JPH0426552U - - Google Patents
Info
- Publication number
- JPH0426552U JPH0426552U JP6832490U JP6832490U JPH0426552U JP H0426552 U JPH0426552 U JP H0426552U JP 6832490 U JP6832490 U JP 6832490U JP 6832490 U JP6832490 U JP 6832490U JP H0426552 U JPH0426552 U JP H0426552U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- die
- punch
- bending device
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 4
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図乃至第４図は、本考案に係るリード折曲
装置の第１の実施例を示す異なる状態の断面図、
第５図は第２の実施例を示す断面斜視図である。
第６図は電子部品の一例を示す斜視図、第７図及
び第８図は従来のリード折曲装置の断面図、第９
図は課題を説明するための断面図、第１０図は別
の課題を説明するための一部平面図である。
１……電子部品、２……外装部、３……リード
、３ａ……中間部、３ｃ……基端部、４……テー
ブル、７……パンチ、８……ダイ。
1 to 4 are cross-sectional views of a first embodiment of the lead bending device according to the present invention in different states;
FIG. 5 is a cross-sectional perspective view showing the second embodiment.
FIG. 6 is a perspective view showing an example of an electronic component, FIGS. 7 and 8 are sectional views of a conventional lead bending device, and FIG.
The figure is a sectional view for explaining the problem, and FIG. 10 is a partial plan view for explaining another problem. 1... Electronic component, 2... Exterior part, 3... Lead, 3a... Middle part, 3c... Base end part, 4... Table, 7... Punch, 8... Die.
Claims (1)
端部を支持するダイと、上記リードの中間部のダ
イに沿つて折曲させるパンチとを具備したリード
折曲装置において、 上記ダイとパンチの互の水平方向の間隔をリー
ドの厚さに対応して可変にしたことを特徴とする
リード折曲装置。[Claims for Utility Model Registration] A lead bending device comprising a die that supports the base end of a lead led out from the side surface of an electronic component's exterior, and a punch that bends the lead along the die in the middle of the lead. A lead bending device characterized in that the horizontal distance between the die and the punch is variable in accordance with the thickness of the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6832490U JPH0426552U (en) | 1990-06-26 | 1990-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6832490U JPH0426552U (en) | 1990-06-26 | 1990-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426552U true JPH0426552U (en) | 1992-03-03 |
Family
ID=31602664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6832490U Pending JPH0426552U (en) | 1990-06-26 | 1990-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426552U (en) |
-
1990
- 1990-06-26 JP JP6832490U patent/JPH0426552U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH029446U (en) | ||
| JPS58152398U (en) | Pressing mold | |
| JPH0459952U (en) | ||
| JPH0295251U (en) | ||
| JPH02132971U (en) | ||
| JPS6373947U (en) | ||
| JPS6351431U (en) | ||
| JPH029447U (en) | ||
| JPS61127820U (en) | ||
| JPH0356565U (en) | ||
| JPS6389673U (en) | ||
| JPS5836816U (en) | accessories | |
| JPS60105785U (en) | door | |
| JPS61168646U (en) | ||
| JPS59194341U (en) | Press bend type product release device | |
| JPS6442726U (en) | ||
| JPH02104671U (en) | ||
| JPH02115408U (en) | ||
| JPS63152435U (en) | ||
| JPH0362625U (en) | ||
| JPS6298226U (en) | ||
| JPH02129676U (en) | ||
| JPH02110362U (en) | ||
| JPH0197572U (en) | ||
| JPH01114119U (en) |