JPH0426409B2 - - Google Patents

Info

Publication number
JPH0426409B2
JPH0426409B2 JP59094463A JP9446384A JPH0426409B2 JP H0426409 B2 JPH0426409 B2 JP H0426409B2 JP 59094463 A JP59094463 A JP 59094463A JP 9446384 A JP9446384 A JP 9446384A JP H0426409 B2 JPH0426409 B2 JP H0426409B2
Authority
JP
Japan
Prior art keywords
magnetic sensor
terminal
flexible printed
printed circuit
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59094463A
Other languages
Japanese (ja)
Other versions
JPS60238714A (en
Inventor
Takeshi Uno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59094463A priority Critical patent/JPS60238714A/en
Publication of JPS60238714A publication Critical patent/JPS60238714A/en
Publication of JPH0426409B2 publication Critical patent/JPH0426409B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Measuring Magnetic Variables (AREA)

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、磁気センサー装置の製造方法に係
り、特に、磁気センサーと波形整形回路との接続
を、好適な作業方法で行なつた磁気センサー装置
の製造方法に関するものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a method for manufacturing a magnetic sensor device, and particularly to a magnetic sensor device in which a magnetic sensor and a waveform shaping circuit are connected by a suitable working method. The present invention relates to a manufacturing method.

〔発明の背景〕[Background of the invention]

従来、フレキシブルプリント回路による接続
は、同時多数接続が可能で、かつ、柔軟性に富
み、線の疲労に強いところから、オフイスオート
メーシヨン機器などの可動部と固定部との接続に
広く用いられている。 Conventionally, connections using flexible printed circuits have been widely used to connect movable parts and fixed parts such as office automation equipment because they allow multiple connections at the same time, are highly flexible, and are resistant to wire fatigue. There is.

また、近年、同時多数接続の特徴を活かし、
100〜400点程度の固定部相互間の接続、たとえ
ば、液晶部品と回路部分との接続に使用されはじ
めている。 In addition, in recent years, taking advantage of the characteristics of simultaneous multiple connections,
It is beginning to be used to connect between 100 to 400 fixed parts, for example, to connect liquid crystal parts and circuit parts.

そして、可動部に応用した場合は、接続部分に
力が加わるため、また多数接続に応用した場合
は、端子を小さくするため、端子強度の限界か
ら、接着剤などによる補強が行われているが、比
較的薄膜端子面積が大きくとれ、端子数も30点以
下と少ない、上記のような固定部相互間の接続に
は、その強度についての検討が加えられていなか
つたものである。 When applied to movable parts, force is applied to the connecting parts, and when applied to multiple connections, reinforcing with adhesive etc. is performed due to the limit of terminal strength in order to reduce the size of the terminal. However, no consideration has been given to the strength of the connection between fixed parts as described above, which has a relatively large thin film terminal area and a small number of terminals (30 or less).

〔発明の目的〕[Purpose of the invention]

本発明は、接着剤などによる補強のない、薄膜
金属端子とフレキシブルプリント回路との接続構
成に係る磁気センサー装置の製造方法の提供を、
その目的とするものである。 The present invention provides a method for manufacturing a magnetic sensor device that has a connection structure between a thin film metal terminal and a flexible printed circuit without reinforcement using an adhesive or the like.
That is the purpose.

〔発明の概要〕[Summary of the invention]

本発明は、磁気エンコーダーにおける磁気セン
サーの薄膜金属端子と、同じく磁気エンコーダー
における波形整形回路とを、フレキシブルプリン
ト回路を介する熱溶着により接続する磁気センサ
ー装置の製造方法において、磁気センサーの薄膜
金属端子の中央よりも、その磁気センサーのセン
サーパターン側を加熱、加圧位置として熱溶着し
接続することを特徴とするものである。 The present invention provides a method for manufacturing a magnetic sensor device in which a thin film metal terminal of a magnetic sensor in a magnetic encoder and a waveform shaping circuit in the same magnetic encoder are connected by thermal welding via a flexible printed circuit. The sensor pattern side of the magnetic sensor, rather than the center, is heated and pressurized and connected by heat welding.

さらに補足すると、次のとおりである。 Further details are as follows.

第４図のイは、磁気エンコーダーの略示断面
図、ロは、その要部拡大図で、第５図は、従来例
に係る、薄膜金属端子とフレキシブルプリント回
路との熱溶着説明図であるが、その熱溶着は、価
格を下げるため、次のようにして行つていたもの
である。 4A is a schematic sectional view of the magnetic encoder, B is an enlarged view of its main parts, and FIG. 5 is an explanatory diagram of thermal welding of a thin film metal terminal and a flexible printed circuit according to a conventional example. However, in order to reduce the price, the heat welding was done as follows.

すなわち、ガラス基板１の上に磁気センサーに
係るセンサーパターン２を蒸着し、その上に銅の
薄膜金属端子４を形成して、パシベーシヨン３で
保護し、半田５を端子部分に付けて構成する磁気
センサーＳに、銅箔６とプラスチツク７とより構
成され、その他方を、波形整形回路部Ｈに接続さ
れるフレキシブルプリント回路Ｆを対向させ、こ
のフレキシブルプリント回路Ｆの背後に、ヒータ
ーチツプ８を配置して、半田５の溶融固着によ
り、フレキシブルプリント回路Ｆを熱融着するも
のである。 That is, a sensor pattern 2 related to a magnetic sensor is deposited on a glass substrate 1, a copper thin film metal terminal 4 is formed on it, protected by a passivation 3, and solder 5 is attached to the terminal part. A flexible printed circuit F, which is composed of a copper foil 6 and a plastic 7 and which is connected to a waveform shaping circuit section H, is placed opposite to the sensor S, and a heater chip 8 is arranged behind the flexible printed circuit F. Then, by melting and fixing the solder 5, the flexible printed circuit F is thermally fused.

しかし、このようにして接続した場合、熱スト
レスにより、端子強度が実用的レベルに達しない
ものがあつた。 However, when connected in this manner, the terminal strength in some cases did not reach a practical level due to thermal stress.

実験的に調査を行つたところ、1μ前後の薄膜
金属端子に、25μ〜35μの銅箔の付いたフレキシ
ブルプリント回路を、半田を介して熱溶着したた
め、半田が固まつたのちの、接合すべき部材の熱
膨張率の相違に基づくバイメタル効果による応力
が、蒸着面に加わつて、端子強度を低下させてい
ることが判つた。 An experimental investigation revealed that a flexible printed circuit with a 25μ to 35μ copper foil was thermally welded to a thin film metal terminal of around 1μ using solder. It was found that stress due to the bimetallic effect due to the difference in the coefficient of thermal expansion of the members was applied to the vapor deposition surface, reducing the terminal strength.

このように、十分、結合ができないために、剥
離事故が多発（約５％）しているものであつた。 As described above, since sufficient bonding was not possible, peeling accidents frequently occurred (approximately 5%).

また、ヒーターチツプの寸法を変更して、半田
の溶け具合を調べたところ、ヒーターチツプの近
傍しか半田が溶けていないことが判つた。 Furthermore, when the dimensions of the heater chip were changed and the degree of melting of the solder was examined, it was found that the solder was melted only in the vicinity of the heater chip.

この結果より、半田付けの長さを、できるだけ
短くし、かつ、化学ストレスの少ない部分に熱溶
着を行い、接着などの端子強度を省くようにした
ものである。 Based on this result, the soldering length was made as short as possible, and heat welding was performed in areas with little chemical stress, thereby eliminating the need for terminal strength such as adhesion.

なお、図で、Ｌはリード線、Ｄは磁気ドラム、
Ｍはモートル、Ｅは、波形整形回路部Ｈに係る電
子部品を示すものである。 In addition, in the figure, L is a lead wire, D is a magnetic drum,
M indicates a motor, and E indicates an electronic component related to the waveform shaping circuit section H.

〔発明の実施例〕[Embodiments of the invention]

本発明の一実施例を第１〜３図を参照して説明
する。 An embodiment of the present invention will be described with reference to FIGS. 1 to 3.

第１図は、本発明方法によつて製造された磁気
センサー装置の一部開披平面図、第２図は、その
薄膜金属端子とフレキシブルプリント回路の熱溶
着説明図、第３図は、端子強度とヒーターチツプ
位置との関係説明図である。 FIG. 1 is a partially opened plan view of a magnetic sensor device manufactured by the method of the present invention, FIG. 2 is an explanatory diagram of thermal welding of a thin film metal terminal and a flexible printed circuit, and FIG. 3 is a terminal FIG. 3 is an explanatory diagram of the relationship between strength and heater chip position.

そして、さきの第４，５図と同一符号は同等部
分を示し、１Ａはガラス基板、５Ａは半田、６Ａ
は銅箔、７Ａはプラスチツクシート、８Ａはヒー
ターチツプである。 The same numbers as those in Figures 4 and 5 above indicate the same parts, 1A is the glass substrate, 5A is solder, 6A is
is a copper foil, 7A is a plastic sheet, and 8A is a heater chip.

しかして、第１図に示す、半田５Ａ、フレキシ
ブルプリント回路の銅箔６Ａの接続は、次のよう
にして行つたものである。 The connection between the solder 5A and the copper foil 6A of the flexible printed circuit shown in FIG. 1 was made as follows.

すなわち、第２図において、ガラス基板１Ａの
上に、磁気センサーの薄膜のセンサーパターン２
を形成し、その上に、薄膜金属端子４を形成し
て、パシベーシヨン３で保護をし、半田５Ａを端
子部分に付けて構成する磁気センサーＳに、銅箔
６Ａとプラスチツク７Ａとより構成されるフレキ
シブルプリント回路Ｆを対向させ、フレキシブル
プリント回路Ｆの背後に、ヒーターチツプ８Ａを
配置せしめ、ヒーターチツプ８Ａによつて、磁気
センサーＳの端子部分とフレキシブルプリント回
路Ｆとを加圧、加熱して半田５Ａを溶融固着させ
るようにしたものである。 That is, in FIG. 2, a thin film sensor pattern 2 of a magnetic sensor is placed on a glass substrate 1A.
A magnetic sensor S is formed by forming a thin film metal terminal 4 thereon, protecting it with passivation 3, and applying solder 5A to the terminal portion, and a magnetic sensor S consisting of a copper foil 6A and a plastic 7A. The flexible printed circuit F is made to face each other, and the heater chip 8A is placed behind the flexible printed circuit F, and the terminal portion of the magnetic sensor S and the flexible printed circuit F are pressurized and heated by the heater chip 8A to solder them. 5A is melted and fixed.

そして、この作業において、ヒーターチツプ８
Ａの幅Ｗを磁気センサーＳの端子部分の長さＬよ
り短かくし、化学ストレスの少ないセンサーパタ
ーン側（図示のＡ）を加圧、加熱するようにした
ものである。 In this work, the heater chip 8
The width W of A is made shorter than the length L of the terminal portion of the magnetic sensor S, and the sensor pattern side (A in the figure) with less chemical stress is pressurized and heated.

一例として、第２図において、端子部分の長さ
Ｌ＝1.5mm、ヒーターチツプ８Ａの幅Ｗ＝0.8mmの
場合、ヒーターチツプ８Ａを位置を、端子部分の
中心Ｃ、中心からＬ／４外側に移したＢ，Ｌ／４
センサーパターン側に移したＡについて、剥離強
度試験を行なつたところ、第３図に示すように、
Ｃが最も弱く、確率的に端子強度不足のものが１
％前後生じた。 As an example, in Fig. 2, if the length L of the terminal part is 1.5 mm and the width W of the heater chip 8A is 0.8 mm, the heater chip 8A is positioned at the center C of the terminal part and L/4 outward from the center. Moved B, L/4
A peel strength test was performed on A transferred to the sensor pattern side, as shown in Figure 3.
C is the weakest, and the one with terminal strength that is probabilistically insufficient is 1.
It occurred around %.

また、Ｂについては、強度の平均値はＣより若
干高く、ばらつきも改善され、端子強度不足のも
のも減少した。 Furthermore, regarding B, the average value of strength was slightly higher than that of C, the variation was improved, and the number of terminals with insufficient strength was reduced.

しかして、Ａのものは、端子強度の平均値が、
Ｃの1.5〜２倍有り、ばらつきも約半分になつて、
端子強度不足も、確率的に0.01％前後になり、最
も安定した作業結果を示した。 Therefore, in case A, the average value of the terminal strength is
It is 1.5 to 2 times as much as C, and the variation is about half,
The probability of insufficient terminal strength was around 0.01%, showing the most stable work results.

このように、ヒーターチツプをセンサーパター
ン側にずらして当てると、さきに述べたバイメタ
ル効果が大巾に低下し、結合力が大巾に増大し、
剥離事故率が低下（0.4％）したものである。 In this way, when the heater chip is shifted toward the sensor pattern and applied, the bimetallic effect mentioned earlier is greatly reduced, and the bonding force is greatly increased.
The peeling accident rate decreased (0.4%).

しかして、第１図に示すものにおいては、一つ
のヒーターチツプにより10個の接続を同時に行う
ようにしたものであり、また、銅箔６Ａと波形整
形回路に係るプリント配線との接続は、同じ態様
の半田接続で行つたものである。 In the case shown in Fig. 1, ten connections are made simultaneously using one heater chip, and the connections between the copper foil 6A and the printed wiring related to the waveform shaping circuit are the same. This was done using solder connections according to the embodiment.

以上のように本実施例によれば、薄膜端子部分
の強度低下を従来の１％前後から0.01％程度まで
防止することができ、端子の補強なくして、実用
に供しうるものが得られる効果がある。 As described above, according to this embodiment, it is possible to prevent the decrease in strength of the thin film terminal portion from around 1% in the conventional case to around 0.01%, and it is possible to obtain a product that can be put to practical use without reinforcing the terminal. be.

〔発明の効果〕〔Effect of the invention〕

本発明によるときは、接着剤などによる補強の
ない、薄膜金属端子とフレキシブルプリント回路
との接続構成を有する磁気センサー装置を提供す
ることができるものであつて、実用効果にすぐれ
た発明ということができる。 According to the present invention, it is possible to provide a magnetic sensor device having a connection structure between a thin film metal terminal and a flexible printed circuit without reinforcement using an adhesive or the like, and it is said that the present invention has excellent practical effects. can.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本発明方法によつて製造された磁気
センサー装置の一部開披平面図、第２図は、その
薄膜金属端子とフレキシブルプリント回路との熱
溶着説明図、第３図は、端子強度とヒーターチツ
プ位置との関係説明図、第４図のイは、磁気エン
コーダーの略示断面図、ロは、その要部拡大図、
第５図は、従来例に係る、薄膜金属端子とフレキ
シブルプリント回路との熱溶着説明図である。 １Ａ……ガラス基板、２……センサーパター
ン、３……パシベーシヨン、４……薄膜金属端
子、５Ａ……半田、６Ａ……銅箔、７Ａ……プラ
スチツクシート、８Ａ……ヒーターチツプ、Ｓ…
…磁気センサー、Ｆ……フレキシブルプリント回
路、Ｈ……波形整形回路部。 FIG. 1 is a partially opened plan view of a magnetic sensor device manufactured by the method of the present invention, FIG. 2 is an explanatory diagram of thermal welding of a thin film metal terminal and a flexible printed circuit, and FIG. An explanatory diagram of the relationship between terminal strength and heater chip position, A in Fig. 4 is a schematic sectional view of the magnetic encoder, B is an enlarged view of its main parts,
FIG. 5 is an explanatory diagram of thermal welding of a thin film metal terminal and a flexible printed circuit according to a conventional example. 1A...Glass substrate, 2...Sensor pattern, 3...Passivation, 4...Thin film metal terminal, 5A...Solder, 6A...Copper foil, 7A...Plastic sheet, 8A...Heater chip, S...
...Magnetic sensor, F...Flexible printed circuit, H...Waveform shaping circuit section.

Claims (1)

【特許請求の範囲】[Claims] １ 磁気エンコーダーにおける磁気センサーの薄
膜金属端子と、同じく磁気エンコーダーにおける
波形整形回路とを、フレキシブルプリント回路を
介する熱溶着により接続する磁気センサー装置の
製造方法において、磁気センサーの薄膜金属端子
の中央よりも、その磁気センサーのセンサーパタ
ーン側を加熱、加圧位置として熱溶着し接続する
ことを特徴とする磁気センサー装置の製造方法。1. In a method for manufacturing a magnetic sensor device in which a thin film metal terminal of a magnetic sensor in a magnetic encoder and a waveform shaping circuit in the same magnetic encoder are connected by thermal welding via a flexible printed circuit, , A method for manufacturing a magnetic sensor device, characterized in that the sensor pattern side of the magnetic sensor is heated and pressurized and connected by thermal welding.
JP59094463A 1984-05-14 1984-05-14 Device for magnetic sensor Granted JPS60238714A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59094463A JPS60238714A (en) 1984-05-14 1984-05-14 Device for magnetic sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59094463A JPS60238714A (en) 1984-05-14 1984-05-14 Device for magnetic sensor

Publications (2)

Publication Number Publication Date
JPS60238714A JPS60238714A (en) 1985-11-27
JPH0426409B2 true JPH0426409B2 (en) 1992-05-07

Family

ID=14110967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59094463A Granted JPS60238714A (en) 1984-05-14 1984-05-14 Device for magnetic sensor

Country Status (1)

Country Link
JP (1) JPS60238714A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10111389A1 (en) * 2001-03-09 2002-09-12 Heidenhain Gmbh Dr Johannes Soldered connection between tracks on e.g. flexible- and glass substrates, to make position measurement sensor, involves using solder pads of specified shape on each substrate

Also Published As

Publication number Publication date
JPS60238714A (en) 1985-11-27

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