JPH0426187A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To prevent a malfunction from being caused even when this device is used in strong electromagnetic waves by a method wherein a line connecting a lead for power-supply use to a lead terminal for ground use, power-supply wiring and wiring for ground use so as to make a surrounding area together with an active element minimum are formed and a capacitor which is connected to the lead for power-supply use and the lead terminal for ground use is formed in a position close to them and so as to correspond to them. CONSTITUTION:On the second face of an insulating board 1, the following main parts are constituted: lines by which a lead terminal 4 for ground use is connected to GND terminals 22A, 22B as second power-supply terminals of active elements 2A, 2B and which connect a lead terminal 3 for power-supply use to the lead terminal 4 for ground use; a power-supply wiring 5; ground wiring 6A to 6D of a second power-supply inter-connection so as to make a surrounding area together with the active elements 2A, 2B minimum by taking into consideration other electronic components, wiring and the like; the ground wiring 6D by which a first electrode and a second electrode are formed in positions close to the lead terminal 3 for power-supply use of the power-supply wiring 5 and so as to be close to the power-supply wiring 5; and a capacitor 8 connected to the interconnections so as to correspond to them. As a result, the ground interconnections 6B to 6D are connected to the ground wiring 6A by using through holes 7A to 7C.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device that has active elements mounted on an insulating substrate and is used in strong electromagnetic waves.

``Prior art'' A wiring pattern is formed on an insulating substrate, such as a printed circuit board, and a wiring pattern is formed on the insulating substrate, such as an IC (IC) transistor.

Hybrid integrated circuit devices are equipped with electronic components such as resistors and capacitors, and lead terminals are provided on the outer periphery of an insulating substrate for connection with external circuits to achieve specific circuit functions. , it is necessary to supply power from outside via the lead terminal.

As shown in FIG. 2, in the conventional hybrid integrated circuit device of this type, the ground wiring 6 is made thick and placed on the outer periphery of the insulating substrate 1 in order to stabilize the operation, and the power wiring 5 is placed on the outer periphery of the insulating substrate 1. It was placed in the center to supply power to the active elements 2A and 2B.

This is because it is convenient to supply power to the plurality of active elements 2A and 2B from the pair of power supply lead terminals 3 and grounding lead terminals 4.

[Problem to be solved by the invention]

In this conventional hybrid integrated circuit device, the ground wiring 6 is placed on the outer periphery of the insulating substrate 1, and the power wiring 5 is placed in the center of the insulating substrate 1. Therefore, when used in strong electromagnetic waves, the magnetic interface of the electromagnetic waves If perpendicular to the insulating substrate 1, the power supply wiring 5. Magnetic flux intersects in the loop formed by the active elements 2A, 2B and the ground wiring 6, which generates an electromotive force in this loop, which is further rectified by the nonlinear characteristic portion in the active elements 2A, 2B, so it is unnecessary. There was a problem in that high voltage was generated, causing malfunction.

An object of the present invention is to provide a hybrid integrated circuit device that can prevent malfunctions even when used in strong electromagnetic waves.

[Means to solve the problem]

A hybrid integrated circuit device of the present invention includes an insulating substrate, an active element mounted on the insulating substrate, and a first insulating substrate provided at a predetermined position on the insulating substrate for supplying external power to the active element. and a second power supply lead terminal, and a first power supply wiring formed on the first surface of the insulating substrate and connecting the first power supply lead terminal and the first power supply terminal of the active element; A line connecting the second power supply lead terminal and the second power supply terminal of the active element to the second surface of the insulating substrate and connecting the first and second power supply lead terminals; The first power supply wiring and the second power supply wiring are formed so that the area surrounding the active element is minimized.

Further, it has a configuration in which capacitors are provided to connect the first and second electrodes to positions close to the first and second power supply lead terminals of the first and second power supply wirings, respectively. .

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing one embodiment of the present invention.

In this embodiment, an insulating substrate 1, active elements 2A and 2B mounted on the insulating substrate, and active elements 2A and 2B provided on one side of the periphery of the insulating substrate 1 respectively, supplying external power to the active elements 2A and 2B. The grounding lead terminal 4 of the first power lead terminal 3 and the second power lead terminal 4 for connecting the first power lead terminal 3 and the active element 2 formed on the first surface of the insulating substrate 1 The first power supply wiring 5 connects the VCC terminals 2iA and 21n, which are the first power supply terminals of ^ and 2B, and the grounding lead terminal 4 and the active element 2A are connected to the second surface of the insulating substrate 1. , GND terminal 2, which is the second power supply terminal of 2B.
2A and 22B, and a wire connecting between the power supply lead terminal 3 and the grounding lead terminal 4, the power supply wiring 5, and the active element 2A.

The ground wirings 6A to 6D of the second power supply wiring, which are formed so that the area surrounding them together with 2n is minimized in consideration of other electronic components, wiring, etc., and the first and second electrodes of the power supply wiring 5. It has a configuration in which capacitors 8 are connected in correspondence with ground wiring 6D provided in a position close to the power supply lead terminal 3 and in proximity to the power supply wiring 5, respectively.

A wire connecting the power supply lead terminal 3 and the grounding lead terminal 4,
Power supply wiring 5, active elements 2A, 2e and ground wiring 6
The area surrounded by A to 6rl is minimized when the ground wiring 6A, power supply wiring 5, and active elements 2A and 2B are arranged so as to overlap when seen from one side of the insulating substrate 1. However, depending on the arrangement of other electronic components, wiring, etc., they cannot necessarily be arranged so as to overlap. The ground wirings 6A to 6D are arranged so that the area becomes the minimum in such a state. In addition, the ground wirings 6B to 6D are
Active elements 2A and 2+ mounted on the first surface of the insulating substrate 1
1 and the predetermined terminals and electrodes of the capacitor 8, and the ground wiring 6A is connected by through poles 7A to 7c.
is connected to.

By arranging the ground wirings 6A to 6D in this way,
Since the magnetic flux of the electromagnetic waves passing through the above-mentioned area is the lowest, the power supply wiring 5. Ground wiring 6A to 6o and active element 2
The electromotive force induced in 4.2B can be minimized,
Furthermore, the capacitor 8 reduces the induced electromotive force and prevents externally induced electromotive force and noise from entering the device, thereby preventing malfunctions even when used in strong electromagnetic waves. be able to.

In this example, the induced electromotive force could be reduced by 10 dB or more compared to the conventional example.

〔Effect of the invention〕

As explained above, the present invention connects the first and second power supply wirings to the wires connecting the first and second power supply lead terminals, and the first and second power supply wirings.
A capacitor is placed between the first and second power supply wirings in close proximity to the first and second power supply lead terminals. With this configuration, even when used in strong electromagnetic waves, the electromotive force induced in the first and second power supply wiring etc. can be minimized, and moreover, the electromotive force induced by the capacitor can be minimized. It is also possible to prevent electromotive force and noise from outside from entering the inside, which has the effect of preventing malfunctions.

[Brief explanation of drawings]

Ru. 1... Insulating substrate, 2A, 2B... Active element, 3.
...Power supply lead terminal, 4...Grounding lead terminal, 5
・・Power wiring, 6,6A~6D・・Ground wiring, 7A・
~7o... Through hole, 8... Capacitor, 21
A2] B-Vcc terminal, 22A, 22B -
GND terminal.

Claims (2)

[Claims] 1. an insulating substrate, an active element mounted on the insulating substrate, and first and second power lead terminals provided at predetermined positions on the insulating substrate for supplying external power to the active element. , a first power supply wiring formed on the first surface of the insulating substrate and connecting the first power supply lead terminal and the first power terminal of the active element; and a first power supply wiring formed on the second surface of the insulating substrate. , a line that connects the second power supply lead terminal and the second power supply terminal of the active element and connects the first and second power supply lead terminals, the first power supply wiring, and the A hybrid integrated circuit device comprising: a second power supply wiring formed so as to minimize the area surrounding the active element. 2. 2. The hybrid integrated circuit according to claim 1, further comprising capacitors connecting the first and second electrodes to positions close to the first and second power supply lead terminals of the first and second power supply wirings, respectively. Device.