JPH0426196A - Shielding structure - Google Patents
Shielding structureInfo
- Publication number
- JPH0426196A JPH0426196A JP13079490A JP13079490A JPH0426196A JP H0426196 A JPH0426196 A JP H0426196A JP 13079490 A JP13079490 A JP 13079490A JP 13079490 A JP13079490 A JP 13079490A JP H0426196 A JPH0426196 A JP H0426196A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- bag
- shield
- whole
- executed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000004698 Polyethylene Substances 0.000 claims abstract description 5
- -1 polyethylene Polymers 0.000 claims abstract description 5
- 229920000573 polyethylene Polymers 0.000 claims abstract description 5
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、電気的及び機械的に発生するノイズを遮へい
する為の、シールド構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a shield structure for shielding electrically and mechanically generated noise.
［従来の技術］
従来のシールド構造は、第５図の様にシールド紙３１を
ケース内側３２へ貼り、シールド接点をスプリング３３
で基板３４との接続をとる構造や、第６図の様に、金属
ハウジング４１を基板４２とはんだ付４３を行ない接続
をとる構造や、第７図の様に、シールド材５１を絶縁物
５２でラミネートした構造のものを基板５３とネジ５４
で接続する構造のものが多く知られている。[Prior Art] In the conventional shield structure, a shield paper 31 is attached to the inside of the case 32 as shown in FIG.
6, a structure in which the metal housing 41 is connected to the board 42 by soldering 43, and a structure in which the shielding material 51 is connected to the insulating material 52 as shown in FIG. The board 53 and the screws 54 have a laminated structure.
Many structures are known that are connected by .
［発明が解決しようとする課題］
しかし、前述の従来技術では、シールド紙を貼付ける構
造や、金属ハウジウング構造等であると、構造的に上記
構造を設【プるスペースを確保する必要があったり、シ
ールド効果をもたせる方法が、その上記構造を有した方
向にしか効果がでないという一面方向の効果しか無いと
いう問題点を有していた。[Problems to be Solved by the Invention] However, in the above-mentioned conventional technology, if the structure is such that a shield paper is pasted or a metal housing structure, it is necessary to secure a structural space for installing the above-mentioned structure. In addition, the method of providing a shielding effect has the problem that it is effective only in one direction, that is, it is effective only in the direction in which the structure described above is provided.
本発明は、このような問題点を解決するもので、その目
的とするとこ、ろは、製型シールドを吸引することによ
り、回路基板に密着し構造的スペースを有効的に活用で
き、又全体をおおうことにより、全体シールド効果を有
するシールド構造を提供するところにある。The present invention is intended to solve these problems.The purpose of the present invention is that by suctioning the molded shield, the filter can closely adhere to the circuit board, effectively utilizing the structural space, and reducing the overall The purpose is to provide a shield structure having an overall shielding effect by covering.
［課題を解決するための手段］
本発明のシールド構造は、電気的及び機械的に発生する
ノイズを遮へいするためのシールド構造に於いて、シー
ルド材を軟質でかつ、絶縁性のあるポリエチレン等によ
りサンドイッチした袋型構造と、吸引できる構造を設け
たことを特徴とする。[Means for Solving the Problems] The shield structure of the present invention is a shield structure for shielding electrically and mechanically generated noise, in which the shield material is made of soft and insulating polyethylene or the like. It is characterized by having a sandwiched bag-type structure and a suction structure.
［実 施 例］
第１図は、本発明の構造の１実施例を示す全体図である
１図中符号１は、シールド材で、電気的、機械的に発生
するノイズを遮へいするシールド材である１袋２により
、包まれた状態でそこへ回路基板３を挿入する構造であ
る。[Embodiment] Figure 1 is an overall view showing one embodiment of the structure of the present invention. In Figure 1, reference numeral 1 is a shielding material that shields electrically and mechanically generated noise. The circuit board 3 is inserted into a bag 2 while being wrapped therein.
吸引口４は外部の真空装置より吸引し、製型のシールド
状態を回路基板３に密着実装するための吸引口４である
。The suction port 4 is a suction port 4 for sucking from an external vacuum device and closely mounting the molded shield state on the circuit board 3.
回路基板３との接続をとるための接続部５が構成され、
上記吸引口４より吸引した後熱カシメ６により製型シー
ルドの開口部を閉じる構造となっている。A connecting part 5 for making a connection with the circuit board 3 is configured,
After suction is drawn from the suction port 4, the opening of the mold shield is closed by thermal caulking 6.
第２図は、第１図に示された全体図の製型シールド構造
の断面図である。FIG. 2 is a cross-sectional view of the overall molded shield structure shown in FIG. 1.
図中符号１１は、シールド材で、袋１２によりザンドイ
ッチ状に構成されており、ポリエチレンやナイロンビニ
ール等の材質でシールド材を包み込んでいる。Reference numeral 11 in the drawing denotes a shielding material, which is configured in a sandwich shape with a bag 12, and the shielding material is wrapped in a material such as polyethylene or nylon vinyl.
第３図は、第１図に示された全体図の製型シールド構造
のｌ接続方法の例を示す構造図である。FIG. 3 is a structural diagram showing an example of a connection method for the molded shield structure shown in the general view shown in FIG. 1.
図中符号２１は接続部、ネジ２２とワッシャー２３で支
柱２４ヘネジ止めする構造となっている。In the figure, reference numeral 21 denotes a connecting portion, which is screwed to a support column 24 using a screw 22 and a washer 23.
この接続部２１は、回路基板２５の接続部２１に合す事
が任意にできる様になっている。This connecting portion 21 can be arbitrarily matched with the connecting portion 21 of the circuit board 25.
第４図は、本発明のシールド構造の完成図である。FIG. 4 is a completed diagram of the shield structure of the present invention.
尚本実施例によれば、シールド材の材料は、従来から使
用している安価な紙タイプでも可能である。又、袋に使
用する材質はポリエチレンや、ナイロンビニール等も用
いることが出来る。According to this embodiment, the material of the shielding material may be a conventionally used inexpensive paper type material. Moreover, polyethylene, nylon vinyl, etc. can also be used as the material for the bag.
［発明の効果］
以上述べたように本発明によれば、製型シールドを吸引
することにより、回路基板に密着し構造的スペースを有
効的に活用でき、又全体をおおうことにより、全体シー
ルドが可能となる効果を有する。[Effects of the Invention] As described above, according to the present invention, by suctioning the molded shield, it is possible to closely adhere to the circuit board and effectively utilize the structural space, and by covering the entire shield, the entire shield can be It has the effect of making it possible.
第１図は、本発明の構造の１実施例を示す全体図。
第２図は、第１図に示された全体図の製型シールド構造
の断面図。
第３図は、第１図に示された全体図の製型シールド構造
の１接続方法の例を示す構造図。
第４図は、本発明のシールド構造の完成図。
第５図、第６図、第７図は従来のシールド構造の１実施
例を示す構造図。
・・シールド材
・・袋
・・回路基板
・・吸引口
・・接続部
・・熱カシメ
１１・・・シールド材
１２・・・袋
２１・・・接続部
２２・・・ネジ
２３・・・ワッシャ＝
２４・・・支柱
２５・・・回路基板
３１・・・シールド材
３２・・・ケース内側
３３・・・スプリング
３４・・・基板
４１・・・金属ハウジング
４２・・・基板
４３・・・はんだ付
５１・・・シールド材
５２・・・絶縁物
５３・・・基板
５４・・・ネジ
第
質２団
第FIG. 1 is an overall view showing one embodiment of the structure of the present invention. FIG. 2 is a cross-sectional view of the overall molded shield structure shown in FIG. 1. FIG. 3 is a structural diagram showing an example of one connection method of the molded shield structure shown in the overall view shown in FIG. 1; FIG. 4 is a completed diagram of the shield structure of the present invention. FIG. 5, FIG. 6, and FIG. 7 are structural diagrams showing one embodiment of a conventional shield structure.・・Shield material・・Bag・・Circuit board・・Suction port・・Connection part・・Heat caulking 11・・Shield material 12・・Bag 21・・Connection part 22・・Screw 23・・Washer = 24... Support column 25... Circuit board 31... Shield material 32... Case inside 33... Spring 34... Board 41... Metal housing 42... Board 43... Solder Attachment 51... Shield material 52... Insulator 53... Substrate 54... Screw material 2nd group
Claims (1)
によりサンドイッチした袋型構造と、吸引できる構造を
設けたことを特徴とするシールド構造。A shield structure characterized by a bag-shaped structure in which the shield material is sandwiched between soft and insulating polyethylene, etc., and a structure capable of suction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13079490A JPH0426196A (en) | 1990-05-21 | 1990-05-21 | Shielding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13079490A JPH0426196A (en) | 1990-05-21 | 1990-05-21 | Shielding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426196A true JPH0426196A (en) | 1992-01-29 |
Family
ID=15042851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13079490A Pending JPH0426196A (en) | 1990-05-21 | 1990-05-21 | Shielding structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426196A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5519585A (en) * | 1993-04-12 | 1996-05-21 | Dell Usa, L.P. | Sandwiched insulative/conductive layer EMI shield structure for printed circuit board |
| US5622755A (en) * | 1994-10-19 | 1997-04-22 | Fuji Photo Film Co., Ltd. | Photographic film cassette |
| US5833160A (en) * | 1994-09-21 | 1998-11-10 | Fuji Photo Film Co., Ltd. | Photo film cassette including an improved flange design for retaining the film |
| DE10247676A1 (en) * | 2002-10-12 | 2004-07-15 | Hella Kg Hueck & Co. | Electronic circuit boards used in such as road vehicle equipment is protected by all over cover of plastic foil |
-
1990
- 1990-05-21 JP JP13079490A patent/JPH0426196A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5519585A (en) * | 1993-04-12 | 1996-05-21 | Dell Usa, L.P. | Sandwiched insulative/conductive layer EMI shield structure for printed circuit board |
| US5833160A (en) * | 1994-09-21 | 1998-11-10 | Fuji Photo Film Co., Ltd. | Photo film cassette including an improved flange design for retaining the film |
| US5622755A (en) * | 1994-10-19 | 1997-04-22 | Fuji Photo Film Co., Ltd. | Photographic film cassette |
| DE10247676A1 (en) * | 2002-10-12 | 2004-07-15 | Hella Kg Hueck & Co. | Electronic circuit boards used in such as road vehicle equipment is protected by all over cover of plastic foil |
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