JPH0427172Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an improvement of a plug-in type semiconductor device housing package for housing a semiconductor device.

[Conventional technology]

Conventionally, a plug-in type semiconductor device storage package for storing semiconductor devices, especially semiconductor integrated circuit devices, is made of an electrically insulating material such as ceramics, and a semiconductor device is placed approximately in the center of the top surface of the package, as shown in FIG. an insulating base 11 having a recess for accommodating an element and a metallized metal layer 12 made of metal powder such as tungsten (W) or molybdenum (Mo) derived from the periphery of the recess to the bottom surface;
It is composed of a large number of external lead pins 13 and a lid body 14 attached to the metallized metal layer 12 through a brazing material such as silver solder in order to electrically connect the semiconductor element to an external circuit. The semiconductor element 15 is housed and hermetically sealed to form a semiconductor device.

Further, on the bottom surface of the insulating base 11, the semiconductor element 1
A copper-iron alloy (Cu-
A heat sink 16 made of Fe) or the like is attached.
The heat sink 16 absorbs heat generated by the semiconductor element 15 during operation and releases it into the atmosphere, thereby effectively preventing thermal damage to the semiconductor element 15 or thermal deterioration of its characteristics.

In addition, in this conventional plug-in type semiconductor device storage package, in order to firmly braze the external lead pins 13 to the metallized metal layer 12,
The exposed outer surface of the metallized metal layer 12 to which the external lead pin 13 is attached is coated with nickel (Ni), which has good wettability with brazing material, by a plating method.

[Problem that the invention aims to solve]

However, since this conventional plug-in type package for housing semiconductor devices has a large-area heat sink attached to the bottom of the insulating base, the area where external lead pins can be attached is small. When the number of external lead pins increases rapidly in response to the increase in the number of electrodes on semiconductor devices as semiconductor devices become more dense and highly integrated, the bottom surface of the insulating substrate 11 is made extremely large to increase the number of external lead pins. This has the disadvantage that the mounting area must be increased, and as a result, the shape of the package housing the semiconductor element becomes extremely large. Furthermore, the electric circuit board on which this plug-in type semiconductor element storage package is mounted must inevitably become large, which also has the disadvantage that it becomes unusable in electronic devices that are becoming smaller. .

[Purpose of invention]

The present invention was devised in view of the above-mentioned drawbacks, and its purpose is to effectively absorb and remove the heat generated by the semiconductor elements housed inside, thereby preventing the semiconductor elements from being thermally destroyed.
It is an object of the present invention to provide a small plug-in type semiconductor device housing package that can completely eliminate thermal deterioration of characteristics.

[Means for solving problems]

The present invention provides a plug-in type semiconductor device storage package comprising a plurality of external lead pins attached to the bottom of an insulating container having a cavity for mounting and storing semiconductor devices therein. It is characterized in that at least the external lead pin located below is formed of a metal having a thermal conductivity of 0.6 cal/sec·°C or more.

〔Example〕

Next, the present invention will be explained in detail based on the embodiment shown in the attached FIG. 1.

FIG. 1 shows an embodiment of the plug-in type semiconductor device storage package of the present invention, in which 1 is an insulating base made of an electrically insulating material such as alumina ceramics, and 2 is a lid also made of an electrically insulating material. . This insulating base 1 and lid 2 constitute an insulating container.

The insulating substrate 1 has a recessed portion in the center of its upper surface for accommodating a semiconductor element, and a semiconductor element 3 is attached to the bottom surface of the recessed portion through an adhesive.

Further, a metallized metal layer 4 is formed on the insulating substrate 1 from the periphery of the recess to the bottom surface,
The electrodes of the semiconductor element 3 are electrically connected to the periphery of the concave portion of the metallized metal layer 4 via wires 5, and external lead pins 6 are brazed to the bottom surface of the base 1 via a brazing material.

The insulating substrate 1 and the metallized metal layer 4 can be made by preparing a plurality of raw ceramic sheets, for example, and applying a metallizing paste made of metal powder such as tungsten on the upper surface of each raw sheet and in the through holes formed in the raw sheet using a thick film method. They are formed by printing and coating them, then laminating them and sintering them into one piece.

The external lead pins 6 attached to the bottom surface of the insulating base 1 function to connect the semiconductor element 3 housed inside to an external circuit, and the external lead pins 6 can be inserted and connected to a socket or the like provided in the external circuit. As a result, the semiconductor element 3 housed inside is connected to an external circuit via the metallized metal layer 4 and external lead pins 6.

Further, the outer surface of the metallized metal layer 4 on the bottom surface of the insulating substrate 1 is coated with a metal such as nickel (Ni), which has excellent wettability with brazing material, by a plating method in order to firmly braze the external lead pins 6. It is worn.

Thus, according to the plug-in type semiconductor device storage package of the present invention, the semiconductor device 3 is attached and fixed to the bottom surface of the recess of the insulating substrate 1, and each electrode of the semiconductor device 3 is connected to the metallized metal layer 4 by the wire 5. After this, the insulating base 1 and the lid 2 are attached using a sealing member such as glass or resin, thereby airtightly sealing the semiconductor element 3 therein, thereby forming a semiconductor device.

In the present invention, among the external lead pins attached to the bottom of the insulating container, those located below at least the internal cavity of the insulating container have a thermal conductivity of 0.6 cal/
It is important to form it with a metal with a temperature of cm・sec・℃ or higher. Therefore, in the embodiment shown in FIG. 1, Cu99.15wt% - Cd0.85wt%, Cu99.05wt%
%-Cr0.85wt%-Si0.1wt%, Cu99.85wt%-
Zr0.15wt%, Ag95wt% - Cu5wt%, Ag10wt%
-Thermal conductivity of Cu90wt% etc. is 0.6Ccal/cm・sec・
An external lead pin 6a made of metal with a temperature of 0.degree. C. or higher is attached. Among the external lead pins attached to the bottom of the insulating container, those located below the cavity where the semiconductor element is housed have a high thermal conductivity.
When made of metal with a temperature of 0.6cal/cm・sec・℃ or higher, the external lead pins can effectively absorb and remove the heat generated by the semiconductor element, making it unnecessary to attach a heat sink and making the plug-in type package for storing semiconductor elements smaller. can be done.

Note that the external lead pins are Cu-Cd, Ag-Cu.
It is formed by forming a metal such as into a predetermined shape by a conventionally well-known metal processing method (press molding method).

[Effect of idea]

According to the plug-in type package for housing semiconductor devices of the present invention, the external lead pins located below at least the cavity of the container among the external lead pins attached to the insulating container have a thermal conductivity of 0.6 cal/cm.
Since it is made of metal with a temperature of sec/°C or higher, the heat generated by the semiconductor element housed inside the insulating container is well absorbed and removed by the external lead pins, thereby preventing thermal damage or thermal deterioration of the characteristics of the semiconductor element. There is nothing.

In addition, the external lead pin absorbs the heat of the semiconductor element,
Since the heat dissipation plate is removed, a heat sink for absorbing and removing heat from the semiconductor element is not required at all, and the plug-in type semiconductor element housing package can be made smaller.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of a plug-in type semiconductor device storage package according to the present invention, and FIG. 2 is a sectional view of a conventional plug-in type semiconductor device storage package. 1... Insulating base, 2... Lid, 6... External lead pin.

Claims (1)

[Scope of utility model registration request] In a plug-in type semiconductor device storage package comprising a plurality of external lead pins attached to the bottom of an insulating container having a cavity for mounting and storing semiconductor devices therein, at least below the internal cavity of the insulating container. The thermal conductivity of the external lead pin located
A plug-in type semiconductor device storage package characterized by being made of metal with a temperature of 0.6 cal/cm/sec/°C or higher.