JPH04294552A - Wire-bonding method - Google Patents

Wire-bonding method

Info

Publication number
JPH04294552A
JPH04294552A JP3059915A JP5991591A JPH04294552A JP H04294552 A JPH04294552 A JP H04294552A JP 3059915 A JP3059915 A JP 3059915A JP 5991591 A JP5991591 A JP 5991591A JP H04294552 A JPH04294552 A JP H04294552A
Authority
JP
Japan
Prior art keywords
bonding
pellet
wire
pad
stitch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3059915A
Other languages
Japanese (ja)
Inventor
Takumi Honda
本多　巧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP3059915A priority Critical patent/JPH04294552A/en
Publication of JPH04294552A publication Critical patent/JPH04294552A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To obtain a load needed for bonding and enable shock load to be reduced by performing ball bonding to a bonding pad of one pellet and stitch bonding to the bonding pad of the other pellet through a protruding electrode. CONSTITUTION:A pellet 2 is mounted to an island 1 of a lead frame. Then, stitch bonding is performed to a bonding pad 3 of the pellet 2. In this case, stitch bonding is performed on an aluminum electrode of the bonding pad 3 through a protruding electrode 4. The protruding electrode 4 interposed between the bonding pad 3 and a gold wire 5 can be produced by many bump-forming technologies.

Description

【発明の詳細な説明】[Detailed description of the invention]

【０００１】0001

【産業上の利用分野】この発明はペレットのボンディン
グパッドにステッチボンディングするワイヤボンディン
グ方法に関するものであり、特にマルチペレットのペレ
ットトゥペレットまたはロングワイヤーに適したもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method for stitch bonding to bonding pads of pellets, and is particularly suitable for multi-pellet pellet-to-pellet or long wire bonding.

【０００２】0002

【従来の技術】ワイヤーボンディングのボールボンディ
ング法について動作概要を説明する。2. Description of the Related Art An outline of the operation of the ball bonding method of wire bonding will be explained.

【０００３】金ワイヤーはキャピラリーツールを通り、
キャピラリーツールの先端に金ボールが形成され、キャ
ピラリーツールが降下し金ボールをボンディングパッド
のアルミニウム電極に押し付け、金ボールを変形させる
ことにより、金とアルミニウムが接合する（以下、ボー
ルボンディングと呼ぶ）。その時ペレットは２５０〜３
００℃程度に加熱されている。次にキャピラリーツール
を電気的に導通させたい側に移し、金ワイヤーの端をそ
の箇所へ押し付け、金ワイヤーの変形により接合する（
以下、ステッチボンディングと呼ぶ）。その後、金ワイ
ヤーをクランパでクランプし引き上げることにより接合
部端部で金ワイヤーを切断し、一つの結線が完了する。 続いてボール形成用トーチにより、金ボール形成が行な
われる。[0003] The gold wire passes through a capillary tool,
A gold ball is formed at the tip of the capillary tool, and the capillary tool descends and presses the gold ball against the aluminum electrode of the bonding pad, deforming the gold ball to bond the gold and aluminum (hereinafter referred to as ball bonding). At that time the pellets were 250-3
It is heated to about 00℃. Next, move the capillary tool to the side where you want electrical conduction, press the end of the gold wire to that point, and join by deforming the gold wire (
(hereinafter referred to as stitch bonding). Thereafter, the gold wire is clamped with a clamper and pulled up to cut the gold wire at the end of the joint, completing one connection. Next, gold balls are formed using a ball forming torch.

【０００４】従来、一般的にはペレットのパッドとリー
ドフレームのフィンガとをワイヤーで接続する場合、パ
ッド側がボールボンディングとなり、フィンガ側がステ
ッチボンディングとなる。したがって、キャピラリーツ
ールの先端は、パッド側は金ボールを介するため非接触
となり、フィンガ側は接触してしまうが、双方共に良好
な接合が得られ、またダメージも無く安定したワイヤー
ボンディングが行えた。また、マルチペレットのワイヤ
ーボンディングにおいては、図６に示すように電気的に
導通させたいパッド同士を、フィンガ側に双方のステッ
チボンディングを行ない、結線を行なっていたため特に
問題はなかった。Conventionally, when connecting a pad of a pellet and a finger of a lead frame with a wire, ball bonding is generally used on the pad side, and stitch bonding is used on the finger side. Therefore, although the tip of the capillary tool was not in contact with the pad side due to the gold ball and was in contact with the finger side, good bonding was obtained on both sides, and stable wire bonding was performed without damage. Further, in the wire bonding of multi-pellets, there was no particular problem because the pads to be electrically connected to each other were connected by stitch bonding on the finger side as shown in FIG.

【０００５】一方、ペレットの中央部にボンディングパ
ッドが配置されたような場合もあるが、これらのワイヤ
ーボンディングについても一般にパッド側ボールボンデ
ィング、フィンガ側ステッチボンディングにて行なって
いた。On the other hand, although there are cases in which a bonding pad is placed in the center of the pellet, wire bonding for these has also generally been performed by ball bonding on the pad side and stitch bonding on the finger side.

【０００６】[0006]

【発明が解決しようとする課題】しかしながらマルチペ
レットの場合、リ−ドフィンガを介さずにペレットとペ
レット間を直接ワイヤ−で接続する必要があるが、図７
に示すように従来方法でペレットトゥペレットのワイヤ
ーボンディングを行なうと、一方のペレットのボンディ
ングパッドはステッチボンディングを行なうことになり
、キャピラリーツールの先端とペレットのアルミニウム
電極部が直接接触するため、ワイヤーボンダーのツール
上下動機構が生み出した衝撃が直接チップにダメージを
与えてしまうため、ステッチボンディング側のパッドへ
のダメージが大きくボンディング性、品質面で不安定で
あった。However, in the case of multi-pellets, it is necessary to directly connect the pellets with wires without using lead fingers.
When performing pellet-to-pellet wire bonding using the conventional method as shown in Figure 2, stitch bonding is performed on the bonding pad of one pellet, and the tip of the capillary tool and the aluminum electrode of the pellet come into direct contact, so the wire bonder The shock generated by the vertical movement mechanism of the tool directly damages the chip, which causes significant damage to the pad on the stitch bonding side, making bonding performance and quality unstable.

【０００７】また、ペレット中央部のボンディングパッ
ドからのワイヤーボンディングについては、図８に示す
ようにパッド側ボールボンディング、フィンガ側ステッ
チボンディングにて行なっているが、ロングワイヤーと
なるため、ワイヤータレ、ワイヤー変形などの不具合が
発生し、それを抑制するために、機構的なループコント
ロールが必要であるが充分ではなかった。Furthermore, wire bonding from the bonding pad at the center of the pellet is performed by ball bonding on the pad side and stitch bonding on the finger side, as shown in FIG. Problems such as deformation occur, and mechanical loop control is necessary to suppress it, but it is not sufficient.

【０００８】本発明は上記従来の問題点を解決するもの
で高品質でボンディング性に優れたワイヤ−ボンディン
グ方法を提供することを目的とする。The present invention solves the above-mentioned conventional problems and aims to provide a wire bonding method with high quality and excellent bonding properties.

【０００９】[0009]

【課題を解決するための手段】この目的を達成するため
に本発明のワイヤ−ボンディング方法は、同一基板上に
配置された複数のペレット間をワイヤ−ボンディングに
より接続するに際し、一方のペレットのボンディングパ
ッドにはボ−ルボンディングをし、他方のペレットのボ
ンディングパッドにはパッド上に形成された突起電極を
介してステッチボンディングを行なうことを特徴とする
。[Means for Solving the Problems] In order to achieve this object, the wire bonding method of the present invention provides a wire bonding method for connecting a plurality of pellets arranged on the same substrate by wire bonding. It is characterized in that ball bonding is performed on the pad, and stitch bonding is performed on the bonding pad of the other pellet via a protruding electrode formed on the pad.

【００１０】また、リ−ドフレ−ムのリ−ドフィンガと
、リ−ドフレ−ムのアイランド上に配置されたペレット
の中央部に位置するボンディングパッドとをワイヤ−ボ
ンディングにより接続するに際し、前記リ−ドフィンガ
側にはボ−ルボンディングを行い、前記ペレットのボン
ディングパッドにはパッド上に形成された突起電極を介
してステッチボンディングを行なうことを特徴とする。[0010] Furthermore, when connecting the lead fingers of the lead frame and the bonding pad located at the center of the pellet disposed on the island of the lead frame by wire bonding, Ball bonding is performed on the dofinger side, and stitch bonding is performed on the bonding pad of the pellet via a protruding electrode formed on the pad.

【００１１】[0011]

【作用】本発明の、ボンディングパッドのアルミニウム
電極上に突起電極を介してステッチボンディングを行な
う方法によって、キャピラリーツールの先端がペレット
のアルミニウム電極上に接触しないでボンディングが行
えるものである。[Operation] By the method of the present invention in which stitch bonding is performed on the aluminum electrode of the bonding pad via the protruding electrode, bonding can be performed without the tip of the capillary tool coming into contact with the aluminum electrode of the pellet.

【００１２】さらに、ロングワイヤーのボンディングに
ついては、ループ直進性の高い、安定したルーピングが
得られ、ワイヤータレ抑制が図れるものである。Furthermore, in bonding long wires, stable looping with high loop straightness can be obtained, and wire sagging can be suppressed.

【００１３】[0013]

【実施例】以下本発明の実施例について、図面を参照し
ながら説明する。図１はであり、リードフレームのアイ
ランド１にペレット２を付けペレットのボンディングパ
ッド３にステッチボンディングを行なう際にボンディン
グパッドのアルミニウム電極上に突起電極４を介してス
テッチボンディングを行なうものである、ボンディング
パッド３と金ワイヤー５に介在する突起電極４は、数々
のバンプ形成技術により可能であるが、その方法の一つ
であるスタッドバンプについて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below with reference to the drawings. FIG. 1 shows a bonding process in which a pellet 2 is attached to an island 1 of a lead frame, and when stitch bonding is performed to a bonding pad 3 of the pellet, stitch bonding is performed via a protruding electrode 4 on an aluminum electrode of the bonding pad. The protruding electrode 4 interposed between the pad 3 and the gold wire 5 can be formed using a number of bump forming techniques, and one of the methods, a stud bump, will be described.

【００１４】ボンディングパッドのアルミニウム電極上
３に金ボールのみを変形接着させる、その後、金ワイヤ
ーをクランパにて保持したまま引き上げ、金ボールネッ
ク部にて切断し、図４に示すようなバンプ状態となる、
その後、バンプ整形用キャピラリーツールにてバンプを
上部より押し、凸部をほぼ平坦な形に整形し図５に示す
ような状態とする。したがって、ボンディングパッドに
ステッチボンディングを行なう際は、事前に図５に示す
ようなバンプ形成を行なうことによりキャピラリーツー
ルの先端がアルミニウム電極部に接触しないでステッチ
ボンディングが可能となり、ワイヤーボンダーのツール
上下動機構が生み出した衝撃が、直接ペレットにダメー
ジを与えないで、良好な接合が得られる、したがって、
図１に示すようなペレットトゥペレットのワイヤーボン
ディングが容易に行えるものである。[0014] Only the gold ball is deformed and bonded on the aluminum electrode 3 of the bonding pad, and then the gold wire is pulled up while being held by a clamper and cut at the neck of the gold ball, resulting in a bump state as shown in Fig. 4. Become,
Thereafter, the bump is pressed from above using a bump shaping capillary tool to shape the convex portion into a substantially flat shape as shown in FIG. Therefore, when performing stitch bonding on a bonding pad, by forming a bump in advance as shown in Figure 5, stitch bonding can be performed without the tip of the capillary tool coming into contact with the aluminum electrode part, and the vertical movement of the tool of the wire bonder can be performed. The impact generated by the mechanism does not directly damage the pellets, resulting in good bonding.
Pellet-to-pellet wire bonding as shown in FIG. 1 can be easily performed.

【００１５】さらに他の実施例として図２に示すように
、ペレット中央部のボンディングパッド３とリードフレ
ームのフィンガ６とを、金ワイヤー５で接続するロング
ワイヤーに於いてもペレットのボンディングパッドのア
ルミニウム電極上に突起電極４を介してステッチボンデ
ィングが可能である。この場合、フィンガ６にボ−ルボ
ンドすなわちファ−ストボンドを行なった後、金ワイヤ
−５は一旦上方へ持ち上げられ引続きペレット中央部の
突起電極４にステッチボンドすなわちセカンドボンドが
行なわれる。このため同図のように金ワイヤ−５はペレ
ット端部に対して充分な距離と高さが保たれ、ロングワ
イヤ−であってもワイヤ−たれ等によるペレットとの接
触が防止できる。As yet another embodiment, as shown in FIG. 2, in the long wire connecting the bonding pad 3 at the center of the pellet and the finger 6 of the lead frame with the gold wire 5, the aluminum of the bonding pad of the pellet is connected. Stitch bonding is possible on the electrode via the protruding electrode 4. In this case, after ball bonding, ie, first bonding, is performed on the finger 6, the gold wire 5 is once lifted upward, and subsequently, stitch bonding, ie, second bonding is performed on the protruding electrode 4 at the center of the pellet. Therefore, as shown in the figure, the gold wire 5 is kept at a sufficient distance and height from the end of the pellet, and even if it is a long wire, contact with the pellet due to wire sag can be prevented.

【００１６】なお、同様の効果はロングワイヤ−の場合
に限らず、図３に示すようにボンディングパッドがペレ
ットの端部に位置している場合にも得られるものである
。Note that similar effects can be obtained not only in the case of long wires but also in cases where the bonding pad is located at the end of the pellet as shown in FIG.

【００１７】なお、本実施例ではスタッドバンプを用い
たが、他の導電性バンプでも実現できることは言うまで
もないことである。Although stud bumps were used in this embodiment, it goes without saying that other conductive bumps can also be used.

【００１８】[0018]

【発明の効果】以上のように本発明は、ボンディングパ
ッドにステッチボンディングを行なう際、突起電極を介
して行なうので、接合に必要な荷重を十分に得て、かつ
衝撃荷重を小さくできるため、ボンディングパッド周辺
のペレットへのダメージを抑制できる。As described above, in the present invention, when stitch bonding is performed on a bonding pad, it is performed via a protruding electrode, so that the load required for bonding can be obtained sufficiently, and the impact load can be reduced. Damage to pellets around the pad can be suppressed.

【００１９】また、ペレット中央部でのボンディングパ
ッドへのステッチボンディングについては、安定したル
ーピングでロングワイヤーが可能となり、さらにペレッ
ト中央部へのボンディングパッドレイアウトも可能にな
る。[0019] Furthermore, as for stitch bonding to the bonding pad at the center of the pellet, long wires can be used with stable looping, and bonding pad layout at the center of the pellet is also possible.

【図面の簡単な説明】[Brief explanation of drawings]

【図１】本発明のワイヤーボンディング方法の一実施例
を説明するための接続部分の拡大側面図FIG. 1: An enlarged side view of a connecting portion for explaining an embodiment of the wire bonding method of the present invention.

【図２】本実施
例のワイヤーボンディングを示す側面図[Figure 2] Side view showing wire bonding of this example

【図３】本発明
の他実施例におけるワイヤーボンディングを説明するた
めの側面図FIG. 3 is a side view for explaining wire bonding in another embodiment of the present invention.

【図４】スタッドバンプの斜視図[Figure 4] Perspective view of stud bump

【図５】スタッドバンプ、スタンピング後の斜視図[Figure 5] Stud bump, perspective view after stamping

【図
６】従来のマルチペレットワイヤーボンディングを説明
するための側面図[Figure 6] Side view for explaining conventional multi-pellet wire bonding

【図７】従来のペレットトゥペレットワイヤーボンディ
ングを説明するための側面図[Figure 7] Side view for explaining conventional pellet-to-pellet wire bonding

【図８】従来のペレット中央部からのワイヤーボンディ
ングを説明するための側面図[Figure 8] Side view for explaining conventional wire bonding from the center of the pellet

【符号の説明】[Explanation of symbols]

１　　リードフレーム、アイランド ２　　ペレット ３　　ボンディングパッド、アルミニウム電極部４　　
バンプ ５　　金ワイヤー ６　　リードフレーム、フィンガ1 Lead frame, island 2 Pellet 3 Bonding pad, aluminum electrode part 4
Bump 5 Gold wire 6 Lead frame, finger

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】同一基板上に配置された複数のペレット間
をワイヤ−ボンディングにより接続するに際し、一方の
ペレットのボンディングパッドにはボ−ルボンディング
を行い、他方のペレットのボンディングパッドにはパッ
ド上に形成された突起電極を介してステッチボンディン
グを行なうことを特徴とするワイヤ−ボンディング方法
。Claim 1: When connecting a plurality of pellets arranged on the same substrate by wire bonding, ball bonding is performed on the bonding pad of one pellet, and the bonding pad of the other pellet is bonded on the pad. A wire bonding method characterized in that stitch bonding is performed through protruding electrodes formed on the wire. 【請求項２】リ−ドフレ−ムのリ−ドフィンガと、リ−
ドフレ−ムのアイランド上に配置されたペレットのボン
ディングパッドとをワイヤ−ボンディングにより接続す
るに際し、前記リ−ドフィンガ側にはボ−ルボンディン
グを行い、前記ペレットのボンディングパッドにはパッ
ド上に形成された突起電極を介してステッチボンディン
グを行なうことを特徴とするワイヤ−ボンディング方法
。Claim 2: A lead finger of a lead frame and a lead frame.
When connecting the bonding pads of the pellets arranged on the islands of the dome frame by wire bonding, ball bonding is performed on the lead finger side, and the bonding pads of the pellets are connected to the bonding pads of the pellets formed on the pads. A wire bonding method characterized in that stitch bonding is performed through a protruding electrode. 【請求項３】突起電極が形成されたボンディングパッド
が、前記ペレットの中央部に位置していることを特徴と
する請求項２記載のワイヤ−ボンディング方法。3. The wire bonding method according to claim 2, wherein the bonding pad on which the protruding electrode is formed is located at the center of the pellet.
JP3059915A 1991-03-25 1991-03-25 Wire-bonding method Pending JPH04294552A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3059915A JPH04294552A (en) 1991-03-25 1991-03-25 Wire-bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3059915A JPH04294552A (en) 1991-03-25 1991-03-25 Wire-bonding method

Publications (1)

Publication Number Publication Date
JPH04294552A true JPH04294552A (en) 1992-10-19

Family

ID=13126904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3059915A Pending JPH04294552A (en) 1991-03-25 1991-03-25 Wire-bonding method

Country Status (1)

Country Link
JP (1) JPH04294552A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997012394A1 (en) * 1995-09-26 1997-04-03 Siemens Aktiengesellschaft Method of electrically connecting a semiconductor chip to at least one contact surface
WO1998021780A3 (en) * 1996-11-11 1998-06-25 Siemens Ag A connection between two contacts and a process for producing such a connection
US6079610A (en) * 1996-10-07 2000-06-27 Denso Corporation Wire bonding method
EP1094517A3 (en) * 1999-10-19 2002-04-10 Fujitsu Limited Semiconductor device and method for producing the same
US6420256B1 (en) * 1997-04-22 2002-07-16 Micron Technology, Inc. Method of improving interconnect of semiconductor devices by using a flattened ball bond
US6601752B2 (en) 2000-03-13 2003-08-05 Denso Corporation Electronic part mounting method
EP1367644A1 (en) * 2002-05-29 2003-12-03 STMicroelectronics S.r.l. Semiconductor electronic device and method of manufacturing thereof
US6803665B1 (en) * 2001-11-02 2004-10-12 Skyworks Solutions, Inc. Off-chip inductor
JP2005340677A (en) * 2004-05-31 2005-12-08 Matsushita Electric Ind Co Ltd Wire bonder holding parts and support parts
US7067413B2 (en) 2003-09-04 2006-06-27 Samsung Electronics Co., Ltd. Wire bonding method, semiconductor chip, and semiconductor package

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6039254B2 (en) * 1976-12-09 1985-09-05 ハ−マン・ウント・ライマ−・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング Method for producing alkylaryl ethers
JPH01293626A (en) * 1988-05-23 1989-11-27 Ricoh Co Ltd Wire bonding method in flexible wiring board
JPH02114545A (en) * 1988-10-24 1990-04-26 Toshiba Corp Connection of wire bonding

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6039254B2 (en) * 1976-12-09 1985-09-05 ハ−マン・ウント・ライマ−・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング Method for producing alkylaryl ethers
JPH01293626A (en) * 1988-05-23 1989-11-27 Ricoh Co Ltd Wire bonding method in flexible wiring board
JPH02114545A (en) * 1988-10-24 1990-04-26 Toshiba Corp Connection of wire bonding

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100377077B1 (en) * 1995-09-26 2003-05-17 지멘스 악티엔게젤샤프트 Method of electrically connecting a semiconductor chip to at least one contact surface
WO1997012394A1 (en) * 1995-09-26 1997-04-03 Siemens Aktiengesellschaft Method of electrically connecting a semiconductor chip to at least one contact surface
US6079610A (en) * 1996-10-07 2000-06-27 Denso Corporation Wire bonding method
WO1998021780A3 (en) * 1996-11-11 1998-06-25 Siemens Ag A connection between two contacts and a process for producing such a connection
US6420256B1 (en) * 1997-04-22 2002-07-16 Micron Technology, Inc. Method of improving interconnect of semiconductor devices by using a flattened ball bond
US6624059B2 (en) 1997-04-22 2003-09-23 Micron Technology, Inc. Method of improving interconnect of semiconductor devices by utilizing a flattened ball bond
EP1713122A3 (en) * 1999-10-19 2006-11-02 Fujitsu Limited Semiconductor device and method for producing the same
EP1094517A3 (en) * 1999-10-19 2002-04-10 Fujitsu Limited Semiconductor device and method for producing the same
US6601752B2 (en) 2000-03-13 2003-08-05 Denso Corporation Electronic part mounting method
US6803665B1 (en) * 2001-11-02 2004-10-12 Skyworks Solutions, Inc. Off-chip inductor
EP1367644A1 (en) * 2002-05-29 2003-12-03 STMicroelectronics S.r.l. Semiconductor electronic device and method of manufacturing thereof
US7067413B2 (en) 2003-09-04 2006-06-27 Samsung Electronics Co., Ltd. Wire bonding method, semiconductor chip, and semiconductor package
JP2005340677A (en) * 2004-05-31 2005-12-08 Matsushita Electric Ind Co Ltd Wire bonder holding parts and support parts

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