JPH0430751U - - Google Patents
Info
- Publication number
- JPH0430751U JPH0430751U JP7268690U JP7268690U JPH0430751U JP H0430751 U JPH0430751 U JP H0430751U JP 7268690 U JP7268690 U JP 7268690U JP 7268690 U JP7268690 U JP 7268690U JP H0430751 U JPH0430751 U JP H0430751U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- conductor patterns
- circuit board
- metal
- heat spreader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の電子機器用回路基板を用いた
電子機器の組立図、第２図は上記電子機器用回路
基板のみの外観図、第３図は上記電子機器用回路
基板に搭載・固着されるヒートスプレツダの外観
図、第４図は導体パターンの交叉部の拡大断面図
、第５図ａ，ｂは電子機器に用いられる従来の電
子機器用回路基板である。
５……ＭＯＳ ＦＥＴ、６……ゲートワイヤ、
８……ソースワイヤ、２０……電子機器用回路基
板、２１，２２ａ，２３ａ……ヒートスプレツダ
、ａ１，ｂ１，ｃ１，ｄ１……電力回路用導体パ
ターン、ｅ１……信号回路用導体パターン、２５
……絶縁コート材。
Figure 1 is an assembly diagram of an electronic device using the circuit board for electronic equipment of the present invention, Figure 2 is an external view of only the circuit board for electronic equipment, and Figure 3 is mounted and fixed on the circuit board for electronic equipment. FIG. 4 is an enlarged sectional view of the intersection of the conductor patterns, and FIGS. 5a and 5b show a conventional circuit board for electronic equipment. 5...MOS FET, 6...gate wire,
8...Source wire, 20...Circuit board for electronic equipment, 21, 22a, 23a...Heat spreader, a1 , b1 , c1 , d1 ...Conductor pattern for power circuit, e1 ...Signal Circuit conductor pattern, 25
...Insulating coating material.
Claims (1)
複数のＡ回路系導体パターンが形成された金属回
路基板と、これらＡ回路系導体パターン間を跨ぐ
ように該導体パターン上に配置された電子部品搭
載用ヒートスプレツダとを有し、該ヒートスプレ
ツダと接触することなく前記Ａ回路系導体パター
ン間で、かつ、同一平面内でそれらＡ回路系導体
パターンと交叉するようにＢ回路系導体パターン
を形成したことを特徴とする電子機器用回路基板
。 A metal circuit board in which a plurality of independent A circuit conductor patterns are formed on one main surface of a metal plate via an insulating layer, and a metal circuit board is arranged on the conductor pattern so as to straddle between these A circuit conductor patterns. and a heat spreader for mounting electronic components, and the B circuit system is arranged between the A circuit system conductor patterns without contacting the heat spreader and intersects with the A circuit system conductor patterns in the same plane. A circuit board for electronic equipment characterized by forming a conductor pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7268690U JPH0430751U (en) | 1990-07-10 | 1990-07-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7268690U JPH0430751U (en) | 1990-07-10 | 1990-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0430751U true JPH0430751U (en) | 1992-03-12 |
Family
ID=31610846
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7268690U Pending JPH0430751U (en) | 1990-07-10 | 1990-07-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0430751U (en) |
-
1990
- 1990-07-10 JP JP7268690U patent/JPH0430751U/ja active Pending