JPH04279014A - Composite parts - Google Patents

Abstract

PURPOSE:To combine electric parts to small-sized high-performance composite electric parts without deteriorating the characteristic of each parts by putting a plurality of kinds of baked electric parts upon another and fixing the parts to each other with a bonding agent by the overlapping surfaces. CONSTITUTION:Inductance parts 11 and capacitor parts 12 respectively have blocked structures each of which contains a plurality of elements and are individually baked at temperatures meeting the material of a ferrite section 13 or dielectric ceramic section 14. A projecting section 21 and recessed section 22 in which the section 21 is put are respectively formed on the overlapping surfaces of the parts 11 and 12 and, after a bonding agent 17 is printed in the section 22, the section 21 is put in the section 22 and both parts 11 and 12 are stuck to each other by means of the bonding agent 17 printed in the section 22. Therefore, the adhesion between both parts 11 and 12 can be improved and small-sized high-performance composite electronic parts can be formed.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite component in which a plurality of types of electronic components are integrated into a block.

0002

2. Description of the Related Art An LC filter, which is a combination of an inductance component and a capacitor component, is known as a composite component in which a plurality of types of electronic components with different functions are combined and integrated.

In the conventional LC filter, as shown in FIGS. 5 and 6, a circuit is formed by soldering an inductance component 4 onto the electrode 2 of a capacitor component 3, which has electrodes 2 on both sides of a dielectric substrate 1. As shown in FIG. 7, there is known a chip type in which an inductance component 5 made of blocks of a plurality of elements and a capacitor component 6 similarly made into blocks are stacked and co-fired.

0004

[Problem to be solved by the invention] By the way, the former LC
The problem with filters is that they are large in size and cannot be included in small sets.

[0005] The latter chip-type LC filter has the advantage that it can be made smaller in size, but has a problem that it has poor characteristics and cannot be used as a high-performance filter compatible with SMD.

This is because the ferrite part 7 of the inductance component 5 and the dielectric material 8 of the capacitor component 6 are made of different ceramic materials, and when they are stacked and fired at the same time, diffusion occurs between the ceramics, which causes the inductance to increase. This is thought to be due to deterioration of the characteristics of component 5 and capacitor component 6.

SUMMARY OF THE INVENTION Therefore, it is an object of the present invention to provide a compact and high-performance composite component by integrating a plurality of types of electronic components without deteriorating their characteristics.

[0008]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention employs a structure in which multiple types of fired electronic components are stacked one on top of the other, and each electronic component is bonded and fixed on the stacked surfaces. be.

[0009]

[Operation] Since the electronic components to be connected to each other have been fired in advance, if they are bonded and fixed at the overlapping surfaces, a compact and high-performance composite component will be obtained without deteriorating the characteristics of each component.

0010

Embodiments Hereinafter, embodiments of the present invention will be explained based on FIGS. 1 to 4.

FIGS. 1 and 2 show a chip-type LC filter that combines a blocked inductance component 11 and a blocked capacitor component 12.
The inductance component 11 and the capacitor component 12 each have a block structure having a plurality of elements, and are individually fired at a temperature depending on the material of the ferrite part 13 or the ceramic dielectric part 14.

Electrode paste is printed on the surrounding side surfaces of the fired inductance component 11 and capacitor component 12, and side electrodes 15 and 16 are provided in an overlapping arrangement when both components 11 and 12 are overlapped, and each side electrode 15 and 16 are fired, the inductance component 11 and the capacitor component 12 are superimposed on each other, and the adhesive 17 applied to the overlapping surfaces is pressed to bond them together.

The material of the adhesive 17 is not particularly limited, but
For example, if the same electrode paste as silver or the like is used for the side electrodes 15 and 16, there is an advantage that the side electrodes 15 and 16 can be fired at the same time to bond the inductance component 11 and the capacitor component 12.

Further, the application position of the adhesive 17 can be arbitrarily selected as long as it does not come into contact with the side electrodes 15 and 16 as shown in FIG.

In the example shown in FIGS. 3 and 4, there is a convex portion 2 on one side of the overlapping surface of the inductance component 11 and the capacitor component 12.
1 and the other to form a recess 22 into which this projection 21 fits, and after printing adhesive 17 in the recess 22, both parts 11 and 12 are overlapped and the projection 21 and recess 22 are fitted. , both parts 11 and 12 are joined by adhesive 17.

[0016] In this way, when the convex part 21 and the concave part 22 provided on the overlapping surfaces are fitted and bonded at this part,
The adhesive force between both parts 11 and 12 can be improved.

In the illustrated case, the composite component is a chip-type LC block that combines an inductance component 11 and a capacitor component 12, but these components 11 or 1
2 and block resistor parts can be combined to form a composite part of LR or CR.

[0018] The composite component of the present invention has the above-mentioned configuration, and the inductance component 11 and the capacitor component 12, which have been fired into blocks, are bonded and integrated with an adhesive 17 applied to the overlapping surfaces. So both parts 11 and 1
2 can be integrated without applying a temperature higher than that during firing, and therefore a small and high-performance SMD-compatible chip LC filter can be constructed without deteriorating the characteristics of both parts 11 and 12. For example, a 4LC filter can be constructed. A composite part is obtained.

[0019]

[Effects of the Invention] As described above, according to the present invention, multiple types of fired electronic components are stacked one on top of the other and joined together with an adhesive applied to the stacked surfaces, so that the characteristics of each electronic component are not deteriorated. It is possible to form compact, high-performance composite electronic components.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a composite component according to the present invention.

FIG. 2 is an enlarged cross-sectional view of the main parts of the composite component according to the present invention.

FIG. 3 is an exploded perspective view showing another example of the composite component according to the present invention.

FIG. 4 is an enlarged cross-sectional view of main parts showing another example of the composite component according to the present invention.

FIG. 5 is a front view showing a conventional LC filter.

FIG. 6 is a side view of a conventional LC filter.

FIG. 7 is a perspective view showing a conventional chip LC filter.

[Explanation of symbols]

11 Inductance parts 12
Capacitor parts 13 Ferrite part 14 Dielectric part 15, 16 Side electrode 17 Adhesive

Claims (1)

[Claims] 1. A composite component characterized in that a plurality of types of fired electronic components are stacked one on top of the other, and each electronic component is bonded and fixed at the stacked surface.