JPH0459952U - - Google Patents

Info

Publication number
JPH0459952U
JPH0459952U JP1990102391U JP10239190U JPH0459952U JP H0459952 U JPH0459952 U JP H0459952U JP 1990102391 U JP1990102391 U JP 1990102391U JP 10239190 U JP10239190 U JP 10239190U JP H0459952 U JPH0459952 U JP H0459952U
Authority
JP
Japan
Prior art keywords
lead
punch
forming
die
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990102391U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990102391U priority Critical patent/JPH0459952U/ja
Publication of JPH0459952U publication Critical patent/JPH0459952U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Wire Processing (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例にかかるリード成形
装置の斜視図、第２図ａ〜ｄは何れも第１図に示
すリード成形装置の各作業位置における要部縦断
面図、第３図はパワートランジスタの一例を示す
斜視図である。 １……電子部品（パワートランジスタ）、３，
４，５……リード、１０……リード成形装置、１
２……第１パンチ、１３……第２パンチ、１５…
…支持部、２０，２１，２２……成形面、２３…
…成形面。 FIG. 1 is a perspective view of a lead forming device according to an embodiment of the present invention, FIGS. 2 a to d are longitudinal sectional views of main parts of the lead forming device shown in FIG. 1 at various working positions, and FIG. FIG. 1 is a perspective view showing an example of a power transistor. 1...Electronic components (power transistor), 3,
4, 5...Lead, 10...Lead forming device, 1
2...First punch, 13...Second punch, 15...
...Supporting part, 20, 21, 22... Molding surface, 23...
...molding surface.

Claims (1)

【実用新案登録請求の範囲】 電子部品の側面より導出する複数のリードを所
定の異なる方向に折曲するリード成形装置であつ
て、 電子部品のリードを挟持すると供にダイを兼ね
る支持部と、各リードの折曲方向に対応して傾斜
する成形面を有する第１パンチと、該第１パンチ
で所定の方向に傾斜して仮折曲された各リードを
ダイに押圧して所定の形状に成形する成形面を有
する第２パンチとを具備することを特徴とするリ
ード成形装置。[Claims for Utility Model Registration] A lead forming device that bends a plurality of leads led out from the side surface of an electronic component in different predetermined directions, the device comprising: a support part that holds the leads of the electronic component and also serves as a die; A first punch having a forming surface that slopes in accordance with the bending direction of each lead, and presses each lead tentatively bent in a predetermined direction with the first punch to a die to form a predetermined shape. A lead forming apparatus comprising: a second punch having a forming surface for forming the lead.
JP1990102391U 1990-09-28 1990-09-28 Pending JPH0459952U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990102391U JPH0459952U (en) 1990-09-28 1990-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990102391U JPH0459952U (en) 1990-09-28 1990-09-28

Publications (1)

Publication Number Publication Date
JPH0459952U true JPH0459952U (en) 1992-05-22

Family

ID=31846610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990102391U Pending JPH0459952U (en) 1990-09-28 1990-09-28

Country Status (1)

Country Link
JP (1) JPH0459952U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013000795A (en) * 2011-06-22 2013-01-07 Yazaki Corp Method and device for working metal lead wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013000795A (en) * 2011-06-22 2013-01-07 Yazaki Corp Method and device for working metal lead wire

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