JPH04288832A - Manufacturing apparatus for semiconductor device - Google Patents

Abstract

PURPOSE:To keep an etching speed constant, by controlling a displacement volume discharged from a semiconductor wafer processing chamber in a single wafer etching apparatus. CONSTITUTION:An air flow sensor 7 for measuring an air flow speed is set in a semiconductor wafer processing chamber 2, and at the same time a reference-value input unit 8 is provided for entering a reference setting value and a control unit 9 is provided for comparing the reference input value with an actual value measured. The control unit 9 sends an output signal to a motor driving unit 10 to drive a step motor 11. Then, the opening angel of an autodamper 12 located in a discharging pipe 13 is automatically adjusted so as to control the displacement volume discharged from the semiconductor wafer processing chamber 2. Consequently, through the control of the displacement volume, the etching speed is kept constant.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing semiconductor devices, and more particularly to a single-wafer etching apparatus for etching a semiconductor wafer by spraying a chemical solution onto the semiconductor wafer in the form of a shower.

0002

2. Description of the Related Art As shown in FIG. 3, a conventional single-wafer etching apparatus rotates a semiconductor wafer 3 attracted to a rotating part 4 in a semiconductor wafer processing chamber 2, and a shower nozzle 1
The structure is such that a chemical liquid is ejected in the form of a shower, and the semiconductor wafer 3 is etched with the ejected chemical liquid 5.

At this time, the semiconductor wafer processing chamber 2 is evacuated from an exhaust pipe 6 on the side surface of the semiconductor wafer processing chamber 2. In addition, the exhaust amount is determined by visually observing the stationary exhaust gas measuring device 15 installed in the exhaust pipe 13 connecting the semiconductor wafer processing chamber 2 and the manual damper 14, and if it is outside the appropriate standard range, manually opening or closing the manual damper 14. I am adjusting it. Figure 4
1 is a flowchart diagram showing a series of operations of the prior art.

0004

[Problems to be Solved by the Invention] In this conventional single-wafer type etching apparatus, if the source pressure of the exhaust fluctuates during etching, the exhaust volume of the semiconductor wafer processing chamber also fluctuates, causing variations in the etching speed. As a result, there is a problem in that variations in etching pattern dimensions occur.

[0005] When pattern dimensions of a semiconductor wafer vary and pattern abnormalities occur, this affects the yield and reliability of semiconductor devices.

In recent years, with the miniaturization of semiconductor devices, improvement in the uniformity of pattern dimensions within a semiconductor wafer and between semiconductor wafers has greatly contributed to the quality of semiconductor devices.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device manufacturing apparatus in which fluctuations in exhaust volume within a semiconductor wafer processing chamber are suppressed.

[0008]

[Means for Solving the Problems] In order to achieve the above-mentioned object, a semiconductor device manufacturing apparatus according to the present invention includes a measuring mechanism, an opening/closing mechanism, and a control mechanism, and the apparatus includes a measuring mechanism, an opening/closing mechanism, and a control mechanism, and the apparatus includes a measuring mechanism, an opening/closing mechanism, and a control mechanism, and the apparatus includes a measuring mechanism, an opening/closing mechanism, and a control mechanism, and the apparatus includes a measuring mechanism, an opening/closing mechanism, and a control mechanism. A manufacturing apparatus for semiconductor devices that performs etching processing by blowing air into the semiconductor wafer processing chamber. The control mechanism is a mechanism that controls the opening/closing degree of the piping to an arbitrary value based on the exhaust air velocity value.

[0009]

[Operation] A mechanism that measures the exhaust air speed of the semiconductor wafer processing chamber and adjusts the opening/closing degree of the exhaust piping to an arbitrary value based on the exhaust air speed value, and controls the opening/closing degree of the exhaust piping of the semiconductor wafer processing chamber. be.

0010

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing one embodiment of the present invention. In the figure, 1 is a shower nozzle, 2 is a semiconductor wafer processing chamber, 3 is a semiconductor wafer, 4 is a rotating part, and 6 is an exhaust pipe. 13 is an exhaust pipe, and 12 is an auto damper. Furthermore, the present invention includes a wind speed sensor 7, a reference input section 8,
Control unit 9, motor drive unit 10, and step motor 11
and has.

The semiconductor wafer 3 is carried into the rotating section 4 of the semiconductor wafer processing chamber 2, and the wafer 3 is etched using the chemical solution 5 jetted from the shower nozzle 1.

On the other hand, the inside of the semiconductor wafer processing chamber 2 is exhausted from an exhaust pipe 6. At that time, the exhaust air speed in the semiconductor wafer processing chamber 2 is measured by a wind speed sensor installed on the side of the semiconductor wafer processing chamber 2, and the wind speed measurement value by the wind speed sensor 7 and the setting value preset by the reference input section 8 are combined. are compared by the control unit 9, and when a certain deviation value is reached, the control unit 9 transmits an output signal to the motor drive unit 10.

The motor drive unit 10 includes a step motor 11
to automatically adjust the opening/closing degree of the auto damper 12 provided in the exhaust pipe 13.

After the etching is completed, the semiconductor wafer 3 is
It is carried out from the rotating part 4. The above operations are repeated in sequence.

FIG. 2 is a flowchart showing a series of operations in the embodiment.

[0016]

Effects of the Invention As explained above, the present invention measures the exhaust air velocity value of the semiconductor wafer processing chamber and automatically opens and closes the damper to maintain the optimum exhaust air velocity, thereby keeping the exhaust volume constant. This has the effect that variations in etching rate due to fluctuations in displacement can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view showing one embodiment of the present invention.

FIG. 2 is a flowchart showing a series of operations in an embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view showing a conventional example.

FIG. 4 is a flowchart showing the operation of a conventional example.

[Explanation of symbols]

1 Shower nozzle 2 Semiconductor wafer processing room 3 Semiconductor wafer 4 Rotating part 5　Gushing chemical liquid 6 Exhaust pipe 7 Wind speed sensor 8 Standard input section 9 Control section 10 Motor drive section 11 Step motor 12 Auto damper 13 Exhaust piping 14 Manual damper 15　Static exhaust gas measuring device

Claims (1)

[Claims] 1. A semiconductor device manufacturing apparatus comprising a measuring mechanism, an opening/closing mechanism, and a control mechanism, and performs an etching process by spouting a chemical solution onto a semiconductor wafer in a shower form, the measuring mechanism comprising: a measuring mechanism, an opening/closing mechanism, and a control mechanism; A mechanism that measures the exhaust air speed of the processing chamber, an opening/closing mechanism that adjusts the degree of opening and closing of the exhaust piping, and a control mechanism that controls the degree of opening and closing of the piping from the exhaust air speed value to an arbitrary value. A semiconductor device manufacturing apparatus characterized by: