JPH02129733U - - Google Patents

Info

Publication number
JPH02129733U
JPH02129733U JP3771989U JP3771989U JPH02129733U JP H02129733 U JPH02129733 U JP H02129733U JP 3771989 U JP3771989 U JP 3771989U JP 3771989 U JP3771989 U JP 3771989U JP H02129733 U JPH02129733 U JP H02129733U
Authority
JP
Japan
Prior art keywords
semiconductor element
insulating container
package
metallized lead
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3771989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3771989U priority Critical patent/JPH02129733U/ja
Publication of JPH02129733U publication Critical patent/JPH02129733U/ja
Pending legal-status Critical Current

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Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案にかかる半導体素子収納用パツ
ケージの一実施例を示す断面図、第２図は従来の
半導体素子収納用パツケージの断面図である。 １：絶縁基体、２：蓋体、５：メタライズリー
ド、７：電気絶縁膜。 FIG. 1 is a sectional view showing an embodiment of a package for housing semiconductor elements according to the present invention, and FIG. 2 is a sectional view of a conventional package for housing semiconductor elements. 1: Insulating base, 2: Lid, 5: Metallized lead, 7: Electrical insulating film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を収容する絶縁容器の底面に、半導
体素子と外部電気回路とを接続するためのメタラ
イズリードが導出されて成る半導体素子収納用パ
ツケージにおいて、前記絶縁容器の底面に前記メ
タライズリードと実質的に同一の厚みを有し、且
つ前記絶縁容器と実質的に同一の熱膨張係数を有
する電気絶縁膜を被着させたことを特徴とする半
導体素子収納用パツケージ。 In a package for storing a semiconductor element, in which a metallized lead for connecting the semiconductor element and an external electric circuit is led out from the bottom of an insulating container housing the semiconductor element, the metallized lead and the metallized lead are substantially connected to the bottom of the insulating container. 1. A package for housing a semiconductor device, characterized in that an electrical insulating film having the same thickness and substantially the same coefficient of thermal expansion as the insulating container is deposited.
JP3771989U 1989-03-30 1989-03-30 Pending JPH02129733U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3771989U JPH02129733U (en) 1989-03-30 1989-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3771989U JPH02129733U (en) 1989-03-30 1989-03-30

Publications (1)

Publication Number Publication Date
JPH02129733U true JPH02129733U (en) 1990-10-25

Family

ID=31545088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3771989U Pending JPH02129733U (en) 1989-03-30 1989-03-30

Country Status (1)

Country Link
JP (1) JPH02129733U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184038A (en) * 1984-10-01 1986-04-28 Nec Corp Package for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6184038A (en) * 1984-10-01 1986-04-28 Nec Corp Package for semiconductor device

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