JPH04266099A - Nozzle and method for sucking electronic component - Google Patents

Abstract

PURPOSE:To provide an electronic component suction nozzle and a sucking method for an electronic component for holding stability of sucking the component when the component is reduced in size and fed at a high speed in the nozzle and the method for sucking the component particularly in an electronic component mounting apparatus. CONSTITUTION:A component suction nozzle 10 having a component upper surface pressing pin 11 to be brought into contact with an upper surface of a component to press it in a pressure reducing port 10a at its end, and a sucking method for an electronic component having steps of bringing the pin into contact with the upper surface of the component 2 and pressing it.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to a component suction nozzle and a component suction method, and particularly to an electronic component mounting apparatus.
The present invention relates to a component suction nozzle for suctioning electronic components and a component suction method.

0002

[Background Art] Currently, as the electronic component mounting field expands and mounting equipment becomes more accurate and faster, electronic components (hereinafter referred to as components) are required to be smaller, more lightweight, and more multifunctional. . With the miniaturization of components and the increase in speed of mounting equipment, the biggest challenge is how to supply components stably and
And how to handle it properly. Next, a method of picking up parts using a conventional parts picking nozzle will be explained. In FIG. 4, 1 is a suction nozzle, 2 is a chip-shaped component, and 3 is a paper tape. (a) shows how the suction nozzle 1 descends toward the upper surface of the component 2. When the lower surface area of the suction nozzle 1 is larger than the component 2 and the component enclosure hole 3a enclosing the component 2, the suction nozzle 1 stops on the upper surface of the paper tape 3. This state is shown in (b). Usually, there is a gap between the upper surface of the component 2 and the lower surface of the suction nozzle 1. (c) shows the moment when the suction nozzle 1 enters the suction state. (d) shows a state in which the suction nozzle 1 that has suctioned the component 2 is raised again and transferred. This figure shows a state in which the component 2 is not properly suctioned.

0003

[Problems to be Solved by the Invention] However, in the conventional suction nozzle 1 described above, when the component 2 is further miniaturized and it is necessary to perform suction operation at high speed,
It is not easy to perform stable and correct adsorption. In other words, although FIG. 5 shows a component supply device that tactically feeds the components 2 one by one to the suction position, in order to perform the suction operation of the components 2 at high speed, it is necessary to increase the feeding speed in the direction of the arrow in the figure. increases. In the figure, 2 is a component and 3 is a paper tape. 4 is a tape holder that holds down the paper tape 3;
is a top tape that covers the part 2 on the upper surface of the paper tape 3 until the part is adsorbed. 6 is a winding wheel that winds up the top tape 5. When the feed speed in the direction of the arrow in the figure increases as the speed of the device increases and the component 2 becomes smaller, the behavior of the component 2 in the component enclosure hole 3a increases accordingly, as shown in FIG. There is a high possibility that the product will be adsorbed in an incorrect posture. In particular, since the upper surface of the component 2 is in an open state at the suction position, there is a possibility that the component 2 may fly out.

SUMMARY OF THE INVENTION The present invention has been made to solve these problems, and an object of the present invention is to provide a component suction nozzle and a component suction method that maintain stability in component suction when components are downsized and transported at high speed. .

[0005]

[Means for Solving the Problems] A component suction nozzle and a component suction method for achieving the above object are a component suction nozzle for suctioning and transferring components by vacuum suction, the tip of the component suction nozzle being A component top surface pressing pin that contacts the top surface of the component and presses the top surface of the component is provided in the pressure reduction port of the component. It has a step of coming into contact with the upper surface and pressing the upper surface of the component.

[0006]

[Operation] According to the component suction nozzle and component suction method of the present invention, with this configuration, the component top surface pressing pin provided in the pressure reducing port at the tip of the component suction nozzle is brought into contact with the top surface of the component before the component suction process. By pressing and suppressing the vibration of the parts, the parts transferred at high speed can be correctly picked up.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A component suction nozzle and a component suction method according to an embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, 10 is a component suction nozzle; 11 is a component suction nozzle;
12 is a hook, 13 is a pin, and 14 is a spring, which urges the component top surface pressing pin 11 downward. The hook 12 can be rotated by a pin 13,
Before picking up the component 2, the hook 12 is released in order to lower the component top surface pressing pin 11 to the state shown by the dashed line shown in FIG.
It deviates from a. When picking up the part 2, the part top surface pressing pin 11 is pushed upward again, and the hook 12 is again engaged with the notch 11a at the height of the push up to the solid line part in FIG. Become.

FIG. 2 shows the flow of this series of operations. In FIG. 2, (a) shows that the component suction nozzle 10 starts to descend, and at this time, the tip of the component pressing pin 11 is located below the lower surface of the component suction nozzle 10. (b)
The lower surface of the component suction nozzle 10 is in contact with the upper surface of the paper tape 3, and the tip of the component pressing pin 11 is pressing the upper surface of the component 2. (c) The lower surface of the component suction nozzle 10 comes into contact with the upper surface of the paper tape 3, the tip of the component pressing pin 11 is pushed upward into the pressure reducing port 10a of the component suction nozzle 10, and the component 2 is moved against the lower surface of the component suction nozzle 10. is adsorbed under reduced pressure. (d) The component suction nozzle 10 is pushed upward while the component 2 is being suctioned under reduced pressure.

As shown in FIG. 2, the component top surface pressing pin 11 presses the top surface of the component 2 before picking up the component, so that no matter what state the component is in inside the component insertion hole 3a, it will be corrected to the correct posture when being picked up. has been done. Therefore, there is an effect that suction defects such as so-called vertical suction and suction errors are eliminated.

Next, an application example in which the component suction nozzle of this embodiment is used in an electronic component mounting apparatus will be described.

In FIG. 3, reference numeral 14 denotes a component supply table, which fixes and holds the component supply device 15 and can be driven to position it so as to supply a predetermined component. 16 is a head that performs intermittent rotational motion. Reference numeral 10 denotes a component suction nozzle of this embodiment, which has the configuration described in the previous embodiment. The component suction nozzle 10 is attached to the periphery of the head 16 so as to be rotatable and movable up and down. 17 is a printed circuit board, which is supported by an X-Y table 18 that moves in the X-Y direction. 2 is a component, and 19 is an attitude regulating device for regulating the attitude of the component 2.

The operation of the electronic component mounting apparatus constructed as described above will be explained below. First, parts supply device 1
The component suction nozzle 10 with the component 2 attached from 5 is the head 1.
It moves to the mounting position by the intermittent rotational movement of 6. During this movement, the posture adjustment device 19 sets the posture of the component 2 in the correct posture, and the X-Y table 18 is positioned so that the predetermined position of the printed circuit board 17 matches the mounting position.
Next, the suction nozzle 10 descends and the electronic component 2 is mounted on the printed circuit board 17.

[0014]

[Effects of the Invention] As is clear from the above description of the embodiments,
According to the component suction nozzle and component suction method of the present invention,
The component upper surface pressing pin installed in the decompression port at the tip of the component suction nozzle presses the component before it is suctioned, and the component remains in the suction state, so even if the component vibrates within the component insertion hole of the paper tape, This is effective in improving the reliability of the equipment because it prevents this and enables correct adsorption.

[Brief Description of the Drawings] [Fig. 1] (a) is a partially cutaway perspective view showing the internal configuration of an electronic component suction nozzle according to an embodiment of the present invention; (b) is a longitudinal cross-sectional view of the same;
FIG. 2 is a schematic diagram showing an electronic component suction process of an electronic component suction nozzle according to an embodiment of the present invention; FIG. 3 is a perspective view showing an electronic component mounting apparatus using the electronic component suction nozzle of the present invention; FIG. Schematic diagram showing the electronic component suction process of a conventional electronic component suction nozzle [FIG. 5] A perspective view showing a conventional electronic component supply device [Explanation of symbols] 10 Component suction nozzle 10a Decompression port 11 Component top surface pressing pin

Claims (2)

[Claims] 1. A component suction nozzle for suctioning and transporting electronic components by vacuum suction, wherein a component is placed in a vacuum port at the tip of the component suction nozzle and contacts the top surface of the component and presses the top surface of the component. Electronic component suction nozzle equipped with a top pressing pin. 2. A component suction method in which electronic components are suctioned and transferred by vacuum suction, wherein, before the component suction process,
An electronic component suction method comprising a step of bringing a component top surface pressing pin provided in a pressure reduction port at the tip of a component suction nozzle into contact with the top surface of the component and pressing the component top surface.