JPH04291987A - Packaging structure of surface mounted parts - Google Patents
Packaging structure of surface mounted partsInfo
- Publication number
- JPH04291987A JPH04291987A JP3057335A JP5733591A JPH04291987A JP H04291987 A JPH04291987 A JP H04291987A JP 3057335 A JP3057335 A JP 3057335A JP 5733591 A JP5733591 A JP 5733591A JP H04291987 A JPH04291987 A JP H04291987A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- smd
- mounting
- surface mount
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は表面実装部品の実装構造
に関する。近年の装置の小型化に伴い装置内に搭載する
プリント基板等の装置を構成する部品夫々の小型化が要
望されており、特にプリント基板では部品（表面実装部
品）をより高密度に実装することによりプリント基板の
装置内で占有する面積の縮小化を図っている。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for surface mount components. With the miniaturization of devices in recent years, there is a demand for miniaturization of each component that makes up the device, such as printed circuit boards mounted inside the device.In particular, printed circuit boards require higher density mounting of components (surface-mounted components). This aims to reduce the area occupied by the printed circuit board within the device.
【０００２】0002
【従来の技術】表面実装部品（以下ＳＭＤと称する）の
プリント基板への搭載方法を図５及び図６に示し、従来
のＳＭＤリードとリード搭載用パッドの接続構造を図３
及び図４に示す。[Prior Art] A method for mounting a surface mount device (hereinafter referred to as SMD) on a printed circuit board is shown in FIGS. 5 and 6, and a connection structure between a conventional SMD lead and a lead mounting pad is shown in FIG.
and shown in FIG.
【０００３】まず図５及び図６を参照しＳＭＤ部品の搭
載方法を説明する。プリント基板９は１面に回路パター
ンが形成され、部品を搭載すべきパッド部を除きレジス
ト１０等の絶縁樹脂によりコーティングして形成され、
このプリント基板９にＳＭＤ部品１１が搭載される。プ
リント基板９に搭載されたＳＭＤ部品１１はプリント基
板の回路パターン間とＳＭＤリード３により接続される
。（図５参照）ここで使用されるＳＭＤリード３は例え
ば金リボンで形成されたリードであり、複数のリードが
バラバラにならないよう紙テープ１３等により固定され
ているものが用いられる。このＳＭＤリード３とリード
搭載用パッド７との間又はＳＭＤ部品１１の端子１４と
の間の接続方法を図６を参照して説明すると、ＳＭＤ部
品１１の端子１４とプリント基板９のリード搭載用パッ
ド７のＳＭＤリード搭載面に半田２、４、６、１２を盛
り、ＳＭＤリード３を上部から熱圧着することによりＳ
ＭＤ部品１１とプリント基板の回路パターンが接続され
る。First, a method for mounting SMD components will be explained with reference to FIGS. 5 and 6. The printed circuit board 9 has a circuit pattern formed on one side, and is coated with an insulating resin such as a resist 10, except for the pad portion where components are to be mounted.
An SMD component 11 is mounted on this printed circuit board 9. The SMD components 11 mounted on the printed circuit board 9 are connected between the circuit patterns of the printed circuit board through the SMD leads 3. (See FIG. 5) The SMD leads 3 used here are made of, for example, gold ribbon, and are fixed with paper tape 13 or the like so that the plurality of leads do not come apart. The connection method between the SMD lead 3 and the lead mounting pad 7 or between the terminal 14 of the SMD component 11 will be explained with reference to FIG. Solders 2, 4, 6, and 12 are applied to the SMD lead mounting surface of pad 7, and SMD lead 3 is bonded by thermocompression from above.
The MD component 11 and the circuit pattern of the printed circuit board are connected.
【０００４】次に図３及び図４を参照し、従来のリード
搭載用パッドとＳＭＤリード間の接続構造について説明
する。図４に於いて、リード搭載用パッド７はＳＭＤリ
ードに比べ幅が広く、且つＳＭＤリード３が半田６を挟
んで対する面に凹部が形成されて構成される。このリー
ド搭載用パッド７とＳＭＤリード３は上述のとうり熱圧
着による半田付けにより接続される。ここで、リード搭
載用パッド７の幅がＳＭＤリード３の幅に比べ大きく設
定されているため、ＳＭＤリード３の両側面に半田が裾
を引くようにフィレットが形成されＳＭＤリード３とリ
ード搭載用パッド７との間の接続強度が向上する。しか
しながら、プリント基板の実装密度を高めていくと、リ
ード搭載用パッドの幅をＳＭＤリードの幅に対して大き
くすることが困難な状況となる。よって従来、よりプリ
ント基板の実装密度を向上させる場合、図３に示すよう
にリード搭載用パッド５の幅とＳＭＤリード３の幅を略
同じ幅とする事により、プリント基板の実装密度の向上
に対応している。Next, a conventional connection structure between lead mounting pads and SMD leads will be described with reference to FIGS. 3 and 4. In FIG. 4, the lead mounting pad 7 is wider than the SMD lead, and has a concave portion formed on the surface of the SMD lead 3 facing the solder 6. The lead mounting pad 7 and the SMD lead 3 are connected by thermocompression soldering as described above. Here, since the width of the lead mounting pad 7 is set larger than the width of the SMD lead 3, fillets are formed on both sides of the SMD lead 3 so that the solder skirts the SMD lead 3 and the lead mounting pad 7. The strength of the connection with the pad 7 is improved. However, as the mounting density of printed circuit boards increases, it becomes difficult to make the width of the lead mounting pad larger than the width of the SMD lead. Therefore, in order to further improve the mounting density of a printed circuit board, conventionally, as shown in FIG. Compatible.
【０００５】[0005]
【発明が解決しようとする課題】以上のように従来のＳ
ＭＤ部品の実装構造としては、リード搭載用パッドの幅
がＳＭＤリードと略同じ幅で中央部に凹部を有する構成
となる。このような構成のリード搭載用パッドとＳＭＤ
リードを熱圧着により半田付けした場合、リード搭載用
パッドとＳＭＤリードとの間にフィレットが形成されに
くく、且つリード搭載用パッドとＳＭＤリードとの間か
ら半田が大きくはみ出し、リード搭載用パッド間でブリ
ッジを形成する又は、はみ出した半田が加熱ツールに付
着する等の問題が生ずる。[Problem to be solved by the invention] As described above, the conventional S
The mounting structure for the MD component is such that the lead mounting pad has approximately the same width as the SMD lead and has a recessed portion in the center. Lead mounting pad and SMD with this configuration
When the leads are soldered by thermocompression bonding, fillets are difficult to form between the lead mounting pads and the SMD leads, and a large amount of solder protrudes from between the lead mounting pads and the SMD leads, causing problems between the lead mounting pads and the SMD leads. Problems such as formation of bridges or adhesion of protruding solder to the heating tool occur.
【０００６】以上のような問題を解決する為、本発明に
おいてはプリント基板の実装密度を向上させるのに好適
なＳＭＤ実装構造を提供することを目的としている。In order to solve the above-mentioned problems, the present invention aims to provide an SMD mounting structure suitable for improving the mounting density of a printed circuit board.
【０００７】[0007]
【課題を解決するための手段】図１に本発明のＳＭＤ実
装構造を示す。図に於いて、リード搭載用パッドの形状
を中央部に凸部を有する構成とし、半田をリード搭載用
パッドの突出部の上面と、突出部を挟む平面に一様に盛
り、ＳＭＤリードを熱圧着により半田付けを行なう。Means for Solving the Problems FIG. 1 shows an SMD mounting structure of the present invention. In the figure, the shape of the lead mounting pad is configured to have a convex part in the center, and solder is uniformly applied to the upper surface of the protruding part of the lead mounting pad and the flat surface sandwiching the protruding part, and the SMD lead is heated. Solder by crimping.
【０００８】[0008]
【作用】以上のように本発明に於いては、凸状に形成さ
れたリード搭載用パッドにＳＭＤリードを熱圧着したと
き、ＳＭＤリードと凸状のリード搭載用パッド間の半田
が凸部の切欠き部に流れ込み半田のはみ出す側面の幅が
広くなるため半田のはみ出しの行きを短くでき、半田の
はみ出しによるフィレットの形成が従来に比べて容易と
なる。[Function] As described above, in the present invention, when an SMD lead is thermocompression bonded to a convex lead mounting pad, the solder between the SMD lead and the convex lead mounting pad is removed from the convex part. Since the width of the side surface from which the solder flows into the notch and protrudes becomes wider, the distance of the solder protruding can be shortened, and it becomes easier to form a fillet by the solder protruding than before.
【０００９】[0009]
【実施例】本発明の実施例を図１及び図２を用いて説明
する。図に於いて、１，５，７はリード搭載用パッド、
２，４，６，１２は半田、３はＳＭＤリード、９はプリ
ント基板、１０はレジスト、１１はＳＭＤ部品、１３は
紙テープ、１４はＳＭＤ部品の端子である。[Embodiment] An embodiment of the present invention will be described with reference to FIGS. 1 and 2. In the figure, 1, 5, 7 are lead mounting pads,
2, 4, 6, and 12 are solders, 3 is an SMD lead, 9 is a printed circuit board, 10 is a resist, 11 is an SMD component, 13 is a paper tape, and 14 is a terminal of the SMD component.
【００１０】以下図面に基いて本発明の一実施例を詳細
に説明する。図に於いて、プリント基板上に形成された
回路パターン（Ｃｕ）のＳＭＤ部品のリード搭載用パッ
ド部１をレーザエッチング等の手法により約１０μｍの
凸状を成すよう形成し、このエッチングにより形成され
た突出部の上面と突出部を挟む平面部にメッキ又はスク
リーン印刷等の手法により半田２を５〜７μｍ一様に供
給し、（図２参照）該リード搭載用パッド１の凸部上部
よりＳＭＤリード３を熱圧着により半田付けする。この
時、熱圧着によりリード搭載用パッドの半田が溶融し突
出部上面の半田が突出部脇の切欠き部に流れ込み、この
切欠き部に半田が一杯に詰まった時半田は切欠き部より
浅広いはみ出しが生じフィレッドが形成されやすい状況
を作る。（図１参照）このようにリード搭載用パッド１
とＳＭＤリード３とは半田付けされる。An embodiment of the present invention will be described in detail below with reference to the drawings. In the figure, a lead mounting pad portion 1 of an SMD component with a circuit pattern (Cu) formed on a printed circuit board is formed by a method such as laser etching to form a convex shape of approximately 10 μm. Solder 2 is uniformly supplied in a thickness of 5 to 7 μm to the top surface of the protrusion and the flat surface sandwiching the protrusion by a method such as plating or screen printing (see FIG. 2), and the SMD is applied from the top of the protrusion of the lead mounting pad 1. The leads 3 are soldered by thermocompression bonding. At this time, the solder on the lead mounting pad melts due to thermocompression, and the solder on the top surface of the protrusion flows into the notch next to the protrusion, and when this notch is completely filled with solder, the solder is shallower than the notch. This creates a situation where a wide protrusion occurs and fillet is likely to form. (See Figure 1) Like this, lead mounting pad 1
and SMD lead 3 are soldered.
【００１１】実際にアウター・リード・ボンディングに
用いられるリードのピッチ（ＴＡＢのＯＬＢピッチ）は
略２５０〜８０μｍであり、以上で示した本発明を適用
する事によりにりより品質の安定した部品の実装が可能
となまる。The lead pitch (TAB OLB pitch) actually used in outer lead bonding is approximately 250 to 80 μm, and by applying the present invention described above, parts with more stable quality can be produced. Implementation is possible.
【００１２】0012
【発明の効果】以上のように本発明によれば、ＳＭＤの
搭載にあたり半田のはみ出しをが浅広くなりフィレット
が形成されやすい状況をができるため、リードとパッド
の接続強度を低下させず、且つ高密度実装に適したＳＭ
Ｄ実装構造を提供できる。[Effects of the Invention] As described above, according to the present invention, when mounting an SMD, it is possible to make the solder protrude shallow and wide, thereby creating a situation where fillets are likely to be formed. SM suitable for high-density mounting
D mounting structure can be provided.
【図１】本発明のＳＭＤ実装構造を示す図[Fig. 1] A diagram showing the SMD mounting structure of the present invention.
【図２】本発
明のリード搭載用パッドに半田を一様に盛った図[Figure 2] Diagram showing solder uniformly applied to the lead mounting pad of the present invention
【図３】従来のリード搭載用パッドにＳＭＤリードを半
田付けした図[Figure 3] Diagram showing SMD leads soldered to conventional lead mounting pads
【図４】従来の幅が異なるリード搭載用パッドとＳＭＤ
リードとを半田付けした図[Figure 4] Conventional lead mounting pads with different widths and SMD
Diagram of soldering with leads
【図５】プリント基板にＳＭＤ部品を搭載した概略を示
す図[Figure 5] Diagram showing an outline of mounting SMD components on a printed circuit board
【図６】ＳＭＤ部品をプリント基板の回路パターンと接
続する方法を示す図[Figure 6] Diagram showing how to connect SMD components to circuit patterns on a printed circuit board
１．５．７・・・リード搭載用パッド、２．４．６．１
２・・・半田、 ３・・・ＳＭＤリード、
９・・・プリント基板、 １０・・・レジスト、１１
・・・ＳＭＤ部品、 １３・・・紙テープ、１４・・
・ＳＭＤ部品の端子、1.5.7...Lead mounting pad, 2.4.6.1
2...Solder, 3...SMD lead, 9...Printed circuit board, 10...Resist, 11
...SMD parts, 13...Paper tape, 14...
・Terminals for SMD parts,
Claims (2)
（９）に搭載し、該表面実装部品の上面に形成された表
面実装部品の端子（１４）と該プリント基板（９） の
表面に形成された表面実装部品のリード搭載用パッド（
１．５．７） とを表面実装用リード（３） により接
続する表面実装部品の実装構造に於いて、該プリント基
板（９）の表面に形成する表面実装部品のリード搭載用
パッド（１．５．７） を凸型としたことを特徴とする
表面実装部品の実装構造。1. A surface mount component (11) is mounted on a printed circuit board (9), and a terminal (14) of the surface mount component formed on the top surface of the surface mount component and a terminal (14) formed on the surface of the printed circuit board (9) are provided. Pads for mounting leads on surface mount components (
1.5.7) In a surface mount component mounting structure in which a surface mount component is connected by a surface mount lead (3), a surface mount component lead mounting pad (1. 5.7) A mounting structure for surface mount components characterized by having a convex shape.
ード搭載用パッド（１）の突出した上面と、突出部を挟
む平面に半田を一様に盛り、該凸型表面実装部品のリー
ド搭載用パッド（１）の上面に表面実装用リード（３）
を熱圧着することを特徴とする表面実装部品の実装構
造。2. Solder is uniformly applied to the protruding upper surface of the lead mounting pad (1) of the convex surface mount component according to claim 1 and the flat surface sandwiching the protrusion, and the lead of the convex surface mount component is Surface mounting lead (3) on the top surface of the mounting pad (1)
A mounting structure for surface mount components characterized by thermocompression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3057335A JPH04291987A (en) | 1991-03-20 | 1991-03-20 | Packaging structure of surface mounted parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3057335A JPH04291987A (en) | 1991-03-20 | 1991-03-20 | Packaging structure of surface mounted parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04291987A true JPH04291987A (en) | 1992-10-16 |
Family
ID=13052703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3057335A Withdrawn JPH04291987A (en) | 1991-03-20 | 1991-03-20 | Packaging structure of surface mounted parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04291987A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6498308B2 (en) | 1999-04-02 | 2002-12-24 | Oki Electric Industry Co., Ltd. | Semiconductor module |
-
1991
- 1991-03-20 JP JP3057335A patent/JPH04291987A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6498308B2 (en) | 1999-04-02 | 2002-12-24 | Oki Electric Industry Co., Ltd. | Semiconductor module |
| KR100789306B1 (en) * | 1999-04-02 | 2007-12-28 | 오끼 덴끼 고오교 가부시끼가이샤 | Semiconductor module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980514 |