position a fluctuates, causing the transfer pin 12 There is no variation in the amount of transfer. Furthermore, the flux 23 is connected to the squeegee 26 and the liquid reservoir 2.
Although the flux 23 tries to flow from the gap 2 toward the collection position a as shown by the arrow B, this flow is also prevented for the same reason, and the liquid level of the flux 23 at the collection position a becomes stable.

FIG. 3 is a developed diagram drawn to facilitate understanding of the operation, and the operation will be explained next with reference to this figure.

The transfer head 3 arrives above the container 21,
As the transfer pin 12 moves up and down, the flux 23 is attached to the lower end thereof, collected, transferred to the substrate 17, and transferred onto the circuit pattern. By collecting the flux 23, the liquid surface is hollowed out to form a recess A, but this recess A is smoothed by the squeegee 26 as the container 21 rotates. At that time, as mentioned above, flux 2
3 flows in the directions of arrows A and B, but since the sampling position a is higher than the smoothing position b, the flux 23 does not flow back to the sampling position a, so the liquid level of the flux 23 at the sampling position a is Stable and always the right amount of flux 23
can be attached to the transfer pin 12. Transfer pin 1
When the flux 23 is repeatedly collected in step 2, the flux 23 in the container 21 gradually decreases, so the flux is replenished from the syringe 35 as appropriate.

[0017]

As explained above, the present invention, in this type of electronic component mounting apparatus, tilts the container for storing flux and adjusts the flux collection position by the transfer pin.
Since it is set higher than the smooth position of the squeegee, the flux will not flow back from the smooth position to the sampling position, and the flux level at the sampling position will be stable, allowing the appropriate amount of flux to always adhere to the transfer pin. can.

[Brief explanation of the drawing]

[Fig. 1] A perspective view of an electronic component mounting apparatus of the present invention.

[Figure 2] Perspective view of the flux supply device

[Figure 3] Exploded view of the flux supply device

[Figure 4] Side view of the container

[Explanation of symbols]

1 Sub transfer head 2 Transfer head 3 Transfer head 7 Flux supply device 12 Transfer pin 21 Container 22 Annular liquid reservoir 23 Flux 24 Motor 26 Squeegee 35 Syringe a Sampling position b Smooth position

Claims (1)

[Claims] 1. A transfer head that transfers and mounts electronic components in an electronic component supply section onto a substrate positioned in a positioning section; and a transfer head that collects flux provided in a flux supply device using a transfer pin and transfers it onto the substrate. In the electronic component mounting apparatus equipped with a head, the flux supply device includes:
It consists of a container having an annular liquid reservoir that is horizontally rotated by being driven by a motor, and a squeegee that smooths the surface of the flux stored in the annular liquid reservoir, and the container is tilted,
An electronic component mounting apparatus characterized in that a flux sampling position by the transfer pin is higher than a smoothing position by the squeegee.