JPH0428434U - - Google Patents
Info
- Publication number
- JPH0428434U JPH0428434U JP7031890U JP7031890U JPH0428434U JP H0428434 U JPH0428434 U JP H0428434U JP 7031890 U JP7031890 U JP 7031890U JP 7031890 U JP7031890 U JP 7031890U JP H0428434 U JPH0428434 U JP H0428434U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- tie bars
- leads
- lead
- punch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図乃至第４図は本考案に係る樹脂バリ除去
用パンチの動作状態を順追つて説明する正面図で
ある。第５図は半導体装置の斜視図、第６図はリ
ードフレームの斜視図、第７図は樹脂モールド装
置の断面斜視図、第８図は樹脂被覆されたリード
フレームの断面図、第９図はタイバを切断除去す
る際の斜視図、第１０図及び第１１図はタイバを
切断除去する際の平面図、第１２図はタイバを切
断除去した後の異なる状態の斜視図である。
１……半導体装置、２……外装樹脂、２ａ……
側壁、３……リード、３ｃ……中間部、１２……
樹脂バリ、４０……樹脂バリ除去用パンチ、４１
……本体、４２……鋸歯状部、４３……駆動機構
。
1 to 4 are front views sequentially illustrating the operating states of the punch for removing resin burrs according to the present invention. FIG. 5 is a perspective view of a semiconductor device, FIG. 6 is a perspective view of a lead frame, FIG. 7 is a cross-sectional perspective view of a resin molding device, FIG. 8 is a cross-sectional view of a resin-coated lead frame, and FIG. 9 is a perspective view of a lead frame. 10 and 11 are plan views when the tie bars are cut and removed, and FIG. 12 is a perspective view of different states after the tie bars are cut and removed. 1...Semiconductor device, 2...Exterior resin, 2a...
Side wall, 3... Lead, 3c... Middle part, 12...
Resin burr, 40...Punch for removing resin burr, 41
. . . Main body, 42 . . . Serrated portion, 43 . . . Drive mechanism.
Claims (1)
され、かつ、リード遊端を含む領域がトランスフ
ア樹脂モールドされたリードフレームのタイバ並
びにタイバと隣接するリード各側壁に形成された
樹脂バリをリード間に挿入したパンチにて除去す
る樹脂バリ除去装置において、 上記パンチは外装樹脂と対向する面が凹湾曲し
、かつ、湾曲面に鋸歯状部を有し、湾曲面が外装
樹脂側に押圧されて上下動駆動されることを特徴
とする樹脂バリ除去装置。[Claims for Utility Model Registration] Tie bars of a lead frame in which the intermediate portions of multiple leads are connected and integrated by tie bars, and the area including the free ends of the leads is molded with transfer resin, and the side walls of each lead adjacent to the tie bars. In a resin burr removal device that removes resin burrs formed on the lead with a punch inserted between the leads, the punch has a concavely curved surface facing the exterior resin, and a serrated portion on the curved surface. A resin burr removal device characterized in that the surface is pressed against the exterior resin side and driven in vertical motion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031890U JPH0428434U (en) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7031890U JPH0428434U (en) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428434U true JPH0428434U (en) | 1992-03-06 |
Family
ID=31606378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7031890U Pending JPH0428434U (en) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428434U (en) |
-
1990
- 1990-06-29 JP JP7031890U patent/JPH0428434U/ja active Pending
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