JPH0459974U - - Google Patents
Info
- Publication number
- JPH0459974U JPH0459974U JP10281090U JP10281090U JPH0459974U JP H0459974 U JPH0459974 U JP H0459974U JP 10281090 U JP10281090 U JP 10281090U JP 10281090 U JP10281090 U JP 10281090U JP H0459974 U JPH0459974 U JP H0459974U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- connection
- board
- land
- preliminary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004048 modification Effects 0.000 claims description 3
- 238000012986 modification Methods 0.000 claims description 3
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案による一実施例の平面図、第２
図は第１図の実装状態を示す要部平面図、第３図
は第２図の一部側断面図である。
図において、１は改造用補助回路基板、１ａは
絶縁基板、１ａ−１は接続用スルーホール、１ａ
−２はランド（フツトプリント）、１ａ−３は配
線パターン、２は改造基板（既設計の回路基板）
、２ａは予備スルーホール、３は追加回路部品、
４はストラツプ線（改造用追加電線）、をそれぞ
れ示す。
Figure 1 is a plan view of one embodiment of the present invention;
The figure is a plan view of a main part showing the mounting state of FIG. 1, and FIG. 3 is a partial side sectional view of FIG. 2. In the figure, 1 is an auxiliary circuit board for modification, 1a is an insulating board, 1a-1 is a through hole for connection, 1a
-2 is land (footprint), 1a-3 is wiring pattern, 2 is modified board (pre-designed circuit board)
, 2a is a spare through hole, 3 is an additional circuit component,
4 indicates a strap wire (additional electric wire for modification).
Claims (1)
いる予備スルーホール２ａに対応する接続用スル
ーホール１ａ−１と、追加回路部品３を表面接続
するランド１ａ−２と、前記接続用スルーホール
１ａ−１とランド１ａ−２とを接続する配線パタ
ーン１ａ−３とを備えてなり、前記予備スルーホ
ール２ａと接続用スルーホール１ａ−１とをスト
ラツプ線４で接続するようにしたことを特徴とす
る改造用補助回路基板。 The insulating board 1a has a connection through hole 1a-1 corresponding to the preliminary through hole 2a already drilled in the modified board 2, a land 1a-2 for surface connection of the additional circuit component 3, and the connection through hole 1a-1. 1a-1 and land 1a-2, and a strap wire 4 connects the preliminary through hole 2a and the connecting through hole 1a-1. Auxiliary circuit board for modification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10281090U JPH0459974U (en) | 1990-09-28 | 1990-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10281090U JPH0459974U (en) | 1990-09-28 | 1990-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459974U true JPH0459974U (en) | 1992-05-22 |
Family
ID=31847370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10281090U Pending JPH0459974U (en) | 1990-09-28 | 1990-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459974U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015126093A (en) * | 2013-12-26 | 2015-07-06 | 株式会社メガチップス | Component mounting module and component mounting method |
-
1990
- 1990-09-28 JP JP10281090U patent/JPH0459974U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015126093A (en) * | 2013-12-26 | 2015-07-06 | 株式会社メガチップス | Component mounting module and component mounting method |