JPH0429166B2 - - Google Patents
Info
- Publication number
- JPH0429166B2 JPH0429166B2 JP16363185A JP16363185A JPH0429166B2 JP H0429166 B2 JPH0429166 B2 JP H0429166B2 JP 16363185 A JP16363185 A JP 16363185A JP 16363185 A JP16363185 A JP 16363185A JP H0429166 B2 JPH0429166 B2 JP H0429166B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- base layer
- electrical contact
- sulfidation
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005486 sulfidation Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 229910000510 noble metal Inorganic materials 0.000 claims description 7
- 230000001737 promoting effect Effects 0.000 claims description 7
- 238000005253 cladding Methods 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000005987 sulfurization reaction Methods 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 43
- 230000000694 effects Effects 0.000 description 9
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Contacts (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、電流通電遮断機能を有するスイツ
チ、リレー等の電気接点に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to electrical contacts such as switches and relays having a current cutoff function.
従来より、電気接点にはAg合金が広く使用さ
れているが、耐硫化性能が著しく劣るという欠点
があつた。すなわち、接点表面を貴金属層（Au
合金）で覆つても、Agのクリーピング作用によ
りＳイオンが貴金属層に到達し、Ag2Ｓが生成す
るのである。クリーピング作用とは、第５図に示
すように、下地層６の側面に生成したAg2Ｓ（符
号Ａで示す）がマイグレーシヨン（Agはイオン
化が容易）のために側面から表面層７に進み、接
触点に硫化物（Ag2Ｓ）を生成することをいう。
また、クリーピング作用は、第６図に示すよう
に、下地層６だけでなく、下地層６を設けた台材
８でも生ずる。台材８がCuの場合には、硫化物
としてCuSが生成する。
Conventionally, Ag alloys have been widely used for electrical contacts, but they have the disadvantage of significantly poor sulfidation resistance. In other words, the contact surface is coated with a noble metal layer (Au
Even if the noble metal layer is covered with a noble metal layer, S ions reach the noble metal layer due to the creeping effect of Ag, and Ag 2 S is generated. As shown in FIG. 5, the creeping effect means that Ag 2 S (indicated by the symbol A) generated on the side surface of the underlayer 6 migrates from the side surface to the surface layer 7 due to migration (Ag is easily ionized). This means that sulfide (Ag 2 S) is produced at the point of contact.
Further, as shown in FIG. 6, the creeping effect occurs not only in the base layer 6 but also in the base material 8 on which the base layer 6 is provided. When the base material 8 is made of Cu, CuS is generated as a sulfide.
このような硫化物層は接点寿命を短くし、信頼
性を低下させるという問題がある。 Such a sulfide layer has the problem of shortening contact life and reducing reliability.
この発明の目的は、側面での硫化が接触表面へ
移行するのを防止してクリーピング作用を減じさ
せることにより、耐硫化性能を向上させ信頼性を
高めた電気接点を提供することである。
An object of the present invention is to provide an electrical contact with improved sulfidation resistance and reliability by preventing sulfurization on the side surfaces from migrating to the contact surfaces and reducing creeping effects.
この発明の電気接点は、台材上にAg，Cu，Ag
合金またはCu合金からなる下地層を介してクラ
ツド層またはめつき層を設けた電気接点におい
て、前記下地層の外周面に孔を設けたことを特徴
とするものである。
The electrical contact of this invention has Ag, Cu, Ag on the base material.
This electrical contact is provided with a cladding layer or a plating layer via a base layer made of an alloy or a Cu alloy, and is characterized in that a hole is provided on the outer peripheral surface of the base layer.
このように、この発明によれば、下地層の外周
面に孔を設けたので、側面部からの硫化の進行が
接触性能に直接影響しない孔に向いこの孔で集中
的に硫化するようになり、接触表面への硫化の進
行が防止され、その結果耐硫化性能が向上し、接
点寿命および信頼性を向上させることができる。 In this way, according to the present invention, since the holes are provided on the outer peripheral surface of the base layer, the progress of sulfidation from the side surface is directed to the holes where it does not directly affect the contact performance, and sulfurization is concentrated in these holes. , the progress of sulfidation to the contact surface is prevented, and as a result, sulfidation resistance is improved, and contact life and reliability can be improved.
また、孔によつて放熱機能を付加させることが
できて、電気接点の温度上昇を抑制することがで
きる。さらに、孔を下地層に設けることにより、
下地層の材料使用量を削減することができ、コス
トダウンが可能になるという副次的効果もある。 Further, the holes can add a heat dissipation function, and it is possible to suppress a rise in temperature of the electrical contacts. Furthermore, by providing holes in the base layer,
There is also the secondary effect of being able to reduce the amount of material used in the base layer, thereby reducing costs.
この発明の他の電気接点は、前述の構成に加え
て、孔内に硫化促進層を形成したものである。 Another electrical contact of the present invention has a sulfidation promoting layer formed in the hole in addition to the above-described structure.
このため、孔への硫化の進行がより一層促進さ
れ、耐硫化性能を著しく向上させることができ
る。 Therefore, the progress of sulfidation into the pores is further promoted, and the sulfidation resistance can be significantly improved.
この発明の一実施例を第１図ないし第３図に基
づいて説明する。すなわち、この電気接点は、第
１図に示すように、台材３上にAg，Cu，Ag合金
またはCu合金からなる下地層２を介してクラツ
ド層１（またはめつき層）を設けた電気接点４に
おいて、前記下地層２の外周面に孔５を設けたこ
とを特徴とするものである。 An embodiment of the present invention will be described based on FIGS. 1 to 3. That is, as shown in Fig. 1, this electrical contact is an electrical contact in which a cladding layer 1 (or plating layer) is provided on a base material 3 via a base layer 2 made of Ag, Cu, Ag alloy, or Cu alloy. The contact point 4 is characterized in that a hole 5 is provided in the outer peripheral surface of the base layer 2.
前記台材３はCu，Cu合金などからなる。クラ
ツド層１はAg，Pdなどの貴金属またはその合金
からなる。 The base material 3 is made of Cu, Cu alloy, or the like. The cladding layer 1 is made of a noble metal such as Ag or Pd or an alloy thereof.
電気接点４を製造するには、第２図に示すよう
に、テープ状の長い台材３上面の両側部に間隔を
あけて２つの第１下地層２ａをそれぞれ圧接また
は熔接により形成し、ついでその上面に台材３の
幅とほぼ同寸法の第２下地層２ｂを同様にして圧
接または熔接して、孔５を有する下地層２を形成
する。しかるのち、下地層２上面にクラツド層１
を形成し、必要な寸法に切断して電気接点を得
る。切断は幅ｈよりも切断幅ａが小さくなるよう
にする。 To manufacture the electrical contact 4, as shown in FIG. 2, two first base layers 2a are formed at intervals on both sides of the top surface of the long tape-shaped base material 3 by pressure welding or welding, and then A second base layer 2b having approximately the same size as the width of the base material 3 is similarly pressure-bonded or welded to the upper surface of the base material 3, thereby forming a base layer 2 having holes 5. After that, a clad layer 1 is formed on the top surface of the base layer 2.
form and cut to the required dimensions to obtain electrical contacts. Cutting is performed so that the cutting width a is smaller than the width h.
また、他の製造方法としては、第３図に示すよ
うに、テープ状の台材３の上面にその長手方向に
適宜な間隔をあけて第１下地層２′ａを圧接また
は熔接し、この上に台材３とほぼ同一寸法の第２
下地層２′ｂを圧接または熔接して下地層２を形
成し、さらにその上にクラツド層１を設ける。し
かるのち、適宜な間隔で切断して孔５を有する電
気接点４を得る。 In addition, as another manufacturing method, as shown in FIG. 3, a first base layer 2'a is pressure-bonded or welded to the upper surface of a tape-shaped base material 3 at appropriate intervals in the longitudinal direction. A second plate with almost the same dimensions as base material 3 is placed on top.
The base layer 2'b is pressed or welded to form the base layer 2, and the cladding layer 1 is further provided thereon. Thereafter, the electrical contacts 4 having holes 5 are obtained by cutting at appropriate intervals.
得られた電気接点４は、その下地層２の外周面
に貫通した孔５が形成されているので、硫化物の
移行がこの孔５中に向かい、その結果表面の接触
部Ｂへの移行が減じられるので、耐硫化性能が向
上する。また、下地層２中の孔５によつて、放熱
効果が促進され、電気接点４の温度上昇が抑制さ
れる。さらに、下地層２の材料使用量が削減さ
れ、コストダウンを図ることができる。 Since the obtained electrical contact 4 has holes 5 that penetrate through the outer circumferential surface of the base layer 2, the sulfide migrates into the holes 5, and as a result, migrates to the contact area B on the surface. This improves sulfidation resistance. Further, the holes 5 in the base layer 2 promote the heat dissipation effect and suppress the temperature rise of the electrical contact 4. Furthermore, the amount of material used for the base layer 2 is reduced, and costs can be reduced.
この発明の他の実施例を第４図に基づいて説明
する。すなわち、この電気接点４′は、前述の実
施例の構成に加えて、下地層２の外周面に設けた
孔５の内面に硫化促進層９を形成したものであ
る。 Another embodiment of the invention will be described based on FIG. That is, in addition to the structure of the above-described embodiment, this electrical contact 4' has a sulfidation promoting layer 9 formed on the inner surface of the hole 5 provided on the outer peripheral surface of the base layer 2.
この硫化促進層９はMg，Al，Cu，Niなどの
貴金属以外の他の金属を用いて、めつきなどによ
り形成したものである。かかる硫化促進層６によ
つて、孔５内への硫化物の移行がより一層促進さ
れ、接点表面への移行をより有効に阻止すること
ができる。その他は前述の実施例と同様である。 This sulfidation promoting layer 9 is formed by plating or the like using metals other than noble metals such as Mg, Al, Cu, and Ni. Such a sulfurization promoting layer 6 further promotes the migration of sulfide into the holes 5, and can more effectively prevent the sulfide from migrating to the contact surface. The rest is the same as the previous embodiment.
なお、孔５は貫通していないものであつてもよ
い。 Note that the hole 5 may not be penetrating.
この発明によれば、下地層の外周面に孔を設け
たので、側面部からの硫化の進行が接触性能に直
接影響しない孔に移行し貫通孔で集中的に硫化す
るようになり、接触表面への硫化の進行が防止さ
れ、耐硫化性能が向上し、接点寿命および信頼性
を向上させることができる。
According to this invention, since the holes are provided on the outer circumferential surface of the base layer, the progress of sulfidation from the side surface moves to the holes that do not directly affect the contact performance, and sulfidation occurs intensively in the through holes, so that the contact surface This prevents the progress of sulfidation, improves sulfurization resistance, and improves contact life and reliability.
また、この孔によつて放熱機能を付加させるこ
とができ、電気接点の温度上昇を抑制することが
できる。さらに、孔を下地層に設けることによ
り、下地層の材料使用量を削減することができ、
コストダウンが可能となるという副次的効果もあ
る。 Further, the holes can add a heat dissipation function, and can suppress the temperature rise of the electrical contacts. Furthermore, by providing holes in the base layer, the amount of material used in the base layer can be reduced.
There is also the side effect of being able to reduce costs.
加えて、孔内に硫化促進層を形成することによ
り、孔への硫化の進行がより一層促進され、耐硫
化性能を著しく向上させることができるという効
果がある。 In addition, by forming the sulfidation promoting layer in the pores, the progress of sulfidation into the pores is further promoted, and there is an effect that the sulfidation resistance can be significantly improved.
第１図はこの発明の一実施例の斜視図、第２図
はこの実施例における電気接点の製造方法を示す
説明図、第３図は他の製造方法を示す説明図、第
４図はこの発明の他の実施例を示す断面図、第５
図はクリーピング作用を示す説明図、第６図は従
来の電気接点の斜視図である。
１……クラツド層、２……下地層、３……台
材、４……電気接点、５……孔、６……硫化促進
層。
FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is an explanatory diagram showing a method of manufacturing an electrical contact in this embodiment, FIG. 3 is an explanatory diagram showing another manufacturing method, and FIG. 4 is an explanatory diagram of this embodiment. Cross-sectional view showing another embodiment of the invention, No. 5
The figure is an explanatory view showing the creeping effect, and FIG. 6 is a perspective view of a conventional electrical contact. DESCRIPTION OF SYMBOLS 1... Clad layer, 2... Base layer, 3... Base material, 4... Electric contact, 5... Hole, 6... Sulfurization promotion layer.
Claims (1)
らなる下地層を介してクラツド層またはめつき層
を設けた電気接点において、前記下地層の外周面
に孔を設けたことを特徴とする電気接点。 ２ 台材上にAg，Cu，Ag合金またはCu合金か
らなる下地層を介してクラツド層またはめつき層
を設けた電気接点において、前記下地層の外周面
に孔を設け、かつこの孔の内面に硫化促進層を形
成したことを特徴とする電気接点。 ３ 前記硫化促進層が貴金属以外の他の金属から
なる特許請求の範囲第２項記載の電気接点。[Claims] 1. In an electrical contact in which a cladding layer or a plating layer is provided on a base material through a base layer made of Ag, Cu, Ag alloy, or Cu alloy, holes are provided on the outer peripheral surface of the base layer. An electrical contact characterized by: 2. In an electrical contact in which a cladding layer or a plating layer is provided on a base material through a base layer made of Ag, Cu, Ag alloy, or Cu alloy, a hole is provided on the outer peripheral surface of the base layer, and the inner surface of this hole is An electrical contact characterized by having a sulfurization promoting layer formed thereon. 3. The electrical contact according to claim 2, wherein the sulfidation promoting layer is made of a metal other than a noble metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16363185A JPS6224509A (en) | 1985-07-24 | 1985-07-24 | Electric contact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16363185A JPS6224509A (en) | 1985-07-24 | 1985-07-24 | Electric contact |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6224509A JPS6224509A (en) | 1987-02-02 |
| JPH0429166B2 true JPH0429166B2 (en) | 1992-05-18 |
Family
ID=15777601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16363185A Granted JPS6224509A (en) | 1985-07-24 | 1985-07-24 | Electric contact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6224509A (en) |
-
1985
- 1985-07-24 JP JP16363185A patent/JPS6224509A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6224509A (en) | 1987-02-02 |
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