JPH0429155B2 - - Google Patents

Description

[Detailed description of the invention] [Table of contents] ●Overview ●Field of industrial application ●Prior art ●Problems to be solved by the invention ●Means for solving the problems ●Operations ●Examples (1) Explanation of device structure and device assembly (2) Explanation of manufacturing method of drive coil body (3) Explanation of manufacturing method of chip assembly ●Effects of the invention [Summary] The present invention inserts an XY drive coil for generating a rotating magnetic field into at least an insulating resin body. Mold and
In addition, a through hole for inserting and accommodating a bubble memory chip is provided in the resin body, and a recess for accommodating a bias magnet plate is provided on the outer surface of the resin body to constitute a driving body, thereby providing an easy-to-assemble and inexpensive magnetic bubble memory device. This has been realized.

[Industrial application field]

Magnetic bubble memory devices have excellent features such as the stored information is non-volatile and can be easily rewritten, they are solid-state devices with no mechanically moving parts, so they are highly reliable, and they have high storage density. The field of use is rapidly expanding as memory for , NC devices, OA equipment, etc.

This type of device has already been commercialized with a capacity of 4 Mbit, and research and development is currently being actively conducted mainly on a 16 Mbit capacity.However, as competing memories such as semiconductors and floppy disks have made remarkable progress, small and There is a strong desire to provide bubble memory devices with high storage capacity at low cost.

[Conventional technology]

Conventional bubble memory devices generally have X and Y solenoid coils for generating a rotating magnetic field inserted in a substantially E-shaped chip mounting board in orthogonal relation, and the chip mounting board with the coils inserted is connected to a magnetic shunt plate or a bias magnet plate. In addition, a plurality of external terminals were housed in an insulating frame attached in a daily-in-line (DIP) format, and a magnetic shielding case was attached to the insulator.

[Problem that the invention seeks to solve]

Conventional bubble memory devices have each component (bubble memory chip, X, Y solenoid coil, Z
Devices are manufactured by supplying coils, magnetic field shunt plates, bias magnet plates, shield cases, insulating frames with external terminals, etc. one after another on one assembly line, but this requires a large number of assembly operations and a lot of assembly time. This has led to a decline in assembly reliability and a rise in device prices.

[Means to solve the problem]

In order to solve the above-mentioned conventional drawbacks, the present invention provides a pair of bent flat plate coils, one of which is an insulated conductive wire wound multiple times into a flat shape and bent into a U-shape, and the other of which is an insulated conductive wire wound multiple times into a cylindrical shape. A solenoid coil for generating an in-plane rotating magnetic field, which has a pair of flat plate coils facing each other so as to be positioned in a cylindrical shape, and combined so that the hollow direction thereof coincides with the hollow direction of the solenoid coil. A cylindrical insulating resin body is provided with an XY drive coil, and the XY drive coil is insert-molded into an insulating resin body, and the resin body has a recess formed on its outer surface to accommodate at least a bias magnet plate, and the resin body is provided with a recess for accommodating at least a bias magnet plate. The input/output terminal portion of the XY drive coil is led out from the outer surface, and the center portion of the resin body is inclined so as to be arranged diagonally with respect to the surface of the bias magnet plate, and extends through the hollow portion of the XY drive coil. A through hole for accommodating the magnetic bubble memory chip formed in the above manner is formed to constitute a drive coil body, and a chip assembly in which the memory chip is mounted on a wiring film on which a wiring pattern for coil power supply is formed is formed. A magnetic bubble memory device is provided, wherein the magnetic bubble memory device is inserted into the through hole, and the coil power feeding wiring pattern and the input/output terminal portion are connected to the outside of the drive coil body.

[Effect]

In the present invention, by insert-molding the drive coil and forming the drive coil body from a cylindrical resin body having a recess for accommodating a bias magnet, the bubble memory device assembly work system can be integrated with the bubble memory chip assembly and the drive coil body. The coil body can be assembled separately and then combined to form a device.Assembling work can be performed in parallel, reducing assembly time and efficiency.Assembling work can also be simplified, increasing assembly reliability. You can also improve your sexuality.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view showing the basic structure of the bubble memory device according to the present invention, FIG. 2 is a side sectional view of the device, and FIG. 3 is a plan view showing an example of the bubble memory chip used in the device. , FIG. 4 is a perspective view showing a state in which the drive coil of this device is temporarily fixed, FIG. 5 is a side sectional view for explaining the insert molding process of the coil in FIG. 4, and FIG. 7 is a perspective view showing the assembled state of the chip assembly and drive coil body, FIG. 8 is a plan view illustrating the manufacturing method of the chip assembly of this device, and FIGS. 9A and 9B are A partially enlarged plan view and side sectional view of the wiring film shown in Fig. 8 (unit wiring pattern), Fig. 10 shows A and B, and Fig. 11 A and B show the first and second wiring films shown in Fig. 8. 12 and 13 are plan views explaining the pattern cutting process of FIGS. 10 and 11.
A plan view and a partially enlarged perspective view showing the pattern connection state of the second wiring film.
3 is a side sectional view illustrating the pattern connection process, and FIG. 15 is a perspective view of the manufactured chip assembly according to the present invention.

(1) Description of device structure and device assembly The device structure will be explained with reference to FIGS. 1, 2, 3, 7, and 15.

In these figures, 10 and 11 are bubble memory chips, 20, 21, and 22 are spacer members and restraining members made of nonmagnetic insulating plates, 30 and 40 are wiring films that are main and sub wiring bodies, and 50 is a chip assembly. 60, 61, and 62 are X and Y coils for generating a rotating magnetic field, 63 is a Z coil, 70 is a drive coil body, 80 and 81 are terminal plates, 90 is a magnetic shunt plate that makes the bias magnetic field uniform, and 91 is a a bias magnet plate that generates a bias magnetic field perpendicular to the chip surface, 9
2 is a magnetic shield case, 93 is a terminal guide hole 94
The insulating plate 95 is a cover made of magnetic or non-magnetic material.

Each memory chip 10, 11 is equipped with a plurality of memory blocks (four in the figure) in one chip, as shown in FIG. , bubble detector D, writing side measure line MW1, MW2,
It constitutes an even/odd type memory block having reading side major lines MR1, MR2, an even side minor loop Em, and an odd side minor loop Om.

This example shows a device in which two memory chips 10 and 11 are mounted. For example, if the memory density of each chip is 8 Mbit, a device with a 16 Mbit capacity is available, and if the memory density of each chip is 16 Mbit, a device with a 32 Mbit capacity is available. It can be obtained by

The memory chip 10 is connected to the wiring pattern of the main wiring film 30 as described later.
1 is similarly connected to a sub-wiring film 40, and the sub-wiring film 40 is mounted on the main wiring film 30 so that the memory chips 10 and 11 overlap and are parallel to each other at the same position, and the chip assembly is completed. 50 are configured.

As shown in FIG. 15, this chip assembly 50 includes a spacer member 2 between wiring films 30 and 40.
0 to provide a certain gap between the memory chips 10 and 11, and the spacer member 20 and the holding member 2
By sandwiching the wiring films 30 and 40 between the chips 1 and 22, the chips 10 and 11 are held parallel to each other.

In addition, the spacer member 20 and the wiring films 30, 4
0 and the restraining members 21 and 22 are adhesively fixed to each other, and as described later, the wiring pattern of the sub wiring film 40 is electrically connected to the wiring pattern of the main wiring film 30, and the chips 10 and 11 are connected to the external bubble. Both ends of the main wiring film 30 are led out from both sides of the chip for connection to the control circuit. The drive coil body 70 includes bent flat plate coils 61 and 62 as an X-coil, which is an insulated conductive wire wound multiple times in a planar shape and bent into a U-shape, and a Y coil, which is an insulated conductive wire multiple-wound in a cylindrical shape. It has a solenoid coil 60 and a Z coil 63 for adjusting the bias magnetic field and erasing information all at once.
It is constructed by insert molding inside.

Memory chip 1 by this drive coil body 70
The generation of a rotating magnetic field parallel to the 1st and 12th planes can be obtained by combining the X-direction magnetic field from the bent flat plate coils 61 and 62 and the Y-direction magnetic field from the solenoid coil 60.
Further, the Z coil 63, which is formed by multiple windings of insulated conductive wire in a ring shape, generates a magnetic field that is substantially orthogonal to the rotating magnetic field.

The resin body 71 of the drive coil body 70 is a cylindrical body having an inclined through hole 72 for accommodating the chip assembly 50, and has recesses 73 for accommodating the magnetization plate 90 and the magnet plate 91 on its upper and lower outer surfaces. Further, lead wires 64, which are input/output terminal portions of the insert-molded coils 60, 61, 62, and 63, are led out from the outer surfaces of both ends thereof.

Incidentally, the drive coil body 70 in FIG. 1 shows the coil arrangement in a state where no resin body is attached (solid line coils are in a combined state, dotted line coils are in a disassembled state).

Then, as shown in FIG. 7, the chip assembly 50 is inserted into the drive coil body 70 in which the magnet plate 90 and the magnet plate 91 are assembled in the recessed part of the resin body 71 and the shield case 92 is attached to the outer periphery. , terminal plates 80 and 81 are attached to both ends of the main wiring film 30 extending from both sides of the drive coil body 70.

At this time, the insertion arrangement of the chip assembly 50 is such that it is inserted into the through hole 72 from one side, and the chips 10 and 11 are positioned in the center of the coils 60 to 63 and the magnet plate 91. It is fixed with adhesive resin. In this inserted state, the surfaces of the chips 10 and 11 are aligned with the magnet plate 91 due to the inclination of the through hole 72.
The chip 1 is arranged diagonally with respect to the opposing surface of the chip 1.
A hold magnetic field will be applied to 0 and 11.

The terminal plates 80 and 81 are pin grid array plates in which a large number of terminal pins 83 are fixed at right angles to the back side of a ceramic substrate 82.
A conductor pattern (not shown) is formed on the inner layer of the board, and a large number of terminal pads 84 are arranged in a row on the surface, and the terminal pads 84 are connected to desired terminal pins 83 through through holes and through the conductor pattern.
It is connected to the.

In the terminal boards 80 and 81, each of the terminal pads 84 and each of the wiring patterns 31 formed exposed at both ends of the main wiring film 30 are connected by thermocompression bonding.

Furthermore, a plurality of connection pads 32 are formed at both ends of the main wiring film 30, with the ends of the coil power supply wiring pattern exposed, and the ends of the above-mentioned coil lead wires 64 are connected to each of the pads 32. Connected by soldering etc. with forming.

Thereafter, both ends of the main wiring film 30 are bent toward the back side of the shield case 92 as shown by dotted lines in FIG. is fixed to the back side of the shield case 92 with the terminal pin 83 protruding at right angles.

The device structure assembled in this way has the terminal board 8 inside the cover 95 with the opening facing upward.
0 and 81 are placed upward, and are then integrated by injecting adhesive resin 96 into the cover 95.

Finally, the opening of the cover 95 is closed with an insulating plate 93 so that the terminal pin 83 protrudes outward, and the cover 95 and the insulating plate 93 are joined, thereby manufacturing the valve memory device according to the present invention. .

Note that the adhesive resin 96 may be filled in the cover 95 so that the device structure is buried therein.

Further, in the state shown in FIG. 7 and without providing the terminal boards 80 and 81, the wiring pattern 31 exposed at both ends of the main wiring pattern 30 is directly connected to a mounting printed board (not shown), and the shield case 92 is It is also possible to adopt a mounting form in which the printed circuit board is held by a fixing band.

(2) Description of manufacturing method of drive coil body 70 Figure 4~
This will be explained with reference to FIG.

FIG. 4 shows the temporarily fixed state of the coils 60 to 63.

This involves using a flat plate jig (not shown), fitting bent flat plate coils 61 and 62 on both sides of the jig as shown in the dotted line coils in FIG. Fit it into the solenoid coil 60 and set it. Next, the input/output lead wire 64a of the solenoid coil 60,
64b, the input/output lead wires 64c, 64d at the beginning of winding of the bent flat plate coils 61, 62, and the input/output lead wires 64a, 64f of the Z coil 63 are pulled out to both sides, respectively, and After connecting lead wires 64g and 64h, apply adhesive 6
5 to temporarily fix the coils 60 to 63 in advance.

Thereafter, the coil is removed from the jig, set in a resin mold as shown in FIG. 5, and insert molded. In this mold, the upper and lower molds 66, 67 and the left and right cores 68, 69 open and close vertically and horizontally (the cores 68, 69 open and close at an angle of θ).
), and the lead wires 64a to 6
4f is held by providing guide grooves (not shown) on the mating surfaces of the upper and lower molds 66, 67 with the left and right cores 68, 69. Then, by injecting insulating resin into the cavity with the coil set in the mold, a drive coil body 70 as shown in FIG.
is produced.

This drive coil body 70 has a magnetic shunt plate 9 in the recess 73.
0, housing the magnet plate 91 and shielding case 9
2, the magnet plate 91 is magnetized by applying an external magnetic field so as to have a desired bias magnetic field value, thereby manufacturing the drive coil body 70 according to the present invention.

By combining this drive coil body 70 and chip assembly 50, a device according to the present invention is obtained.

(3) Explanation of the manufacturing method of the chip assembly 50 The manufacturing method of the chip assembly 50 is shown in FIGS.
This will be explained with reference to FIG.

In FIG. 8, 30a is the main wiring film 30.
40a is a tape-like wiring film for obtaining the sub-wiring film 40, and these films 30a, 40a have a plurality of unit wiring patterns shown in FIG. 9 that are continuous in the longitudinal direction of the film. It is formed as follows.

The films 30a and 40a are films having exactly the same external shape and the wiring state of the wiring pattern, and two types of wiring films 30 and 40, a main wiring film and a sub-wiring film 40, are formed by the manufacturing process described later.

9A and 9B show an enlarged view of the unit wiring patterns of the films 30a and 40a, and 31a in the figure
are two parallel branch patterns 31a-1, 31a-
2 is a wiring pattern for chip connection (9 wires on each side in the figure), 31b is a wiring pattern for coil power supply (3 wires on each side in the figure), 32 is a connection pad, 33 is a flexible insulating film, 34 is a film feed hole formed at a predetermined pitch on both sides of the film; 35 is a hole for accommodating the memory chips 10 and 11;
36 is a hole for cutting positioning, and 37 is a round hole for overlapping positioning. 38 is a wiring pattern 31
A strip opening 39 partially and completely exposes both ends of the wiring pattern 31a to form a terminal board connection part, and a strip opening 39 partially and completely exposes the middle part of the wiring pattern 31a to form the main and sub wiring films 30, This is a band-shaped opening for connecting 40 patterns and selectively cutting branch patterns.

As shown in FIGS. 9A and 9B, each unit wiring pattern is formed symmetrically in the longitudinal direction of the film with the center line of the accommodation hole 35 as a boundary, and each adjacent unit wiring pattern is formed in its wiring pattern 31a, 31b.
A pattern is formed with the ends connected.

For the films 30a and 40a, a tape-shaped copper foil 41 (see FIG. 14) with a thickness of approximately 5 μm is bonded onto an insulating film 33 in which holes 34, 35, 36, and 37 are formed in advance for each unit wiring pattern. The copper foil 41 is patterned (resist exposure/development-copper etching treatment) to form wiring patterns 31a, 31.
b is formed. In addition, each wiring pattern 31
A gold layer 42 (see FIG. 14) having a thickness of about 2 to 5 μm is plated on the surfaces of the patterns a and 31b to ensure thermocompression bonding connections between the patterns. This plating is carried out by gold plating after patterning the copper foil, thereby obtaining wiring patterns 31a and 31b in which a gold layer 42 is formed on the surface of the copper pattern.

One wiring pattern 31 formed in this way
a is attached to the insulating film 33 across the openings 38 and 39, one end thereof protrudes inside the receiving hole 35 at a predetermined pitch to form a chip connection end 43, and the other end forms the branch pattern 31a. −
1 and 31a-2 are connected by a connection pattern 44. The other wiring pattern 31b is also attached to the insulating film 33 across the opening 38, and the connection pad 32 is connected to one end thereof.

Note that 45 and 46 (shown by dotted lines in FIG. 9A) are insulating films deposited on the insulating film 33 by screen printing, and 45 is a branch pattern 31a-1, 45 is formed so that the connection pad 32 is exposed. 31a-2
and the wiring pattern 31b, and 46 is the wiring pattern 31a, 31 located around the accommodation hole 35.
b to improve the insulation between the patterns.

The films 30a and 40a constructed as described above are sequentially fed by the engagement of a feed mechanism (not shown) and the feed hole 34, and are processed through a bonding device and a cutting device (not shown) to form a chip assembly 5.
0 is produced.

That is, as shown in FIG. 8 (the wiring pattern is omitted), the film 30a is initially in a state of just the film as shown in A, but when it is fed by a predetermined pitch, the chip 10 is first mounted as shown in B.
This chip mounting is carried out by positioning the chip 10 in the receiving hole 35 in a bonding device and thermocompression bonding the connection 43 and the connection pattern 47 of the chip 10. FIG. 9 shows this chip mounting state. Further, when the film 30a is fed, the chip 10 is subjected to a chip test at C. In this chip test, a prober is brought into contact with the wiring pattern 31a exposed through the opening 38, and the resistance values of the generators G1 and G2, the detector D of the chip 10, and the gates (swap gates and replicate gates) in the chip are measured. . In addition, a rotating magnetic field or a bias magnetic field is actually applied from the outside to operate the chip 10, and the quality of the chip 10 is determined.

Also, regarding the film 40a, the film 30a
Similarly, tip 11 is moved from the state of A' to the feed position of B'.
was mounted using thermocompression bonding, and a chip test was performed at the feeding position C'.

Next, at the feeding positions D and D', the film 30a,
40a undergoes a selective pattern cutting process for a good unit wiring pattern.

The situation of this cutting process is shown in Figures 10A and B and 11.
Shown in Figures A and B.

This figure is an enlarged view of the wiring pattern 31a near the opening 39 in FIG. 9A, and FIG. 10 shows the case of the film 40a, and FIG. 11 shows the case of the film 30a.

The film 40a has openings 39 on both sides of the insulating film 33 and the branch patterns 31a-1 and 31a-2 at the meandering cutting line a...a' in FIG. 10A.
The insulation film 33 is cut at the upper and lower positions along the cutting lines b...b' and c...c' in FIG. 9A.

As a result, the wiring pattern 31 as shown in FIG.
8a, only one branch pattern 31a-1 protrudes from both sides of the insulating film 33, and the wiring film in this state is cut out from the film 40a as shown in FIG. 8 to form the sub-wiring film 40 with chips mounted thereon. becomes.

On the other hand, each branch pattern 31a-1 of the film 30a is punched and cut along with the insulating film 33 at the dotted line portion 48 as shown in FIG. It is processed separately from 31a.

When the film 30a is further fed and reaches the position E, the chip-mounted sub-wiring film 40, the spacer member 20, and the restraining members 21, 22 are placed on the film 30a, and the films 30a and 4 are placed on the film 30a.
0 wiring pattern connections are made.

The spacer member 20 and the restraining members 21 and 22 have the same shape, with a rectangular through hole 23 in the center corresponding to the chip receiving hole 35, strip holes 24 corresponding to the openings 39 on both sides, and holes 37 in the four corners. Corresponding positioning holes 25 are formed.

The state at position E is as shown in FIG. 14, where four positioning pins 1 (only one is shown in the figure) are installed on the support base 100 of the bonding device.
01 as a guide, the holding member 21, film 30a, spacer member 20, chip-mounted sub-wiring film 40, and holding member 22 are placed on the support base 100 through the holes 25 and 37, respectively. Also, at this time, the spacer member 20 is placed on the upper surface of the restraining member 21.
Since adhesive is applied in advance to the upper and lower surfaces of the holding member 22 and to the lower surface of the holding member 22, these members 20, 21, 22 and the films 30a, 40 are adhesively fixed.

By lowering the crimp head 102 of the bonding device into the opening 39 from this placed state, the respective branch patterns 31a-1 and the film 30a of the chip-mounted sub-wiring film 40 are separated.
The respective branch patterns 31a-1 are thermocompression bonded and electrically connected.

During this bonding, the branch pattern 13a-
If a bump is formed in advance at one bonding location, bondability and connection reliability will be further improved.

As a result, only one branch pattern 31a-2 of the film 30a is connected to the chip 10 via the wiring pattern 31a, and the other branch pattern 31a-2 is connected to the chip 10 via the wiring pattern 31a.
-1 is connected to the branch pattern 31a-1 of the upper chip-mounted sub-wiring film 40 within the opening 39, and is connected to the chip 11 via the wiring pattern 31a.

In addition, this connection part is shown in the plan view and the first part in Fig. 12.
FIG. 3 shows a perspective view, and 103 is a bonding connection point.

The film 30a to which the chip-mounted sub-wiring film 40 has been connected and mounted is further fed, and cut lines b...b', c...c', d... shown in FIG. 9 are cut by a cutting device at a predetermined position. The film is cut at positions d', e...e', whereby the chip-mounted main wiring film 30 is separated from the film 30a.
At the same time, a chip assembly 50 having two chips 10 and 11 mounted thereon shown in FIG. 15 is manufactured.

In FIG. 15, reference numeral 49 indicates the remaining portion of the film produced by cutting the film 30a at the cutting lines d...d', e...e', and this is the branch pattern 31a- 1,31a-
The ends of the terminal boards 80 and 81 are held to prevent the pattern from bending, and the connection between the terminal boards 80 and 81 and the terminal pads 84 is ensured.

The chip assembly 50 manufactured in this way is assembled with the drive coil body 70 and the shield case 9 as described above.
2 and the like to produce a magnetic bubble memory device according to the present invention.

In the above description of manufacturing the chip assembly 50, it was explained that the chip-mounted sub-wiring film 40 is manufactured simultaneously with the chip-mounted main wiring film 30, but the film 40 is separated in advance. A large number of them may be manufactured and prepared in the process.

Also, each part (film 40
Although it has been described that the mounting process (e.g.) and the wiring pattern connection are performed at the same time, the mounting process may be performed at a separate position, and then the wiring pattern connection process may be performed.

Furthermore, in the device of the above embodiment, since two bubble memory chips are stacked, the wiring pattern has two branch patterns, but the branch pattern may be set according to the number of bubble memory chips. By implementing the above configuration with a three-branch pattern, a device with even higher storage capacity can be obtained.

〔Effect of the invention〕

According to the present invention as described above, it is possible to assemble the drive coil, bias magnet, etc. as a unit separately from the bubble memory chip, and the assembly work can be shortened and reliability can be improved, resulting in an inexpensive magnetic bubble memory device. can be provided in large quantities, and its practical effects are extremely significant.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view showing the basic configuration of a bubble memory device according to the present invention, FIG. 2 is a side sectional view of the device, and FIG. 3 is a plan view showing an example of the bubble memory chip used in the device. , FIG. 4 is a perspective view showing the temporarily fixed state of the drive coil of this device, FIG. 5 is a side sectional view for explaining the insert molding process of the coil in FIG. 4, and FIG. 7 is a perspective view showing the assembled state of the chip assembly and the drive coil body, FIG. 8 is a plan view illustrating the manufacturing method of the chip assembly of this device, and FIGS. A partially enlarged plan view and side cross-sectional view of the wiring film shown in the figure, and FIGS. Figures 12 and 13 are Figures 10,
FIG. 11 is a plan view and partially enlarged perspective view showing the pattern connection state of the first and second wiring films; FIG. 14 is a side sectional view illustrating the pattern connection process in FIGS. 12 and 13; FIG. 15 FIG. 2 is a perspective view of a manufactured chip assembly according to the present invention. Explanation of symbols, 10, 11... Bubble chip memory, 30... Main wiring film with chip mounted, 40
...Chip-mounted sub-wiring film, 30a, 40
a...Tape wiring film, 31, 31a, 31
b...Wiring pattern, 31a-1, 31a-2...
...Branch pattern, 50...Chip assembly, 60~
63...Coil, 70...Coil assembly, 80,
81...Terminal board, 91...Bias magnet plate, 92
...magnetic shield case.

Claims (1)

[Scope of Claims] 1. A pair of bent flat plate coils, one of which is formed by multiple windings of insulated conductive wire in a flat shape and bent into a U-shape;
The other has a solenoid coil in which an insulated conductive wire is wound multiple times in a cylindrical shape, and the pair of flat plate coils are arranged opposite each other in a cylindrical shape, and are combined so that the hollow direction thereof coincides with the hollow direction of the solenoid coil. A cylindrical insulating resin body is provided in which the XY drive coil is insert-molded in an insulating resin body, and the resin body has at least a bias magnet plate on its outer surface. A recess is formed for accommodating the
The input and output terminals of the XY drive coil are led out,
A through hole for accommodating a magnetic bubble memory chip is formed in the center of the resin body, the hole being inclined so as to be disposed diagonally with respect to the surface of the bias magnet plate and penetrating the hollow portion of the XY drive coil. , which constitutes a drive coil body, and a chip assembly in which the memory chip is mounted on a wiring film on which a wiring pattern for coil power feeding is formed is inserted into the through hole, and the wiring pattern for coil power feeding and the said input are inserted into the through hole. A magnetic bubble memory device characterized in that an output terminal portion is connected to the outside of the drive coil body. 2. The magnetic bubble according to claim 1, wherein the cylindrical insulating resin body is insert-molded with a Z coil that applies a magnetic field substantially orthogonal to the in-plane rotating magnetic field generated by the XY drive coil. memory device. 3. A shield case with openings at both ends is inserted into the outer surface of the cylindrical insulating resin body, and the XY drive coil and the Z 3. The magnetic bubble memory device according to claim 2, wherein the input/output terminal portion of the coil is led out.