JPH04306836A - Etching device - Google Patents

Abstract

PURPOSE:To avoid the adherence of fine particles to a processed wafer in relation to the title etching device especially a single-wafer wet etching device of the semiconductor wafer. CONSTITUTION:The title wafer etching device feeding an etchant to a turning wafer 1 to be etched is composed of a wafer chuck 11 horizontally holding the wafer 1 to be turned and blades 16 located on the positions beneath the wafer 1 to be turned together with the wafer chuck 11 for blowing a downward air current.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an etching apparatus used for manufacturing semiconductor devices, and more particularly to the structure of a single-wafer wet etching apparatus.

In the wafer processing process of the semiconductor device manufacturing process, the process of etching the wafer surface is repeated. There are two types of etching methods: dry etching and wet etching, and the latter is usually used as a surface etching treatment before depositing a metal film.

[0003] In recent years, automation of wafer processing processes has been progressing, and automated lines are often constructed using single-wafer type equipment. Single-wafer wet etching equipment is also being used for surface etching before metal film deposition.

0004

2. Description of the Related Art An example of a conventional single-wafer type wet etching apparatus will be explained with reference to FIG. Figure 2 is a schematic diagram showing an example of a conventional device, where (a) shows the device configuration (cross-sectional view), and (b) shows the wafer chuck (perspective view).
. In the figure, the same parts as in FIG. 1 are given the same reference numerals.

1 is a wafer to be processed, 11 is a wafer chuck, 12 is a nozzle, 13 is a dome cover, 14 is a cup, 14a is a drain port, 15 is a housing, and 15a is an exhaust port. The wafer chuck 11 has three or more jaws 11
It is a mechanical chuck consisting of three or more arms 11b, a shaft 11c, etc., and a claw 11a fixed to the tip of the arm 11b supports the wafer 1 at its step, and three of them support the wafer 1 from three sides. Press the end face of and clamp it. The shaft 11c is engaged with a rotating means (not shown).

Processing by this device is performed as follows. First, the wafer 1 is clamped to a wafer chuck 11 and rotated at high speed by a rotating means (not shown), and an etching solution is sprayed from the nozzle 12 onto the surface of the rotating wafer 1. Thereafter, spraying of the etching solution is stopped, and a rinsing solution is sprayed from another nozzle (not shown). Then stop spraying the rinse solution and continue rotating. When the rinsing liquid has finished drying, stop the rotation of wafer 1,
Complete the process.

[0007]

However, when etching is performed using such an etching apparatus, there is a problem in that droplets of etching waste liquid float in the processing chamber and adhere as particles to the surface of the processed wafer.

SUMMARY OF THE INVENTION An object of the present invention is to provide an etching apparatus that can solve these problems and reduce the adhesion of particles to processed wafers.

[0009]

[Means for Solving the Problem] According to the present invention, in an apparatus for etching a rotating wafer 1 by supplying an etching solution to the wafer 1, the wafer 1 is held horizontally and the wafer 1 is held horizontally. Rotating wafer chuck 1
1 and a blade 16 that rotates together with the wafer chuck 11 below the wafer 1 to generate a downward airflow.

0010

[Operation] When the blades provided below the wafer rotate together with the wafer chuck, it functions as a ventilation fan (generating a downward airflow within the processing chamber), and exhaust air containing waste liquid droplets is discharged out of the apparatus together with the waste liquid. Therefore, the atmosphere in the processing chamber is improved, and the adhesion of particles to processed wafers is reduced.

[0011]

Embodiment An embodiment of a single-wafer type wet etching apparatus according to the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram showing an apparatus according to an embodiment of the present invention, in which (a) shows the structure of the apparatus (cross-sectional view), and (b) shows a wafer chuck and blades (perspective view). It shows.

1 is a wafer to be processed; 11 is a wafer chuck that rotates while holding the wafer 1; 12 is a nozzle that sprays etching solution onto the surface of the wafer 1; 13 is a dome cover; 14 is a cup; and 14a is a liquid drain. mouth, 15
is a housing, 15a is an exhaust port, and 16 is a blade.

The wafer chuck 11 has three or more (six in this example) claws 11a, three or more (six in this example)
It is a mechanical chuck consisting of an arm 11b, a shaft 11c, etc., and a claw 11 fixed to the tip of the arm 11b.
A supports the wafer 1 at its stepped portion, and three of them press the end face of the wafer 1 from three sides to clamp it. The shaft 11c is engaged with a rotating means (not shown). The blade 16 is the chuck 11 (shaft 11c)
A plurality of sheets (six in this example) are fixed radially to the chuck 11 and rotate together with the chuck 11. Each blade 16 has a shaft 11c
The chuck 11 is attached obliquely to the axis of the chuck 11, and the rotation of the chuck 11 generates a downward airflow. The dome cover 13 has an opening on the side surface, through which air circulates. This dome cover 13 and cup 14 form a processing chamber.

Processing by this device is performed as follows. First, the wafer 1 is clamped to a wafer chuck 11 and rotated at high speed by a rotating means (not shown), and an etching solution is sprayed from the nozzle 12 onto the surface of the rotating wafer 1. Thereafter, spraying of the etching solution is stopped, and a rinsing solution is sprayed from another nozzle (not shown). Then stop spraying the rinse solution and continue rotating. When the rinsing liquid has finished drying, stop the rotation of wafer 1,
Complete the process.

At this time, the blades 16 rotate together with the wafer chuck 11 to generate a downward airflow in the processing chamber, and the air containing the waste liquid droplets inside the dome cover 13 is discharged from the drain port of the cup (exhaust air) together with the waste liquid. (Partly from exhaust port 15a)
Eject outside the device.

[0016] As a result of using this apparatus for etching the wafer surface (SiO2) before depositing an aluminum film for wiring (the etching solution was ammonium fluoride and the rinsing solution was pure water), the inventor discovered that the wafer surface after processing The amount of attached particles was significantly reduced compared to when using conventional equipment.

The present invention is not limited to the above embodiments, but can be implemented with various modifications.

[0018]

[Effects of the Invention] As explained above, according to the present invention,
We can provide a single-wafer etching system that can reduce the adhesion of particles to processed wafers.
Contributes to improving semiconductor device manufacturing yield.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing an apparatus according to an embodiment of the present invention, in which (a) shows the structure of the apparatus, and (b) shows a wafer chuck and a blade.

FIG. 2 is a schematic diagram showing an example of a conventional device;
) is the device configuration, and (b) is the wafer chuck.

[Explanation of symbols]

1 Wafer 11 Wafer chuck 11a Nail 11b Arm 11c axis 12 Nozzle 13 Dome cover 14 cups 15 Housing 16 Feather

Claims (1)

[Claims] 1. An apparatus for etching a rotating wafer (1) by supplying an etching solution to the wafer (1), comprising a wafer chuck (11) that holds the wafer (1) horizontally and rotates it. ) and the wafer (
1) An etching apparatus comprising: a blade (16) which rotates together with the wafer chuck (11) below the wafer chuck (11) to generate a downward airflow.