JPH04280460A - Semiconductor cooler and contact member used for its device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cooling device, and more particularly to a semiconductor cooling device in which a heat sink through which a cooling medium flows is mounted in contact with an LSI chip or the like for cooling.

0002

[Prior Art] Conventional devices include, for example,
As described in Publication No. 441, a metal plate through which a cooling pipe passes is attached to a board via a contact member to which a metallic spring-like member, or a member in the form of a row of fins or a row of pins is attached. Press it against the LSI chip mounted on the tower, and the LS
The heat generated by the I-chip is transferred to the metal plate having the cooling pipe through the contact member for cooling.

Furthermore, as described in Japanese Utility Model Application Publication No. 61-53990, a flexible film (rubber film) containing a coolant is placed between a substrate on which semiconductor components are mounted and a heat sink through which a cooling fluid flows. etc.), and by pressing this pack against the substrate, the heat generated by the semiconductor components is transferred to the cooling fluid side through this pack, and is cooled.

0004

As described above, conventional semiconductor cooling devices utilize the flexibility of contact members or cooling containment packs to improve contact between LSI chips and heat sinks. It is designed to transmit heat to the heat sink side and to enable attachment and detachment of the heat sink and LSI chip, but among the above conventional techniques,
In the one described in Japanese Utility Model Application Publication No. 59-18441, no consideration was given to electrical insulation.

[0005] In other words, LSI chips mounted on a board are often electrically connected to the substrate constituting the board through a large number of thin signal lines, and insulation is strongly required. However, since the metal contact members are in direct contact with the LSI chip, fine powder from the metal contact members may be generated during operation and adhere to the signal wires, weakening the insulation and causing trouble. was there.

[0006] Furthermore, in the method described in Japanese Utility Model Application Publication No. 61-53990, no consideration was given to heat transfer performance and reliability.

[0007] That is, since the pack is constructed of a flexible membrane, often made of rubber, and only refrigerant liquid is sealed inside this container-shaped pack, the efficiency is lower than when no refrigerant liquid is sealed. Generally, the heat transfer performance is good, but since convection occurs throughout the container-shaped pack, as the amount of heat generated in the LSI chip increases, it is necessary to further improve the heat transfer performance. Furthermore, when a rubber-like flexible film is used for a long period of time, it becomes pore-prone due to corrosion caused by the refrigerant, and there is a problem in that the refrigerant liquid tends to flow onto the LSI chip and the substrate.

[0008] The first object of the present invention is to
An object of the present invention is to provide a semiconductor cooling device in which the insulation properties and reliability of a detachable contact member with a semiconductor component such as an SI chip are improved.

[0009] A second object of the present invention is to
An object of the present invention is to provide a semiconductor cooling device in which the heat transfer performance of a detachable contact member with a semiconductor component such as an SI chip is improved.

[0010] A third object of the present invention is to
An object of the present invention is to provide a semiconductor cooling device in which the amount of heat transferred through a contact member installed between an SI chip and the LSI chip is adjusted according to the amount of heat generated by each LSI chip.

Another object of the present invention is to provide a semiconductor cooling device that can set the temperatures of LSI chips of the same type to approximately the same temperature.

[0012] A fourth object of the present invention is to
It is an object of the present invention to provide a semiconductor cooling device which can make contact with an SI chip with flexibility and can appropriately set the pressing force of a contact member installed therebetween.

[0013]

[Means for Solving the Problems] In order to achieve the first object, the semiconductor cooling device of the present invention has a multi-layer pack material of the container-like pack forming the contact, and has a thin metal core as a core material. It has a structure in which an insulating coating is provided on both sides of the core material.

[0014] Also, the pack material of the container-shaped pack is a metal foil, and an insulating resin foil is laminated on both or one side of the metal foil.

In order to achieve the above-mentioned second object, the semiconductor cooling device of the present invention has a container-like pack sealed with a liquid having excellent thermal conductivity, and the upper and lower surfaces of the pack (for example, the upper surface side is connected to a heat sink). , the lower surface side is in the direction of contact with the LSI chip), and a group of metal members are provided inside the pack.

[0016] Also, a pulsation generating mechanism is provided in a portion of the contact member for forcing the fluid in the pack to flow.

[0017] Furthermore, in a pack structure that is relatively thin and wide, such as a pillow, a partition wall is provided in the middle.

In order to achieve the third object, the semiconductor cooling device of the present invention divides the inside of the contact member into a plurality of regions according to the difference between each LSI chip when a plurality of LSI chips are mounted. However, a partition wall is provided to form that area.

Further, regions are provided in the contact member according to the amount of heat generated by each LSI chip, and partition walls are provided so that convection occurs within the regions.

Furthermore, a single pack is provided for each LSI chip.

In order to achieve the fourth object, when a plurality of LSI chips of different heights are mounted, the semiconductor cooling device of the present invention has a structure in which a plurality of LSI chips are arranged inside the contact member according to the heights of the LSI chips. A partition wall is provided in the area to divide the area, and a part of the area is connected.

[0022] Also, a pressure adjustment part is provided in a part of the contact member.

[0023] Furthermore, the metal members provided within the contact member are provided with spring properties.

[0024]

[Operation] The contactor of the present invention is installed between a heat sink having a flow path through which relatively low-temperature fluid flows and a plurality of LSI chips mounted on one board, and heat generated within the LSI chip is is transmitted to the heat sink side via the contact.

First, the heat flow path will be explained. L.S.
The I-chip contains many semiconductor elements and generates heat during operation. This heat is transferred to the contact side through thermal conduction within the LSI chip made of silicon or the like. The bottom surface of the contact and L
Strictly speaking, the contact part with the SI chip is not a complete contact,
Gas or liquid exists in minute gaps, and the thermal resistance when heat is transferred through these gaps is large. The heat is then conducted through the thick part of the lower surface of the contact, and then through the liquid sealed inside the contact. When heat is transmitted through this liquid, heat is transferred by conduction if the liquid is not moving, and by convective heat transfer if there is convection. Heat transfer efficiency is higher in the case of convection heat transfer. Further, the heat is transferred to the heat sink side through heat transfer through the upper surface of the contact and the contact portion between the upper surface and the heat sink.

In the semiconductor cooling device of the present invention, firstly, the container-shaped pack forming the contact member has a multilayer structure, a thin metal material is provided as the core material, and an insulating coating is provided on both or one side of the core material. Alternatively, the pack material is made of metal foil and insulating resin foil is laminated on both or one side of the metal foil.
The insulating coating provides insulation to signal lines, etc., and improves corrosion resistance.

Second, since the container-shaped pack is filled with a liquid with excellent thermal conductivity and metal members are provided that face the upper and lower surfaces of the pack, the upper and lower surfaces of the contact members are connected by the metal members. The heat transfer from the bottom surface of the pack to the top surface of the pack is conducted not only through the sealed liquid portion but also through the metal member portion. Since the thermal conductivity of metal generally has a high value, heat transfer efficiency is increased by providing a metal member.

Furthermore, since a part of the contact member is provided with a pulsation generating mechanism for forcing the fluid in the pack to flow, convective heat transfer is promoted and heat transfer efficiency is improved.

[0029] Furthermore, in a pack structure that is relatively thin and wide, partition walls are provided in the middle, so convection with high heat transfer efficiency can be generated locally, so that it is possible to The heat transfer efficiency can be increased.

Thirdly, since partition walls are provided in areas within the contact member according to the differences in the amount of heat generated by the LSI chips, in areas where the amount of heat generated is large, local convection heat transfer is carried out in accordance with each area. This allows the amount of heat transferred to be adjusted.

Furthermore, by providing the partition wall, temperature differences do not occur over a wide range, but are limited locally, so that the temperatures of the LSI chips can be set to approximately the same temperature.

Fourth, when a plurality of LSI chips of different heights are mounted on the board, the inside of the contact member is divided into a plurality of regions according to the heights of the LSI chips by providing partition walls,
Since a part of the structure is connected, even if the height of the LSI chip is different, it is possible to use a contact member according to the height.Since each divided part is connected, the pressure is equalized and the contact member is connected to the bottom of the contact member. - It is possible to prevent the pressing force against the LSI chip on the board from becoming excessive.

Furthermore, since a pressure adjustment section is provided in a part of the contact member, the pressing force of the contact member against the LSI chip on the board can be adjusted, so that the pressing force can be optimized.

[0034] Also, since the metal members provided within the contact member have spring properties, the spring force can be adjusted.
The pressing force against the LSI chip can be optimized. Also, since it has flexibility, it can absorb the high irregularity of multiple LSI chips. In addition, since the metal member has a spring-like mechanism,
The metal member functions to press the top surface of the pack toward the heat sink and the bottom surface of the pack toward the LSI chip. Therefore, between the top of the pack and the heat sink, and between the bottom of the pack and the LSI.
The contact thermal resistance between the chips is reduced, increasing the heat transfer efficiency here.

[0035]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention is shown in FIGS. 1 to 11. FIG. 1 shows an overall configuration diagram of a semiconductor cooling device according to the present invention. An LSI chip 7 is arranged on a board 6, and a platter 53 is attached to sandwich both sides of the board 6. A heat sink 8 is disposed above the LSI chip 7 via a contact member 1 in which a liquid 5 is sealed in a pack 2, and within this heat sink 8, for example, a flow path 55 having fins 54 inside is arranged. It has a structure in which cooling water 9 flows therethrough for cooling. Bolt holes 56 are provided on the end surface side of the heat sink 8, and the contact member 1 is pressed against the LSI chip 7 by screwing the heat sink 8 to the platter 53 using bolts 57.

Here, considering that the LSI chips 7 often have different heights, the contact member 1 can be adjusted by changing the thickness of the contact member 1 to eliminate large height differences. The relatively small difference in height can be accommodated in the following way. Further, the surface of the contact member 1 on the heat sink 8 side is formed flat, and the heat sink 8 is pressed and fixed against this surface.

That is, the packs 2a and 2b are communicated with each other through a refrigerant passage 48, and a pressure adjustment section 36 is provided in a portion of the pack 2 or the refrigerant passage 48. Since fluid is sealed in the pack 2 and the refrigerant passage 48, the pressure adjustment section 3
6, the pressure is adjusted to an appropriate value, and the pack 2 is deformed and pressurized with uniform pressure, making it possible to uniformly contact the LSI chip 7 and the heat sink 8 with a weak force. Note that the pressure adjustment section 36 can be omitted if necessary.

On the other hand, the heat sink 8 has two cooling water pipes 58 and 59 provided with flexible portions 58a and 59a.
The heat sink 8 is connected to a cooling supply device 60 via a cooling water supply device 60, and is configured to supply and discharge cooling water 9 to and from the heat sink 8. That is, the cooling supply device 60 typically includes a water pump 61, a water tank 62, and a chiller 63, and the water heated by the heat sink 8 is supplied to the cooling water pipe 5.
8, is sent to the cooling supply device 60, is cooled by the chiller 63, and is sent to the cooling water pipe 5 by the water pump 61.
9 and flows out to the heat sink 8 side again to cool the heat sink 8, and the LSI that generates heat when the semiconductor device is operated.
The chip 7 is cooled.

Here, the heat sink 8 and the cooling supply device 6
Since the heat sink 8 is connected to the heat sink 8 by a cooling water pipe 59 via a flexible portion 58, the heat sink 8 can be easily removed from the board 6 on which the LSI chip 7 is mounted by removing the bolts 57. .

Next, each embodiment of the contact member 1 will be explained with reference to FIGS. 2 to 11.

FIG. 2 shows a pack 2 of the contact member 1 of this embodiment.
A perspective view of either one of a or 2b is shown, and FIG. 3 is a cross-sectional perspective view of the pack 2 shown in FIG. 2.

[0042] Inside the pack 2, a liquid 5 such as thermally conductive grease, thermally conductive silicone oil, or Fluorinert liquid is sealed. Also, the materials for pack 2 are:
For example, use is made of aluminum foil laminated with a thin film of insulating resin on both sides. Examples of the resin to be laminated into a film include polyethylene, polypropylene, etc., but a material with excellent corrosion resistance is selected depending on the type of liquid to be sealed in the pack. The ends of the pack top surface 3 and the pack bottom surface 4 are each closed to allow the filling liquid 5 to be held. With this configuration, the heat transfer performance based on heat conduction within the pack 2 is improved because the sealed liquid 5 with good thermal conductivity, such as thermally conductive grease, thermally conductive silicone oil, or Fluorinert liquid, is used. do. In addition, the pack 2 has excellent insulation properties because it is made of aluminum foil with a thin film of insulating resin laminated on both sides. Additionally, since aluminum foil is used, it is strong and has improved corrosion resistance.

Next, examples of application aimed at further improving the heat transfer performance of the contact member 1 are shown in FIGS. 4 to 11, respectively.

FIG. 4 is a cross-sectional perspective view of the contact member 1.
In this application example, a cylindrical metal coil 10 made of thin metal wire is inserted into the pack 2 along the top surface 3 of the pack. Here, a part of the metal coil 10 is connected to the top surface 3 of the pack with contact points 11 so as to improve heat transfer.
The other part is configured to be in contact with the lower surface 4 of the pack at contact points 12, respectively. That is, since heat is transferred from the pack lower surface 4 side to the pack upper surface 3 side, by configuring the metal coil 10 to be in contact with the pack upper surface 3 and lower surface 4 by bonding or the like, the contacts 11,
This is because heat conduction of 12 parts is promoted. On the other hand, since the metal coil 10 is highly elastic, the contact member 1 is
When pressed between the I-chip 7 and the heat sink 8, the metal coil 10 pushes the top surface 3 of the pack against the heat sink 8.
A force is generated to press the pack lower surface 4 toward the LSI chip 7 side. In this way, the thermal resistance between the pack top surface 3 and the heat sink 8 and between the pack bottom surface 4 and the LSI chip 7 is reduced, and heat transfer performance can be improved. Note that the metal coil 10 may be inserted into the pack 2 together with the filler liquid 5. FIG. 5 is a cross-sectional perspective view of the contact member 1 showing another application example. In this application example, a metal coil 13 made of thin metal wire and wound in a cylindrical shape is placed inside the pack 2 on the upper surface of the pack 3.
It is inserted so that it is almost perpendicular to. metal coil 13
is configured such that one end thereof is in contact with the pack upper surface 3 and the other end thereof is in contact with the pack lower surface 4 at contact points 14 and 15, respectively. The heat generated in the LSI chip 7 is transmitted through the sealed liquid 5 in the contact member 1 and the metal coil 13 by conduction. Therefore, the heat transfer efficiency will be improved if the contacts 14 and 15 are configured to be in contact with each other by bonding or the like. In this case, since the metal coil 13 is inserted almost perpendicularly to the pack top surface 3, the contact area of the contacts 14 and 15 is
The metal coil 13 is larger than in the case of the application example shown in FIG.
The number of can be reduced. In addition, the metal coil 13
may be inserted into the pack 2 together with the filling liquid 5.

FIG. 6 is a cross-sectional perspective view of the contact member 1 showing still another example of application. It is inserted along with 5. In this case as well, the contact point 1 where the metal scrubbing brush 16 touches the pack top surface 3 and the pack bottom surface 4
By joining the portion 7, good heat transfer can be maintained. In the case of this structure, the metal scrubbers 16 can be inserted into the pack 2 relatively randomly, making manufacturing easier.

FIG. 7 is a cross-sectional perspective view of the contact member 1 showing yet another application example. In this application example, fins 18 made of thin metal wire and continuously bent into a mountain shape are attached to the pack upper surface 3 and the pack lower surface. It is inserted into pack 2 so as to be in contact with 4. Here, the contacts 19 and 20 in the portions that are in contact with the pack top surface 3 and the pack bottom surface 4 may be thin metal wires,
It may be a metal plate. In this case as well, contacts 19, 2
0 is preferably joined to the pack upper surface 3 and the pack lower surface 4, respectively. Since the fins 18 made of thin metal wires are regularly arranged and have high elasticity, the pack upper surface 3 and the pack lower surface 4 are pressed against the heat sink 8 and the LSI chip 7, thereby improving heat transfer efficiency.

FIG. 8 is a cross-sectional perspective view of the contact member 1 showing still another application example. In this application example, a finned plate 21 is provided with a large number of regularly arranged metal plates 22 bent in a U-shape. A large number of them are lined up and inserted into the pack 2 together with the filling liquid 5. In this case as well, the pack upper surface 3 and the fin 22 and the pack lower surface 4 and the base plate 25 contact at the contact points 23 and 24. When these contacts 23 and 24 are joined together, the heat transfer efficiency improves.

FIG. 9 shows a contact member 1 showing still another example of application.
In this application example, a large number of thin metal wires 2
6 bound together with, for example, a rubber-like resin 27, is inserted into the pack 2 together with the filling liquid 5. Both ends of the thin metal wire 26 are in contact with the pack upper surface 3 and the pack lower surface 4 at contact points 28 and 29. Bonding this part improves heat transfer efficiency.

FIG. 10 is a longitudinal cross-sectional view of the contact member 1 showing still another example of application. In this example of application, the top surface 3 of the pack
A plurality of pins 30 are joined to the side, and a metal scrubber 31 is provided inside the pack 2 on the pack lower surface 4 side, and when the pack 2 is formed, the tips of the pins 30 are inserted into the metal scrubber 31. shall be. In this case, the pin 30 and the metal scrubber 31 are in thermal contact while maintaining flexibility.

FIG. 11 is a longitudinal cross-sectional view of the contact member 1 showing yet another example of application. In this example of application, the top surface 3 of the pack
A large number of pins 30 are provided on the pack, and a perforated plate 33 having a large number of holes 32 is attached to the lower surface 4 of the pack. The large number of pins 30 and the large number of holes 32 correspond to each other so that they can be inserted. When forming the pack 2, the pin 30 is inserted into the pack 2 together with the filler liquid 5 with the pin 30 inserted into the hole 32. In this way, the pin 30 and the hole 32 can be in thermal contact while remaining flexible.

Another embodiment of the present invention will be explained with reference to FIGS. 12 to 16. 12 is a perspective view showing a state in which the contact member 1 is sandwiched between the substrate 6 and the heat sink 8, FIG. 13 is a side view of the assembled state shown in FIG. 13 viewed from the lateral direction, and FIG. FIG. 15 is a perspective view of a contact member 1 for guiding heat generated in an LSI chip to a heat sink. FIG. 15 is a longitudinal sectional view showing the structure of a heat conductive film 39 used in the contact member 1.

As shown in FIGS. 12 and 13, the semiconductor cooling device of this embodiment has a substrate 6 on which an LSI chip 7 is mounted.
The contact member 1 consisting of the heat transfer pack 2 is placed between the heat sink 8 and the heat transfer pack 2, and the end portions are clamped and fixed with clamps 38 in order to stabilize the heat transfer performance. Board 6
A plurality of large and small LSI chips 7 are arranged, and the height of each LSI chip 7 from the substrate 6 is approximately the same, and the contact surface of the heat transfer pack 2 is flat. Further, the contact member 1 is provided with a pressure adjustment section 36 in addition to the heat transfer section 34 that contacts the LSI chip 7 and the heat sink 8 . Then, the pressure adjustment part 36 is
The internal pressure of the contact member 1 is increased to bring the heat transfer portion 34 of the heat transfer pack 2 into close contact with the LSI chip 7 and heat sink 8 mounted on the substrate 6. In such a mounted state, the pressing force against the LSI chip 7 can be easily changed by changing the spring constant of the pressure retaining spring 37 attached to the pressure adjustment section 36. In addition, another function of the pressure adjustment section 36 is to serve as a reservoir for gas that is simultaneously enclosed when a heat transfer medium such as grease or liquid is enclosed inside the contact member 1, and serves as a reservoir between the substrate 6 and the heat sink 8. Installed pack 2
This allows the heat transfer medium inside to efficiently transfer heat.

Here, as an example, the substrate 6 is 220
A case will be described in which a size of mm x 130 mm x 2 mm is used. Thirty LSI chips 7 with a heat output of 3 W/chip are mounted on the board 6, and power is supplied to the LSI chips 7 mounted on the board 6 at the lower part of FIG. 12 (pressure adjustment, although not shown). This is done by a connector installed on the opposite end face of the section 36. The heat transfer pack 2 is placed in the center of the back side of the mounting surface of the LSI chip 7.
In order to prevent the board 6 from deforming due to the force applied to the board 6 via the LSI chip 7 when the internal pressure is increased to bring it into close contact with the LSI chip 7, a reinforcing member 46 with a cross section of 3 mm x 10 mm is provided. Note that this reinforcing member 46 may not be provided if the shape of the substrate 6, that is, the size and thickness of the substrate 6, causes little deformation of the substrate 6. Further, the contact member 1 has a pressure adjustment section 3.
The size is almost the same as the substrate except for the size 6. The pressure adjustment section 36 has a size of 40 mm x 25 mm,
The 40 mm side portion is integrally formed with the main body side of the heat transfer pack 2.

On the other hand, the contact member 1 has a heat transfer medium such as grease or liquid with high thermal conductivity sealed inside as shown in FIG. 14, and the bag-shaped portion is made of core material as shown in FIG. It consists of a thermally conductive film 39 with resin layers 40 and 41 provided on both sides of the film 40. The heat transfer medium sealed inside the pack 2 is a thermally conductive grease based on silicone grease, and the amount of the heat transfer medium sealed is adjusted so that the average thickness of the contact member 1 after being sealed is about 3 mm.

Furthermore, the heat sink 8 uses a heat pipe whose interior is subdivided, and the heat is finally exhausted by flowing water through a member attached to the end face of the heat pipe. It should be noted that the heat sink 8 may be replaced with a heat pipe, and the same effect can be obtained by using a jacket having a water flow part inside. Furthermore, substantially the same effect can be obtained by using a liquid refrigerant, such as Fluorinert, as the heat transfer medium sealed in the contact member 1.

In the above mounting state, the LSI chip 7
We were able to keep the junction temperature below 80°C.

Another embodiment of the present invention will be explained with reference to FIG. Although only the contact member 1 is shown in FIG. 16, in this embodiment, a protrusion 47 is provided on the cooling part of the LSI chip 7 of the pack 2.
is provided, and the liquid heat transfer medium sealed within the contact member 1 is forcibly circulated by applying vibration to that part.

Compared to the case where the heat transfer medium is kept stationary, the heat transfer efficiency is significantly improved by forcibly moving, diffusing, and mixing the heat transfer medium, and this embodiment applies this feature to the contact member 1. Yes, the protrusion 47 provided on the pack 2,
By striking with the vibration generator 43, forced circulation of the heat transfer medium was caused as described above, and the heat transfer ability was able to be greatly improved. The vibration generator 43 used in this example is shown in FIG.
As shown in 7, it consists of a striking part 44 and a motor 45. The striking part 44 is configured such that a plurality of rotatable spherical parts are attached to the outer peripheral part of the disc, and the spherical parts are located outside the outer peripheral part of the disc. The disc of the striking part 44 is rotated by a motor 45, and a spherical component provided on the outer periphery of the disc intermittently hits the protrusion 47, thereby causing the heat transfer medium in the contact member 1 to pulsate. Note that the position of the protrusion 47 is different from that of the pack 2.
It may be provided on any side of the board, and the same effect can be obtained.

Another embodiment of the present invention will be described with reference to FIGS. 17 to 22. FIG. 17 is a perspective view showing a state in which an LSI chip is mounted on a board, and FIGS.
19 and 20 are longitudinal sectional views of the contact member 1 shown in FIG. 18, and FIG. 22 is a longitudinal sectional view of the contact member 1 shown in FIG. 21.

There are various mounting forms for the LSI chip 7 to be mounted on the substrate 6. In this embodiment, a pin grid type LSI 20 and a DIL type LSI 20 having different shapes as shown in FIG.
A case will be described in which a substrate 6 containing SIs is used. In this case, the heights of the various LSI chips 7 mounted on the board 6 may differ, and the height of the contact surface to the pack 2 may differ, but as shown in FIG. By changing the thickness of the contact member 1, the stability of the contact can be maintained. That is, the contact member 1 used in this example is used to connect the LSI chip 7 on the substrate 6 as shown in FIG.
Each pin grid type LS
The heat transfer portion 34 of the contact member 1 is divided corresponding to the I49 and the plurality of DIL type LSIs 50, and the thickness of each heat transfer portion 34 is set to L.
It is changed depending on the height of the SI chip 7. In addition, in the pack 2 of this embodiment, the heat transfer section 3 divided as described above is
4 are configured to communicate with each other through a refrigerant passage 48. Note that if there is not much difference in the heights of the various LSI chips 7, the cross-sectional shape of the contact member 1 is made to have approximately the same thickness as shown in FIG.

In this way, by dividing the heat transfer section 34 and changing the thickness of each heat transfer section 34 according to the height of the LSI chip 7, it is possible to maintain contact stability and improve heat transfer performance. In addition, local convection can be generated within each heat transfer section 34, compared to the case where convection occurs throughout the pack 2 when the heat transfer section 34 is not divided.
There is an advantage that cooling can be efficiently performed according to the amount of heat generated by the various LSI chips 7.

[0062] Also, the same type of LSI chip 7 is mounted on the same substrate 6.
is mounted, the heat transfer pack 2 is configured to have a heat transfer section 34 corresponding to each LSI chip 7 as shown in FIG. 21, and to have approximately the same thickness as shown in FIG. You may do so. In this case as well, local convection can be generated within each heat transfer section 34, and each L
Since the adhesion between the SI chip 7 and the contact member 1 is improved, there is an effect that heat transfer can be performed smoothly. Another embodiment of the invention is shown in FIGS. 23 and 24. FIG. 23 is a vertical sectional view showing an example of application when the contact member 1 is arranged between the substrate 6 and the heat sink 8 which are arranged in the vertical direction.

The contact member 1 used in this example is the pack 2
A liquid heat transfer medium is sealed inside the heat transfer pack 2, and a partition wall 52 is installed inside the heat transfer pack 2 to prevent the flow 51 of the heat transfer medium. Each partition 52 is provided such that the area formed by each partition 52 corresponds to each LSI chip 7, respectively. In this configuration, heat generated in the LSI chip 7 is transmitted to the heat transfer medium 5 through the coating forming the contact member 1. heated heat transfer medium 5
rises above the contact member 1 due to convection, but is prevented by the partition wall 52, changes its direction toward the heat sink 8, is cooled near the heat sink 8, descends downward, and returns to the LSI chip 7.
This results in a flow 51 that changes direction to the side. Therefore, the temperature difference in the vertical direction of the heat transfer medium in the heat transfer pack 2 arranged in the vertical direction is eliminated, a heat transfer medium of the same temperature is supplied to each LSI chip 7, and temperature variations between LSI chips 7 are reduced. It has the effect of

The embodiment shown in FIG. 24 shows an example in which a pack 2 similar to the contact member 1 shown in FIG. 23 can be arranged laterally. In this case as well, convection can be locally caused by each wall 52 and a flow 51 of the heat transfer medium corresponding to each LSI chip 7 can be formed, so that heat transfer at the same temperature is achieved for each LSI chip 7. The medium is supplied, temperature variations among the LSI chips 7 are reduced, and the cooling stability of the LSI chips 7 is increased.

Another embodiment of the present invention is shown in FIG. In this embodiment, a plurality of LSI chips 7 are arranged on a substrate 6, and independent contact members 1 corresponding to each of the LSI chips 7 are arranged. The individual contact members 1 have the same structure as the heat transfer pack 2 described above, and the heat sink 8 has a structure in which, for example, cooling water 9 is allowed to flow inside for cooling. With this configuration, it is possible to perform cooling corresponding to each individual LSI chip 7, which has the effect of increasing the stability of cooling the LSI chip 7.

[0066]

According to the present invention, firstly, the pack forming the contact member has a multilayer structure, the core material is provided with a thin metal material, and the core material is provided with an insulating coating on both or one side. is a metallic foil such as aluminum foil,
Since it has a structure in which an insulating polymer resin film is laminated on both or one side of the pack, the pack has excellent insulation properties and is also effective in terms of strength and corrosion resistance. In particular, when cooling LSI chips, wiring is often left bare, and insulation is important.
It has the effect of not causing any damage.

According to the present invention, secondly, a liquid with good thermal conductivity such as thermally conductive grease is sealed in the container-shaped pack, and metal members are provided in the pack to be in contact with the upper and lower surfaces of the pack. , Heat conduction from the bottom surface to the top surface of the pack is conducted not only through the sealed liquid but also through the metal members, which has the effect of increasing heat transfer efficiency based on heat conduction within the contact members.

[0068] Furthermore, since a pulsation generating mechanism is provided in a part of the contact member, the fluid within the contact member can be forced to flow, promoting convective heat transfer, and thus increasing heat transfer efficiency. effective.

[0069] Furthermore, since a partition wall is provided in the middle of the pack, which has a relatively thin and wide structure, convection occurs locally and promotes convective heat transfer, which has the effect of increasing heat transfer efficiency. There is.

According to the present invention, thirdly, the inside of the contact member is divided by providing partition walls according to the difference in the amount of heat generated by the LSI chip, so that convection is generated depending on the portion where the amount of heat is large. This has the effect of being able to adjust the amount of heat transferred.

Furthermore, by providing the partition wall, convection does not occur over a wide range, and temperature differences do not occur over a wide range, but are limited locally, so the temperature of the LSI chip can be set almost constant. effective.

Since a thin metal wire having a spring effect is inserted into the pack, the heat transfer efficiency based on heat conduction within the contact can be further increased, and the upper and lower surfaces of the contact can be used as heat sinks and Since the contactor is pressed against the electronic component side, the heat transfer effect at the contact portion between the contactor, the heat sink, and the electronic component can be enhanced.

According to the present invention, fourthly, when a plurality of LSI chips of different heights are mounted on a board, partition walls are formed in a plurality of areas within the contact member according to the heights of the LSI chips. Since the structure is divided and each area is connected, the LSI
Even if the height of the chip is different, the contact member can be made according to the height, and since each divided part is connected, the pressure is equalized and the pressing force of the contact member against the LSI chip is partially excessive. It has the effect of preventing this.

In addition, since a pressure adjustment mechanism is provided in a part of the contact member, it is possible to adjust the pressing force of the contact member against the LSI chip on the board, and to ensure that there is sufficient pressure against the heat sink and electronic components. This has the effect of increasing the heat transfer efficiency of the contact portion.

Furthermore, since the metal member provided inside the contact member has spring properties, the spring force can be adjusted in advance, and the pressing force of the contact member against the LSI chip on the board can be adjusted. Since the heat sink and electronic components can be sufficiently pressed against each other, the heat transfer efficiency of the contact portion can be improved.

[0076]

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the overall configuration of a semiconductor cooling device showing an embodiment of the present invention.

FIG. 2 is a perspective view of a contact member showing an embodiment of the present invention.

FIG. 3 is a cross-sectional perspective view of a contact member showing one embodiment of the present invention.

FIG. 4 is a cross-sectional perspective view of a contact member showing an embodiment of the present invention.

FIG. 5 is a cross-sectional perspective view of a contact member showing one embodiment of the present invention.

FIG. 6 is a cross-sectional perspective view of a contact member showing one embodiment of the present invention.

FIG. 7 is a cross-sectional perspective view of a contact member showing one embodiment of the present invention.

FIG. 8 is a longitudinal sectional view of a contact member showing an embodiment of the present invention.

FIG. 9 is a longitudinal sectional view of a contact member showing one embodiment of the present invention.

FIG. 10 is a longitudinal sectional view of a contact member showing an embodiment of the present invention.

FIG. 11 is a longitudinal sectional view of a contact member showing an embodiment of the present invention.

FIG. 12 is a perspective view showing another embodiment of the present invention.

FIG. 13 is a side view showing another embodiment of the present invention in an assembled state.

FIG. 14 is a perspective view of a contact member showing another embodiment of the present invention.

FIG. 15 is a longitudinal cross-sectional view of a thermally conductive film showing another embodiment of the present invention.

FIG. 16 is a perspective view of a contact member showing still another embodiment of the present invention.

FIG. 17 is a perspective view showing still another embodiment of the present invention.

FIG. 18 is a cross-sectional view of a contact member showing still another embodiment of the present invention.

FIG. 19 is a longitudinal sectional view of a contact member showing still another embodiment of the present invention.

FIG. 20 is a longitudinal sectional view of a contact member showing still another embodiment of the present invention.

FIG. 21 is a cross-sectional view of a contact member showing still another embodiment of the present invention.

FIG. 22 is a longitudinal sectional view of a contact member showing still another embodiment of the present invention.

FIG. 23 is a vertical cross-sectional view showing a mounting state of still another embodiment of the present invention.

FIG. 24 is a vertical cross-sectional view showing a mounting state of still another embodiment of the present invention.

FIG. 25 is a longitudinal sectional view showing still another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1... Contact member, 2... Pack, 5... Filled liquid, 7... LSI chip, 8... Heat sink, 10... Horizontal metal coil, 13
... Vertical metal coil, 16 ... Metal scrubber, 18 ... Mountain-shaped fin, 19 ... Fin plate, 36 ... Pressure adjustment section, 43 ... Vibration generator, 48 ... Refrigerant passage, 34 ... Heat transfer section, 35 ... Seal section , 36... Pressure adjustment part, 37... Pressure retention spring, 38... Clamp, 39... Heat conductive film, 40... Core material, 41, 42
...resin layer, 43...vibration generator, 44...blow part, 45...
Motor, 46... Reinforcement member, 47... Projection, 48... Refrigerant passage, 49... Pin grid type LSI, 50... DIL type LS
I, 51... Flow of heat transfer medium, 52... Partition wall, 53... Platter, 54... Fin, 55... Channel, 57... Bolt, 58
...Flexible part, 59...Cooling water pipe, 60...Cooling water purifier, 61...Water pump, 62...Water tank, 63...Chiller.

Claims (29)

[Claims] 1. A semiconductor cooling device that cools the LSI chip by interposing a contact member between a board on which an LSI chip is mounted and a heat sink that cools the board by flowing a cooling fluid, wherein the contact member is made of metal. 1. A semiconductor cooling device characterized in that the semiconductor cooling device is formed of a pack having a core material made of a flexible material and an insulating coating provided on at least the outer surface of the core material. 2. A semiconductor cooling device that cools the LSI chip by interposing a contact member between a board on which an LSI chip is mounted and a heat sink that cools the board by flowing a cooling fluid, wherein the contact member is made of metal. 1. A semiconductor cooling device comprising a pack formed by laminating a plastic foil and an insulating resin foil on at least the outer surface thereof. 3. A semiconductor cooling device that cools the LSI chip by interposing a contact member between a board on which an LSI chip is mounted and a heat sink that cools the LSI chip by flowing a cooling fluid therethrough, wherein the contact member is a bag. A semiconductor cooling device formed of a shaped pack, characterized in that a fluid with good thermal conductivity is sealed in the contact member, and metal groups are provided in contact with the upper and lower surfaces of the pack. . 4. A semiconductor cooling device that cools the LSI chip by interposing a contact member between a board on which an LSI chip is mounted and a heat sink that cools the LSI chip by flowing a cooling fluid therethrough, wherein A semiconductor cooling device characterized in that a fluid having good thermal conductivity is sealed in the contact member and the inside of the contact member is divided into a plurality of regions by partition walls. 5. A semiconductor cooling device in which the LSI chips are cooled by interposing a contact member between a board on which LSI chips having different calorific values are mounted and a heat sink that cools the chips by flowing a cooling fluid therethrough, A semiconductor cooling device characterized in that a fluid having good thermal conductivity is sealed in a contact member, and the inside of the contact member is divided by a partition wall in correspondence with LSI chips having different calorific values. 6. A semiconductor cooling device that cools the LSI chip by interposing a contact member between a board on which an LSI chip is mounted and a heat sink that cools the LSI chip by flowing a cooling fluid thereinto, which corresponds to each LSI chip. A semiconductor cooling device characterized in that the contact member is provided in a manner that the contact member is provided with the contact member. 7. A semiconductor cooling device that cools the LSI chips by interposing a contact member between a board on which LSI chips of different heights are mounted and a heat sink that cools the chips by flowing a cooling fluid therethrough, Semiconductor cooling characterized in that the contact member is provided with a plurality of regions having different thicknesses corresponding to the heights of LSI chips having different heights, and a partition is provided for each region, and each region is partially communicated with each other. Device. 8. A semiconductor cooling device that cools the LSI chip by interposing a contact member between a board on which an LSI chip is mounted and a heat sink that cools the board by flowing cooling fluid, wherein a contact member is provided in the contact member. What is claimed is: 1. A semiconductor cooling device, characterized in that a fluid having good thermal conductivity is sealed in the semiconductor cooling device, and a pressure adjustment section is provided to adjust the pressure within the contact member. 9. A semiconductor cooling device that cools the LSI chip by interposing a contact member between a board on which an LSI chip is mounted and a heat sink that cools the board by flowing a cooling fluid therein. A semiconductor cooling device comprising a group of metal members, and the group of metal members has a spring action. 10. A contact member characterized in that it is formed of a pack formed by laminating a metal foil and insulating resin foil on both sides of the metal foil. 11. A bag-shaped pack, characterized in that a fluid with good thermal conductivity is sealed in the pack, and metal groups are provided in contact with the top and bottom surfaces of the pack. contact member. 12. A bag-shaped pack, characterized in that a fluid with good thermal conductivity is sealed inside the pack, and the inside of the pack is divided into a plurality of regions by partition walls. contact member. 13. A bag-shaped pack, in which a fluid with good thermal conductivity is sealed, and a plurality of partition walls are provided in the pack to correspond to LSI chips with different calorific values. A contact member for a semiconductor cooling device, characterized in that the contact member is divided into regions. 14. A semiconductor cooling device that cools the LSI chips by interposing a contact member between a board on which LSI chips of different heights are mounted and a heat sink that cools the chips by flowing a cooling fluid therein. The surface of the contact member is provided with a plurality of regions having an uneven shape corresponding to the heights of LSI chips having different heights, and a partition is provided for each region, and each region is partially communicated with each other. Features of semiconductor cooling equipment. 15. The liquid sealed in the contact member includes:
The semiconductor cooling device according to any one of claims 1 to 9, using thermally conductive grease. 16. The semiconductor cooling device according to claim 3, wherein the metal member group has a linearly wound shape. 17. A plurality of metal pins are erected on one inner surface of the contact member, and a porous plate is provided on the inner surface of the other contact member, and the pins and the holes of the porous plate are connected to each other. The semiconductor cooling device according to claim 3 or 9, which is combined so as to be connected in a corresponding manner, respectively. 18. The metal member has a structure in which mountain-shaped fins are continuously and regularly arranged, and the peak side and valley side of the mountain-shaped fins are in contact with the opposing inner surface of the contact member, respectively. The semiconductor cooling device described in . 19. The metal member is bent into a U-shape.
According to claim 3 or 9, the fin plate provided with a large number of fins has a structure such that the fins are in contact with the inner surface of one contact member, and the fin plate with a large number of fins protruding is in contact with the inner surface of the other contact member. The semiconductor cooling device described. 20. The semiconductor cooling device according to claim 3 or 9, wherein one end of the metal member group whose central portion is made of resin is in contact with the inner surface of one contact, and the other end is in contact with the inner surface of the other contact. . 21. The semiconductor cooling device according to claim 8, wherein the pressure adjustment section is pressurized by a component having a spring effect. 22. The semiconductor cooling device according to claim 1, further comprising a pulsation generating mechanism that intermittently hits a part of the contact member to generate pulsations in the cooling medium. 23. The semiconductor cooling device according to claim 4, wherein each of the plurality of heat transfer medium enclosing sections separated by the partition wall is communicated with each other through a small refrigerant passage. 24. The semiconductor cooling device according to claim 4, wherein one of the partition walls is fixed to the inner surface of the contact member, and a tip of the partition wall protrudes toward the other inner surface of the contact member. 25. The semiconductor cooling device according to claim 4, wherein the partition wall is formed to suppress convection of the coolant. 26. A contact member comprising a pack formed by having a metal film in the center and placing a polymer resin on both or one surface of the metal film. 27. The contact member according to claim 22, wherein the metal film is made of aluminum. 28. The contact member according to claim 22, wherein the polymer resin is bonded by heating. 29. A semiconductor cooling device that cools the LSI chip by interposing a contact member between a board on which an LSI chip is mounted and a heat sink that cools the board by flowing cooling fluid, wherein the contact member is a bag. The contact member is formed of a pack having a shape, and a fluid with good thermal conductivity is sealed in the contact member, and a surface of the pack on the heat sink side is formed flat, and the heat sink is A semiconductor cooling device characterized in that it is placed on the surface and pressed.