JPH0470760U - - Google Patents
Info
- Publication number
- JPH0470760U JPH0470760U JP11309290U JP11309290U JPH0470760U JP H0470760 U JPH0470760 U JP H0470760U JP 11309290 U JP11309290 U JP 11309290U JP 11309290 U JP11309290 U JP 11309290U JP H0470760 U JPH0470760 U JP H0470760U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- insulating substrate
- back surface
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
図面は本考案の一実施例を示し、第１図はプリ
ント基板本体の表面図、第２図は同裏面図である
。
１……プリント基板本体、２……絶縁基板、３
……導体パターン、４ａ……放熱パターン部。
The drawings show an embodiment of the present invention, and FIG. 1 is a front view of the printed circuit board body, and FIG. 2 is a back view thereof. 1...Printed circuit board body, 2...Insulating board, 3
...Conductor pattern, 4a... Heat dissipation pattern section.
Claims (1)
電子部品を取付ける導体パターンを形成すると共
に、上記絶縁基板の裏面に、使用時発熱する電子
部品の裏面に位置するように放熱パターン部を形
成してなるプリント基板。 A conductive pattern for attaching electronic components is formed on the surface of an insulating substrate constituting the printed circuit board body, and a heat dissipation pattern is formed on the back surface of the insulating substrate so as to be located on the back surface of the electronic components that generate heat during use. Printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11309290U JPH0470760U (en) | 1990-10-30 | 1990-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11309290U JPH0470760U (en) | 1990-10-30 | 1990-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0470760U true JPH0470760U (en) | 1992-06-23 |
Family
ID=31860640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11309290U Pending JPH0470760U (en) | 1990-10-30 | 1990-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0470760U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011046134A1 (en) * | 2009-10-13 | 2011-04-21 | カルソニックカンセイ株式会社 | Heat-dissipation structure for a multilayer substrate |
-
1990
- 1990-10-30 JP JP11309290U patent/JPH0470760U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011046134A1 (en) * | 2009-10-13 | 2011-04-21 | カルソニックカンセイ株式会社 | Heat-dissipation structure for a multilayer substrate |
| JP2011086663A (en) * | 2009-10-13 | 2011-04-28 | Calsonic Kansei Corp | Heat dissipation structure of multilayer substrate |