JPH0430761U - - Google Patents

Info

Publication number
JPH0430761U
JPH0430761U JP7122790U JP7122790U JPH0430761U JP H0430761 U JPH0430761 U JP H0430761U JP 7122790 U JP7122790 U JP 7122790U JP 7122790 U JP7122790 U JP 7122790U JP H0430761 U JPH0430761 U JP H0430761U
Authority
JP
Japan
Prior art keywords
land
lead
hole
circuit
remodeling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7122790U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7122790U priority Critical patent/JPH0430761U/ja
Publication of JPH0430761U publication Critical patent/JPH0430761U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による一実施例の平面図、第2
図は第1図の実装状態を示す要部平面図、第3図
は他の実施例を示す平面図である。 図において、1は改造用補助回路基板、1aは
絶縁基板、1a−1はスルーホール、1a−2は
ランド(フツトプリント)、3は回路部品(集積
回路IC)、3aはリードをそれぞれ示す。
Figure 1 is a plan view of an embodiment of the present invention;
The figure is a plan view of the main part showing the mounting state of FIG. 1, and FIG. 3 is a plan view showing another embodiment. In the figure, 1 is an auxiliary circuit board for modification, 1a is an insulating board, 1a-1 is a through hole, 1a-2 is a land (footprint), 3 is a circuit component (integrated circuit IC), and 3a is a lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板1aに、既に実装された回路部品3の
リード3aに挿入接続するスルーホール1a−1
と追加実装する回路部品の電極を表面接続するラ
ンド1a−2を備えてなることを特徴とする改造
用補助回路基板。
A through hole 1a-1 is inserted into and connected to the lead 3a of the circuit component 3 already mounted on the insulating substrate 1a.
An auxiliary circuit board for remodeling, comprising a land 1a-2 for surface connection of electrodes of circuit components to be additionally mounted.
JP7122790U 1990-07-03 1990-07-03 Pending JPH0430761U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7122790U JPH0430761U (en) 1990-07-03 1990-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7122790U JPH0430761U (en) 1990-07-03 1990-07-03

Publications (1)

Publication Number Publication Date
JPH0430761U true JPH0430761U (en) 1992-03-12

Family

ID=31608070

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7122790U Pending JPH0430761U (en) 1990-07-03 1990-07-03

Country Status (1)

Country Link
JP (1) JPH0430761U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250836A (en) * 1995-03-08 1996-09-27 Fujitsu Ltd Printed wiring board additional component mounting structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250836A (en) * 1995-03-08 1996-09-27 Fujitsu Ltd Printed wiring board additional component mounting structure

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