JPH04299543A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To provide a semiconductor manufacturing device which can individually seal a plurality of kinds of semiconductor elements of a semiconductor device in the same metallic mold by using a plurality of kinds of resins respectively meeting the functions of the elements. CONSTITUTION:By providing pluralities of pieces of gates 8a, 8b... and plungers 2a, 2b... for forcibly injecting resins having different properties into one metallic mold composed of a top and bottom parts 3a and 6a with pressures, a clamped semiconductor device 1a is sealed with resins 4a, 4b....

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention relates to semiconductor manufacturing equipment.
In particular, the present invention relates to a manufacturing apparatus for resin-sealed semiconductor devices.

0002

2. Description of the Related Art As shown in the cross-sectional view of FIG. 5, a conventional semiconductor device manufacturing apparatus uses an adhesive to attach a semiconductor device 1 that has not yet been sealed with resin, for example (1) an island portion of a metal lead frame. mount active elements, passive elements, etc. using
Each element and the inner lead part of the lead frame are electrically and mechanically connected by thin metal wires,
(2) A circuit board is fixed to the island part of a metal lead frame, active elements and passive elements are mounted on the circuit board using adhesive, and a circuit is formed using thin metal wires, conductive paste, etc. (3) A circuit pattern is formed on a printed circuit board, passive elements and active elements are mounted on this circuit pattern using adhesive, and the circuit is formed using thin metal wires, conductive paste, etc. With things, etc.
Each plate with a thickness of about 0.15 to 4.0 mm is heated to a pressure of 80 to 100 kg/cm2 using an upper mold 3 and a lower mold 6.
The mold is clamped, and the resin 4 is press-fitted through the gate 8 using the plunger 2 attached to the upper mold 3. As described above, in conventional manufacturing equipment, only one type of resin can be used at the same time.

0003

[Problems to be Solved by the Invention] This conventional semiconductor manufacturing equipment has a structure in which one gate and one plunger are provided in the same mold, so only one type of resin can be used. . For this reason, when sealing optical-related elements, it is necessary to use transparent resin or translucent resin of blue, red, green, yellow, etc. for the light-receiving element and light-emitting element, which are optical elements. Further, unless non-transparent resins such as black, red, blue, and green are used for elements such as transistors, ICs, and diodes, each element cannot perform its functions. Furthermore, microcomputers, gate arrays, SRAMs, ROMs, and the like having high-performance elements tend to have increasingly larger element sizes, and the effects of cracks, stress strains, etc. on element characteristics are very large. Furthermore, α-ray damage, etc. must also be considered. Therefore, in the past, only one type of sealing resin was used, which caused the problem that a resin suitable for each element could not be used.

0004

[Means for Solving the Problems] The semiconductor manufacturing apparatus of the present invention includes a plurality of gates and a plurality of plungers in the same mold so that the resin required for each element can be used. , it is possible to resin-seal multiple elements using multiple types of resin.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a sectional view showing a first embodiment of the present invention. Semiconductor device 1a (substrate thickness 0.15 to 4.0 mm) that is not yet resin-sealed
position) with the upper mold 3a and lower mold 6a at a pressure of 50 to 100.
Clamp the mold at kg/cm2. The upper mold 3a has a plunger 2a (outer diameter of about 5 to 20 mm) and a gate 8a (width of about 2 to 20 mm).
5 mm and a thickness of about 0.1 to 2.0 mm), and this mechanism causes a pressure of 40 to 120 k on the upper surface of the semiconductor device 1a.
The resin 4a is press-fitted and sealed at a pressure of g/cm2. Further, another plunger 2b is provided in the upper mold 3a, and the gate 8
b is provided in the lower mold 6a. The plunger 2b and the gate 8b press-fit the resin 4b into the lower surface of the semiconductor device 1a and seal it. In this way, one semiconductor device 1a includes two gates 8a and 8b and plungers 2a and 2b.
By providing two resins, a semiconductor device using two types of resins 4a and 4b can be manufactured.

FIG. 2 is a sectional view showing a second embodiment of the present invention. The semiconductor device 1b, which has not yet been resin-sealed, is clamped between the upper mold 3b and the lower mold 6b. The upper mold 3b is equipped with a plunger 2c and a gate 8c, and a plunger 2d and a gate 8d, and both functions press-fit the resin 4c and the resin 4d and seal them. In the case of this embodiment, the through hole 16 (for example, diameter 2 to 5 mm) provided in the semiconductor device 1b allows the semiconductor device to A semiconductor device can be manufactured in which the same type of resin is placed on the upper and lower opposing surfaces of 1b, and different types of resin are placed on the left and right sides.

FIG. 3 is a diagram showing a third embodiment of the present invention, in which (a) is a plan view, and (b) is a plane view of A-A and B.
-B sectional view. The semiconductor device 1c which has not yet been resin-sealed is clamped between the upper mold 3c and the lower mold 6c. The upper mold 3c includes two plungers and two gates: a plunger 2e and a gate 8e, and a plunger 2f and a gate 8f. The lower mold 6c has two plungers and two gates: a plunger 2g and a gate 8g, and a plunger 2h and a gate 8h. That is, four different resins, 4e, 4f, 4g, and 4h, are press-fitted and sealed by the functions of 4 plungers and 4 gates. Therefore, it is possible to manufacture a semiconductor device in which four different types of resins are placed on the top and bottom, left and right sides of the semiconductor device 1c.

FIG. 4 is a sectional view showing a fourth embodiment of the present invention. Semiconductor device 1d (substrate thickness 0.15
~4.0 mm, etc.) has a structure in which one end does not protrude from the resin, so only one side is clamped by the upper mold 3d and the lower mold 6d. The upper mold 3d has a plunger 2i and a gate 8i,
It is equipped with a plunger 2j and a gate 8j, and the functions of the two plungers and the two gates allow two types of resin to be press-fitted and sealed. In this case, the through hole 18 is necessary when the resin 4i is press-fitted, but the through-hole 17 may be present or not when the resin 4j is press-fitted. As a result, it is possible to manufacture a semiconductor device in which the same type of resin is placed on the upper and lower opposing surfaces of the semiconductor device 1d, and different types of resin are placed on the left and right sides of the semiconductor device 1d. Furthermore, since one side of the semiconductor device 1d has a structure that does not protrude from the resin 4j, moisture resistance can be improved.

[0009]

[Effects of the Invention] As explained above, the present invention provides a plurality of gates and a plurality of plungers in the same mold, thereby making it possible to arrange a plurality of types of resin in one semiconductor device. be able to. Therefore, it is possible to combine optical-related elements (emitting, light-receiving, etc.) with other elements (transistors, ICs, diodes, etc.), which was previously impossible, by using transparent resin for optical-related elements. This becomes possible by using black resin for the other elements. Furthermore, regarding issues such as element dimensions, thickness, and alpha rays, resins suitable for each element can be used, which has the effect of fully bringing out the characteristics of each element.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing Example 1 of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a diagram showing a third embodiment of the present invention; FIG. 3(a) is a plan view, and FIG. 3(b) is a sectional view taken along line AA and line BB.

FIG. 4 is a sectional view showing a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a conventional manufacturing apparatus.

[Explanation of symbols]

1, 1a to 1d　　　　　Semiconductor device 2,2a~2j Plunger 3, 3a to 3d Upper mold 4,4a-4j Resin 6, 6a-6d Lower mold 8, 8a-8j Gate 16, 17, 18 Through hole

Claims (1)

[Claims] 1. A semiconductor manufacturing apparatus for resin-sealing a semiconductor device, comprising a plurality of gates and a plurality of plungers for press-fitting resins with different properties into the same mold. Manufacturing equipment.