JPH04297084A - Power source - Google Patents

Abstract

PURPOSE:To increase a mounting density and to reduce influence of heat generation of a power source circuit component by forming a drive controller pattern on a conductor through hole printed board, and stereoscopically securing it to a metal base printed board for a power source circuit. CONSTITUTION:A drive controller pattern 10 is formed on a plurality of conductor layers formed on both side surfaces of an insulating layer or an inner layer of a conductor through hole printed board 21, connected by a conductor through hole 22, and a drive control component 11 is mounted. Connecting terminals 23, 24 are formed at corresponding positions of a metal base printed board 2 and the board 21, and the board 21 is so secured to the board 2 in an erected state as to electrically connect the terminals 23, 24. Thus, since a complicated circuit is simplified by using the holes to form the board having a small area, a mounting density can be increased.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply circuit for supplying large amounts of electric power, and a power supply apparatus having a drive control circuit for driving and controlling the power supply circuit.

0002

2. Description of the Related Art A power supply device for supplying high power consists of a power supply circuit through which a high power flows, and a drive control circuit through which a small power signal current flows for driving or controlling the power supply circuit. Among these, the power supply circuit has large power supply circuit components mounted thereon and a large amount of power flows through it, so the entire circuit is formed on a metal-based printed circuit board connected to the heat sink, and all components are mounted thereon.

FIG. 3 is a perspective view showing a conventional power supply device. In the figure, 1 is a power supply device, 2 is a metal base printed circuit board that constitutes this power supply device 1, and a power supply circuit pattern 6 is formed on an insulating layer 5 laminated on a base metal 4 that is thermally connected to a heat sink 3. ing. 7 is an input terminal connected to the power circuit pattern 6, 8 is an output terminal, and 9 is a power circuit component mounted so as to be connected to the power circuit pattern 6. 10 is a drive control circuit pattern for driving or controlling the power supply circuit pattern 6, and 11 is a drive control component mounted to be connected to this drive control circuit pattern 10.

In the above power supply device 1, the input terminal 7
The input power enters a power supply circuit consisting of a power supply circuit pattern 6 and a power supply circuit component 9, and the power supply circuit is driven and controlled by a drive control circuit consisting of a drive control circuit pattern 10 and a drive control component 11, and is output from an output terminal 8. A predetermined power is supplied. Power supply circuit parts 9, drive control parts 11
The heat generated in the above is conducted from the base metal 4 to the heat radiator 3 and is radiated.

[0005]

However, in the conventional power supply device 1 described above, the power supply circuit pattern 6 and the drive control circuit pattern 10 are formed on one side of the same metal base printed circuit board 2, and the large power supply circuit component 9 and Since the small drive control components 11 are mounted all at once without distinction, a large-area metal-based printed circuit board is required and the mounting density is low.

[0006] The power supply circuit passes a large amount of power, so it is necessary to make the conductor layer of the power supply circuit pattern 6 thick, whereas the drive control circuit requires only a small amount of power, but in order to process complex signals, it is necessary to make the conductor layer of the power circuit pattern 6 thick. A complicated drive control circuit pattern 10 is required. However, it is difficult to form a fine circuit pattern on a thick conductor layer, and increasing the width of the circuit pattern increases the size of the power supply device 1.

Further, the drive control component 11 is small and has a low height, but the power supply circuit component 9 is large and has a high height, and the size of the power supply device 1 is regulated by the height of the power supply circuit component 9.
The equipment becomes larger. Further, many of the power supply circuit components 9 generate a large amount of heat, and there is a problem in that the heat generated has an effect on the drive control components 11, which are sensitive to heat, such as integrated circuit elements.

The present invention was made to solve the above-mentioned conventional problems, and by forming the power supply circuit and the drive control circuit on separate substrates and integrating them, the packaging density is increased and the space is saved. It is an object of the present invention to provide a power supply device that can miniaturize the device by effectively utilizing the power and reduce the influence of heat generated by power supply circuit components.

[0009]

[Means for Solving the Problems] A power supply device of the present invention has a base metal connected to a heat sink, a power circuit pattern, an input terminal, an output terminal, and a connection terminal connected to the power circuit pattern, and has a power supply circuit. The conductor through-hole printed circuit board includes a metal base printed circuit board on which components are mounted, and a conductive through-hole printed circuit board that has a drive control circuit pattern and connection terminals that drive and control the power supply circuit, and on which the drive control components are mounted. The board is three-dimensionally fixed to the metal base printed circuit board so that the connection terminals are connected to the connection terminals of the metal base printed circuit board.

0010

[Operation] The power supply device of the present invention has power circuit components mounted on a metal-based printed circuit board, drive control components mounted on a conductive through-hole printed circuit board, and connection terminals of the conductive through-hole printed circuit board connected to the metal-based printed circuit board. It is formed by three-dimensionally fixing a conductive through-hole printed circuit board to a metal base printed circuit board so as to electrically connect to the terminal, and thermally connecting the base metal of the metal base printed circuit board to a heat sink.

In the power supply device formed as described above, the power input from the input terminal enters the power supply circuit having the power supply circuit components, the power supply circuit is drive-controlled by the drive control circuit having the drive control components, and the power is input to the output terminal. A predetermined power is supplied from.

A large amount of heat generated from the power supply circuit pattern and power supply circuit components is led from the base metal of the metal-based printed circuit board to the radiator and radiated. A small amount of heat is generated from the drive control circuit pattern and the drive control components, and the heat is directly radiated into the atmosphere. Since the drive control components are separated from the power circuit components and placed on a separate board, they are less susceptible to the heat generated by the power circuit components.

[0013] Conductor through-hole printed circuit boards can form thin conductor layers, making it possible to form fine circuit patterns, and connecting multiple conductor layers with conductor through-holes, making it possible to create complex crossing patterns. Wiring can be formed in a narrow area to increase packaging density. Such a conductor through-hole printed circuit board is three-dimensionally fixed to a metal base printed circuit board by utilizing the space formed by large power supply circuit components, thereby reducing the size of the entire power supply device.

[0014]

Embodiments Hereinafter, embodiments of the present invention will be explained with reference to the drawings. FIG. 1 is an exploded perspective view showing a power supply device according to an embodiment, and FIG. 2 is an integrated perspective view thereof. In the figures, the same reference numerals as in FIG. 3 indicate the same or corresponding parts.

Similar to the conventional one, the metal base printed circuit board 2 has a power circuit pattern 6 formed on an insulating layer 5 laminated on a base metal 4 which is thermally connected to a radiator 3, and a power circuit component 9. Although it is mounted, the area is smaller than the conventional one, and the drive control circuit pattern 10 is not formed. Of course, some drive control circuit patterns 10 that do not require fine circuit patterns may be formed.

Reference numeral 21 denotes a conductor through-hole printed circuit board, in which drive control circuit patterns 10 are formed on a plurality of conductor layers formed on both sides of an insulating layer or on an inner layer, and are interconnected by conductor through-holes 22. A drive control component 11 is mounted. Of course, a part of the power supply circuit pattern 6 may be formed. The conductor layer forming the drive control circuit pattern 10 of the conductor through-hole printed circuit board 21 is thin. For this reason, the drive control circuit pattern 10 is made into a fine circuit pattern, and is connected to the circuit pattern formed on the back surface or other conductor layer on the inner layer through the conductor through hole 22, simplifying and forming complex wiring within a small area. has been done.

Connecting terminals 23 and 24 are formed at corresponding positions on the metal base printed circuit board 2 and the conductive through-hole printed circuit board 21, respectively.
A conductive through-hole printed circuit board 21 is fixed to the metal base printed circuit board 2 in an upright manner so as to electrically connect the metal base printed circuit board 2. By soldering the connection terminals 23 and 24, electrical connection and fixation can be achieved at the same time, but other means may also be used. 25 is a circuit pattern that connects the connection terminal 23 and the power supply circuit pattern 6 or the power supply circuit component 9.

The above-described power supply device 1 has power circuit components 9 mounted on a metal base printed circuit board 2, drive control components 11 mounted on a conductive through-hole printed circuit board 21, and connecting terminals 24 of the conductive through-hole printed circuit board 21. The conductor through-hole printed circuit board 21 is three-dimensionally fixed to the metal base printed circuit board 2 so as to be electrically connected to the connection terminals 23 of the metal base printed circuit board 2, and the base metal 4 of the metal base printed circuit board 2 is connected to the heat sink 3. formed by being thermally connected to.

In the power supply device 1 formed as described above, the power input from the input terminal 7 enters the power supply circuit consisting of the power supply circuit pattern 6 and the power supply circuit components 9, and the power supply circuit includes the drive control circuit pattern 10 and the drive control circuit pattern 6. Part 1
1, and a predetermined power is supplied from the output terminal 8.

Power supply circuit pattern 6 and power supply circuit components 9
A large amount of heat generated from the metal base printed circuit board 2 is guided from the base metal 4 of the metal base printed circuit board 2 to the heat radiator 3 and radiated. The heat generated from the drive control circuit pattern 10 and the drive control component 11 is small, and is radiated directly into the atmosphere. Since the drive control component 11 is separated from the power supply circuit component 9 and placed on a separate board, it can be placed in a position where it is less affected by the heat generated by the power supply circuit component 9.

Since the conductor through hole printed circuit board 21 can form a thin conductor layer, it is possible to form a fine drive control circuit pattern 10, and the conductor through hole 22 can connect a plurality of conductor layers. , complex wiring that crosses can be formed in a narrow area to increase packaging density. Such a conductor through-hole printed circuit board 21 is three-dimensionally fixed to the metal base printed circuit board 2 by utilizing the space formed by the large-sized power supply circuit component 9, and the entire power supply device 1 is miniaturized.

In the above embodiment, one conductive through-hole printed circuit board 21 was used, but the drive control circuit pattern 10 and the drive control component 11 were divided into a plurality of blocks and formed or mounted separately. A plurality of conductor through-hole printed circuit boards 21 may be connected and fixed to one metal base printed circuit board 2.

[0023]

As described above, according to the present invention, the drive control circuit pattern is formed on a conductor through-hole printed circuit board and fixed three-dimensionally to a metal base printed circuit board for a power supply circuit. Thin the conductor layer of a through-hole printed circuit board to form a fine circuit pattern, and use conductor through-holes to simplify complex circuits and form them on a small-area board, thereby increasing packaging density. be able to. In addition, since the space created by large power circuit components can be effectively used to secure the conductor through-hole printed circuit board, the device can be made smaller and the effects of heat generated by the power circuit components can be reduced. .

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a power supply device according to an embodiment.

FIG. 2 is a perspective view of the power supply device of the embodiment.

FIG. 3 is a perspective view of a conventional power supply device.

[Explanation of symbols]

1 Power supply device 2 Metal base printed circuit board 3 Heatsink 4 Base metal 5 Insulating layer 6 Power circuit pattern 7 Input terminal 8 Output terminal 9 Power circuit component 10 Drive control circuit pattern 11 Drive control component 21 Conductor through hole Print circuit board 22 Conductor through hole 23, 24 Connection terminal

Claims (1)

[Claims] 1. A metal base printed circuit board having a base metal connected to a heat sink, a power supply circuit pattern, an input terminal, an output terminal, and a connection terminal connected to the power supply circuit pattern, and on which a power supply circuit component is mounted; A conductor through-hole printed circuit board having a drive control circuit pattern for driving and controlling a power supply circuit and a connection terminal and mounting a drive control component, wherein the conductor through-hole printed circuit board has a connection terminal connected to a metal base printed circuit board. A power supply device characterized by being three-dimensionally fixed to a metal base printed circuit board so as to be connected to a terminal.