JPH0429209U - - Google Patents
Info
- Publication number
- JPH0429209U JPH0429209U JP7001890U JP7001890U JPH0429209U JP H0429209 U JPH0429209 U JP H0429209U JP 7001890 U JP7001890 U JP 7001890U JP 7001890 U JP7001890 U JP 7001890U JP H0429209 U JPH0429209 U JP H0429209U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- external
- metal ball
- holes
- ground pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims 3
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案による電磁遅延線の一実施例を
示す底面図および要部断面図、第２図は同電磁遅
延線のアースパターンとストリツプライン・パタ
ーンを示す要部平面図、第３図は従来の電磁遅延
線の一例の要部外観図である。
図中、１はアースパターン、２はセラミツク基
板、３，４はアースパターン、６はスルーホール
、７，１２はストリツプライン・パターン、１１
は電磁遅延線、１３は接続端子である。
Fig. 1 is a bottom view and a sectional view of the main parts of an embodiment of the electromagnetic delay line according to the present invention, Fig. 2 is a plan view of the main parts showing the ground pattern and stripline pattern of the electromagnetic delay line, and Fig. 3 The figure is an external view of the main parts of an example of a conventional electromagnetic delay line. In the figure, 1 is a ground pattern, 2 is a ceramic substrate, 3 and 4 are ground patterns, 6 is a through hole, 7 and 12 are stripline patterns, and 11
is an electromagnetic delay line, and 13 is a connection terminal.
Claims (1)
スパターンを上面にした第１セラミツク基板にス
ルーホールを設けてアースパターンと接続し、ア
ースパターンを下面にした第２セラミツク基板に
複数の孔を設け第１外部引き出し用金属ボールと
第２外部引き出し用金属ボールをそれぞれの孔に
載置し、前記第１セラミツク基板を上部にし前記
第２セラミツク基板を下部にして重ね合わせ、前
記スルーホールと前記第１外部引き出し用金属ボ
ールを半田付けし、前記ストリツプライン・パタ
ーンと前記第２外部引き出し用金属ボールをそれ
ぞれ半田付けして構成した電磁遅延線。 A through hole is provided in the first ceramic substrate with the stripline pattern facing down and the ground pattern is the top surface, and a through hole is connected to the ground pattern, and a plurality of holes are provided in the second ceramic substrate with the ground pattern facing down, and the first external A drawer metal ball and a second external drawer metal ball are placed in their respective holes, and the first ceramic substrate is placed on top and the second ceramic substrate is placed on the bottom, and the through holes and the first external drawer are placed one on top of the other. The electromagnetic delay line is constructed by soldering the stripline pattern and the second external lead-out metal ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7001890U JPH0429209U (en) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7001890U JPH0429209U (en) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0429209U true JPH0429209U (en) | 1992-03-09 |
Family
ID=31605826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7001890U Pending JPH0429209U (en) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429209U (en) |
-
1990
- 1990-06-29 JP JP7001890U patent/JPH0429209U/ja active Pending