JPH0426549U - - Google Patents
Info
- Publication number
- JPH0426549U JPH0426549U JP1990067542U JP6754290U JPH0426549U JP H0426549 U JPH0426549 U JP H0426549U JP 1990067542 U JP1990067542 U JP 1990067542U JP 6754290 U JP6754290 U JP 6754290U JP H0426549 U JPH0426549 U JP H0426549U
- Authority
- JP
- Japan
- Prior art keywords
- package
- container
- insulating base
- lead terminal
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Description
第１図は本考案の半導体素子収納用パツケージ
の一実施例を示す断面図である。
１……絶縁基体、２……蓋体、３……容器、５
……外部リード端子、６ａ，６ｂ……有機樹脂接
着材から成る封止部材。
FIG. 1 is a sectional view showing an embodiment of a package for housing semiconductor elements of the present invention. 1... Insulating base, 2... Lid, 3... Container, 5
...External lead terminals, 6a, 6b...Sealing members made of organic resin adhesive.
Claims (1)
を収容するための空所を有する容器と、該容器内
に収容される半導体素子を外部電気回路に電気的
に接続するための外部リード端子とから成る半導
体素子収納用パツケージにおいて、前記少なくと
も絶縁基体が熱伝導率８０．０Ｗ／ｍ・Ｋ以上の
高熱伝導性材料から成り、且つ外部リード端子が
容器に誘電率８．０以下の有機樹脂接着材を介し
取着固定されていることを特徴とする半導体素子
収納用パツケージ。 A container consisting of an insulating base and a lid and having a cavity for accommodating a semiconductor element therein, and an external lead terminal for electrically connecting the semiconductor element housed in the container to an external electric circuit. In a package for storing semiconductor elements, the at least the insulating base is made of a highly thermally conductive material with a thermal conductivity of 80.0 W/m·K or more, and the external lead terminal is bonded to the container with an organic resin with a dielectric constant of 8.0 or less. A package for storing semiconductor elements, characterized in that the package is attached and fixed through a material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067542U JPH0426549U (en) | 1990-06-26 | 1990-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990067542U JPH0426549U (en) | 1990-06-26 | 1990-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426549U true JPH0426549U (en) | 1992-03-03 |
Family
ID=31601202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990067542U Pending JPH0426549U (en) | 1990-06-26 | 1990-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426549U (en) |
-
1990
- 1990-06-26 JP JP1990067542U patent/JPH0426549U/ja active Pending
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