JPH0425862U - - Google Patents
Info
- Publication number
- JPH0425862U JPH0425862U JP1990067481U JP6748190U JPH0425862U JP H0425862 U JPH0425862 U JP H0425862U JP 1990067481 U JP1990067481 U JP 1990067481U JP 6748190 U JP6748190 U JP 6748190U JP H0425862 U JPH0425862 U JP H0425862U
- Authority
- JP
- Japan
- Prior art keywords
- island
- presses
- mask material
- pressing part
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
第1図は本考案に係る第1の部分メツキ用マス
ク材の概略平面図、第2図は同じく第2のマスク
材の概略平面図、第3図は同じく第3のマスク材
の概略平面図、第4図は第1のマスク材を使用時
の平面図、第5図は第2のマスク材を使用時の平
面図、第6図は第3のマスク材を使用時の平面図
、第7図は第1図のa−a断面図、第8図は第1
図のb−b断面図、第9図は第2図のc−c断面
図、第10図は第2図のd−d断面図、第11図
は第3図のe−e断面図、第12図は第3図のf
−f断面図、第13図は従来のマスク材の平面図
、第14図は従来のマスク材を使用時の平面図、
第15図は第14図のg−g断面図、第16図は
第14図のh−h断面図である。
図面符号、A……マスク材、1……開口部、2
……アイランド押圧部、3……押圧部支持部、4
……アイランド部、5……ピン、6……外周縁寄
り部分、7……吊りピン、8……先端寄り部分、
9……隅角部、10……シール材、11……基板
、12……マスク板。
FIG. 1 is a schematic plan view of a first partial plating mask material according to the present invention, FIG. 2 is a schematic plan view of a second mask material, and FIG. 3 is a schematic plan view of a third mask material. , FIG. 4 is a plan view when using the first mask material, FIG. 5 is a plan view when using the second mask material, FIG. 6 is a plan view when using the third mask material, and FIG. Figure 7 is a sectional view taken along line a-a in Figure 1, and Figure 8 is a cross-sectional view of Figure 1.
9 is a sectional view taken along line cc in FIG. 2, FIG. 10 is a sectional view taken along line dd in FIG. 2, FIG. 11 is a sectional view taken along line ee in FIG. 3, Figure 12 is f of Figure 3.
-f sectional view, Fig. 13 is a plan view of a conventional mask material, Fig. 14 is a plan view when using a conventional mask material,
15 is a sectional view taken along line gg in FIG. 14, and FIG. 16 is a sectional view taken along line hh in FIG. 14. Drawing code, A... Mask material, 1... Opening, 2
...Island pressing part, 3...Pressing part support part, 4
... Island part, 5 ... Pin, 6 ... Part near the outer periphery, 7 ... Hanging pin, 8 ... Part near the tip,
9...Corner portion, 10...Sealing material, 11...Substrate, 12...Mask plate.
Claims (1)
開口部1を形成した部分メツキ用マスク材Aにお
いて、 リング状の内周縁寄り部分が、アイランド部4
の外周縁寄り部分6を押さえるアイランド押圧部
2と、 開口部3内縁から吊りピン7を押さえ、上記ア
イランド押圧部2に続く押圧部支持部3とを設け
てなる、部分メツキ用マスク材。 リードフレームのメツキ必要箇所に対応して
開口部1を形成した部分メツキ用マスク材Aにお
いて、 リング状の内周縁寄り部分がアイランド部4の
外周縁寄り部分6を押さえ、外周縁寄り部分で各
ピン5の先端寄り部分8も押さえるアイランド押
圧部2と、 開口部1内縁から吊りピン7を押さえ、上記ア
イランド押圧部2に続く押圧部支持部3とを設け
てなる、部分メツキ用マスク材。 リードフレームのメツキ必要箇所に対応して
開口部1を形成した部分メツキ用マスク材Aにお
いて、 アイランド部4の隅角部9を押さえるアイラン
ド押圧部2を、 開口部1内縁から吊りピン7を押さえ、上記ア
イランド押圧部2に続く押圧部支持部3の先端部
寄りに設けてなる、部分メツキ用マスク材。[Scope of Claim for Utility Model Registration] In mask material A for partial plating in which openings 1 are formed corresponding to the parts of the lead frame that require plating, the ring-shaped inner periphery part is island part 4.
A mask material for partial plating, comprising: an island pressing part 2 that presses a portion 6 near the outer peripheral edge of the opening 3; and a pressing part support part 3 that presses a hanging pin 7 from the inner edge of the opening 3 and continues to the island pressing part 2. In the mask material A for partial plating, in which openings 1 are formed corresponding to the parts of the lead frame that require plating, the ring-shaped inner peripheral edge part presses the outer peripheral edge part 6 of the island part 4, and the outer peripheral edge part presses the outer peripheral edge part 6 of the island part 4. This mask material for partial plating is provided with: an island pressing part 2 which also presses a portion 8 near the tip of a pin 5; and a pressing part support part 3 which presses a hanging pin 7 from the inner edge of the opening 1 and continues to the island pressing part 2. In the mask material A for partial plating in which openings 1 are formed corresponding to the parts of the lead frame that require plating, the island pressing part 2 that presses the corner part 9 of the island part 4 is pressed, and the hanging pin 7 is pressed from the inner edge of the opening 1. , a mask material for partial plating provided near the tip of the pressing part support part 3 following the island pressing part 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067481U JPH0734930Y2 (en) | 1990-06-26 | 1990-06-26 | Masking material for partial plating for lead frames that requires plating on the island |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067481U JPH0734930Y2 (en) | 1990-06-26 | 1990-06-26 | Masking material for partial plating for lead frames that requires plating on the island |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0425862U true JPH0425862U (en) | 1992-03-02 |
| JPH0734930Y2 JPH0734930Y2 (en) | 1995-08-09 |
Family
ID=31601093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990067481U Expired - Lifetime JPH0734930Y2 (en) | 1990-06-26 | 1990-06-26 | Masking material for partial plating for lead frames that requires plating on the island |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0734930Y2 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748265U (en) * | 1980-08-29 | 1982-03-18 | ||
| JPS57140886A (en) * | 1981-02-25 | 1982-08-31 | Toshiba Corp | Partial plating device |
| JPS57210987A (en) * | 1981-06-18 | 1982-12-24 | Sumitomo Electric Ind Ltd | Partial plating device |
| JPS6223862U (en) * | 1985-07-27 | 1987-02-13 | ||
| JPS6353957A (en) * | 1986-08-22 | 1988-03-08 | Hitachi Cable Ltd | How to spot-fit a lead frame |
| JPH02133949A (en) * | 1988-11-14 | 1990-05-23 | Hitachi Cable Ltd | Lead frame spot plating method |
-
1990
- 1990-06-26 JP JP1990067481U patent/JPH0734930Y2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748265U (en) * | 1980-08-29 | 1982-03-18 | ||
| JPS57140886A (en) * | 1981-02-25 | 1982-08-31 | Toshiba Corp | Partial plating device |
| JPS57210987A (en) * | 1981-06-18 | 1982-12-24 | Sumitomo Electric Ind Ltd | Partial plating device |
| JPS6223862U (en) * | 1985-07-27 | 1987-02-13 | ||
| JPS6353957A (en) * | 1986-08-22 | 1988-03-08 | Hitachi Cable Ltd | How to spot-fit a lead frame |
| JPH02133949A (en) * | 1988-11-14 | 1990-05-23 | Hitachi Cable Ltd | Lead frame spot plating method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0734930Y2 (en) | 1995-08-09 |
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