JPH0428455U - - Google Patents
Info
- Publication number
- JPH0428455U JPH0428455U JP1990069532U JP6953290U JPH0428455U JP H0428455 U JPH0428455 U JP H0428455U JP 1990069532 U JP1990069532 U JP 1990069532U JP 6953290 U JP6953290 U JP 6953290U JP H0428455 U JPH0428455 U JP H0428455U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- light
- solid
- imaging device
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000003384 imaging method Methods 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は本考案の要部拡大図、第３図はＭＴＦ特性を
示す図、第４図は従来の固体撮像素子及び鏡筒の
断面図である。
１０，３０……固体撮像素子、１１，３１……
半導体チツプ、１２……セラミツクパツケージ、
１５……シールガラス、３６……回折格子、２０
……鏡筒、２１……光学レンズ、２２……絞り、
２３……フイルタ、２４……赤外線カツトフイル
タ、３５……モールド樹脂。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is an enlarged view of the main part of the present invention, FIG. 3 is a diagram showing MTF characteristics, and FIG. 4 is a sectional view of a conventional solid-state image sensor and lens barrel. 10, 30... solid-state image sensor, 11, 31...
Semiconductor chip, 12...ceramic package,
15... Seal glass, 36... Diffraction grating, 20
... Lens barrel, 21 ... Optical lens, 22 ... Aperture,
23...Filter, 24...Infrared cut filter, 35...Mold resin.
Claims (1)
状に配列されてなる半導体チツプと、 この半導体チツプが固着されるアイランド部及
び上記半導体チツプと電気的に接続されるリード
部からなるリードフレームと、 上記半導体チツプを上記リードフレームと共に
モールドする透光性のモードル樹脂と、 を備えた固体撮像素子に於いて、 上記半導体チツプの受光面と対向する上記モー
ルド樹脂の表面に、上記半導体チツプ上の受光素
子の配列ピツチに応じた凹凸が形成されて回折格
子が構成されることを特徴とする固体撮像素子。 (2) 上記半導体チツプの受光面に照射される光
の光路上に、特定の波長より長い波長の光を吸収
する光学フイルタが装着されることを特徴とする
請求項第１項記載の固体撮像素子。[Claims for Utility Model Registration] (1) A semiconductor chip having a plurality of photoelectric conversion elements arranged in a matrix on a light-receiving surface, an island portion to which this semiconductor chip is fixed, and an island portion electrically connected to the semiconductor chip. A solid-state imaging device comprising: a lead frame having a lead portion; and a translucent mold resin for molding the semiconductor chip together with the lead frame; 1. A solid-state image pickup device, characterized in that a diffraction grating is formed by forming irregularities on the surface corresponding to the arrangement pitch of the light-receiving elements on the semiconductor chip. (2) The solid-state imaging device according to claim 1, wherein an optical filter that absorbs light with a wavelength longer than a specific wavelength is installed on the optical path of the light irradiated onto the light-receiving surface of the semiconductor chip. element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069532U JPH0428455U (en) | 1990-06-28 | 1990-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069532U JPH0428455U (en) | 1990-06-28 | 1990-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428455U true JPH0428455U (en) | 1992-03-06 |
Family
ID=31604917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069532U Pending JPH0428455U (en) | 1990-06-28 | 1990-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428455U (en) |
-
1990
- 1990-06-28 JP JP1990069532U patent/JPH0428455U/ja active Pending
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