JPH0426546U - - Google Patents

Info

Publication number
JPH0426546U
JPH0426546U JP1990067541U JP6754190U JPH0426546U JP H0426546 U JPH0426546 U JP H0426546U JP 1990067541 U JP1990067541 U JP 1990067541U JP 6754190 U JP6754190 U JP 6754190U JP H0426546 U JPH0426546 U JP H0426546U
Authority
JP
Japan
Prior art keywords
recess
semiconductor element
accommodating
wiring layer
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990067541U
Other languages
English (en)
Japanese (ja)
Other versions
JP2514094Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990067541U priority Critical patent/JP2514094Y2/ja
Publication of JPH0426546U publication Critical patent/JPH0426546U/ja
Application granted granted Critical
Publication of JP2514094Y2 publication Critical patent/JP2514094Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1990067541U 1990-06-26 1990-06-26 半導体素子収納用パッケ―ジ Expired - Lifetime JP2514094Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990067541U JP2514094Y2 (ja) 1990-06-26 1990-06-26 半導体素子収納用パッケ―ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990067541U JP2514094Y2 (ja) 1990-06-26 1990-06-26 半導体素子収納用パッケ―ジ

Publications (2)

Publication Number Publication Date
JPH0426546U true JPH0426546U (th) 1992-03-03
JP2514094Y2 JP2514094Y2 (ja) 1996-10-16

Family

ID=31601200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990067541U Expired - Lifetime JP2514094Y2 (ja) 1990-06-26 1990-06-26 半導体素子収納用パッケ―ジ

Country Status (1)

Country Link
JP (1) JP2514094Y2 (th)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251488A (ja) * 1998-03-05 1999-09-17 Sumitomo Metal Electronics Devices Inc セラミックパッケージ
JP2001110941A (ja) * 1999-10-06 2001-04-20 Meito Chin 半導体デバイス

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63261862A (ja) * 1987-04-20 1988-10-28 Sumitomo Electric Ind Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63261862A (ja) * 1987-04-20 1988-10-28 Sumitomo Electric Ind Ltd 半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251488A (ja) * 1998-03-05 1999-09-17 Sumitomo Metal Electronics Devices Inc セラミックパッケージ
JP2001110941A (ja) * 1999-10-06 2001-04-20 Meito Chin 半導体デバイス

Also Published As

Publication number Publication date
JP2514094Y2 (ja) 1996-10-16

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term