JPH04309457A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPH04309457A JPH04309457A JP10187091A JP10187091A JPH04309457A JP H04309457 A JPH04309457 A JP H04309457A JP 10187091 A JP10187091 A JP 10187091A JP 10187091 A JP10187091 A JP 10187091A JP H04309457 A JPH04309457 A JP H04309457A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- ventilation
- soldering iron
- air
- iron tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、たとえば回路基板等に
電子部品を搭載するときに用いる半田付け装置に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device used, for example, when mounting electronic components on a circuit board or the like.
【0002】0002
【従来の技術】従来の半田ゴテを用いた半田付け作業で
は、半田ゴテのコテ先部を基板に押しあてて熱伝導によ
り加熱し、基板と電子部品との間に半田を溶かし込み、
その後コテ先部を離し、半田付け部を自然冷却すること
により両者の接合を行っている。[Prior Art] In conventional soldering work using a soldering iron, the tip of the soldering iron is pressed against a board and heated by thermal conduction to melt the solder between the board and the electronic component.
After that, the soldering iron tip is separated and the soldered part is allowed to cool naturally, thereby joining the two.
【0003】0003
【発明が解決しようとする課題】従来の半田ゴテは、熱
容量の小さい被接合部を半田付けする場合には、それほ
ど問題とはならないが、たとえばプレーンを含む回路基
板や、厚い金属板のような、熱容量の大きな基板に対し
て、部品を半田付けする場合には、加熱と冷却に時間が
かかり効率が悪いという問題があった。[Problems to be Solved by the Invention] Conventional soldering irons do not pose much of a problem when soldering parts to be joined with a small heat capacity, but for example, when soldering parts to be joined that have a small heat capacity, it is difficult to solder parts such as circuit boards containing planes or thick metal plates. When soldering components to a board with a large heat capacity, there is a problem in that heating and cooling take time and are inefficient.
【0004】本発明は上記事情に基づいてなされたもの
であり、被接合部を効率よく加熱・冷却することができ
る半田付け装置を提供することを目的とする。The present invention has been made based on the above circumstances, and an object of the present invention is to provide a soldering device that can efficiently heat and cool parts to be joined.
【0005】[0005]
【課題を解決するための手段】本発明は上記課題を解決
するために、被接合部にコテ先部を当接して加熱するこ
とにより半田付けを行う半田付け装置において、前記コ
テ先部に雰囲気ガスを送り出す送風手段を設け、且つ該
送風手段又はその通風路に半田を溶かす熱を発生させる
発熱手段を設けたことを特徴とするものである。[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a soldering apparatus that performs soldering by contacting and heating a soldering iron tip with a part to be joined, in which an atmosphere is applied to the soldering iron tip. The present invention is characterized in that a blower means for sending out gas is provided, and a heat generating means for generating heat to melt the solder is provided in the blower means or its ventilation path.
【0006】そして、前記雰囲気ガスは不活性ガスであ
ることが望ましい。[0006] Preferably, the atmospheric gas is an inert gas.
【0007】[0007]
【作用】本発明は前記の構成によって、被接合部にコテ
先部を押し付けて加熱すると同時に、送風手段又はその
通風路に設けられた発熱手段によって加熱された雰囲気
ガスをコテ先部に吹き付けて補助加熱を行う。半田付け
終了後は、被接合部からコテ先を離し、発熱手段の発熱
を停止して送風のみを行うことにより、半田付け部の放
熱を促す。これにより、加熱・冷却に要する時間を短縮
することができる。[Operation] With the above-described structure, the present invention presses the soldering iron tip against the part to be welded and heats it, and at the same time blows atmospheric gas heated by the blowing means or the heating means provided in the ventilation path onto the soldering iron tip. Perform auxiliary heating. After soldering is completed, the tip of the soldering iron is removed from the part to be joined, the heat generating means stops generating heat, and only air is blown, thereby promoting heat dissipation from the soldered part. Thereby, the time required for heating and cooling can be shortened.
【0008】そして、雰囲気ガスとして不活性ガスを使
用することにより、半田の酸化を防止することができる
。[0008] By using an inert gas as the atmospheric gas, oxidation of the solder can be prevented.
【0009】[0009]
【実施例】次に本発明の一実施例である半田付け装置に
ついて図面を参照して説明する。図1は本発明の一実施
例である半田付け装置の概略構成図である。図1に示す
半田付け装置は、半田ゴテ部10と、半田ゴテ部10と
一体的に構成された送風装置20と、発熱部30とを備
えるものである。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a soldering apparatus which is an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram of a soldering device according to an embodiment of the present invention. The soldering apparatus shown in FIG. 1 includes a soldering iron section 10, an air blower 20 integrally formed with the soldering iron section 10, and a heat generating section 30.
【0010】半田ゴテ部10は、基板等に当接してその
基板を加熱するコテ先部12、該コテ先部を加熱するた
めのヒータ(不図示)と、把持部14とを備える。尚、
半田ゴテ部10の構造は通常の半田ゴテと同様であるの
で、その詳細な説明は省略する。The soldering iron section 10 includes a soldering iron tip section 12 that comes into contact with a substrate or the like to heat the substrate, a heater (not shown) for heating the soldering iron tip section, and a grip section 14. still,
Since the structure of the soldering iron section 10 is similar to that of a normal soldering iron, a detailed explanation thereof will be omitted.
【0011】送風装置20は、コテ先部12に空気を送
るための送風源22と、空気をコテ先部12の先端部に
送りだすための送風口24と、送風源22と送風口24
とを繋ぐ通風路26とを備える。送風源22にはファン
、コンプレッサ、或はボンベ等を使用する。また、通風
路26の送風口24の近傍には、電熱式ヒータよりなる
発熱部30を設けてある。尚、図示しないが、半田ゴテ
部10の把持部14には、作業のし易い位置に発熱部3
0のスイッチと通風を開始したり停止したりする送風バ
ルブとを設けている。The blowing device 20 includes a blowing source 22 for sending air to the soldering iron tip 12, a blowing port 24 for sending air to the tip of the soldering iron tip 12, and the blowing source 22 and the blowing port 24.
and a ventilation passage 26 connecting the two. A fan, compressor, cylinder, or the like is used as the air source 22. Further, in the vicinity of the air outlet 24 of the ventilation path 26, a heat generating section 30 made of an electric heater is provided. Although not shown, the grip part 14 of the soldering iron part 10 has a heat generating part 3 at a position where it is easy to work.
0 switch and a ventilation valve to start and stop ventilation.
【0012】本実施例の装置を使用するときには、先ず
コテ先部12を基板等に押し付けて基板の半田付け部を
加熱すると同時に、発熱部30に通電して、半田付け部
に熱風を吹き付け、コテ先部12による昇温を援助する
。そして、半田付け終了後はコテ先部12を基板から離
し、発熱部30のスイッチを切って、送風のみを行い、
半田付部に冷風を吹きつけて半田付け部の放熱を促進す
る。When using the apparatus of this embodiment, first, the soldering part of the board is heated by pressing the soldering iron tip 12 against the board, etc. At the same time, the heat generating part 30 is energized to blow hot air onto the soldering part. This assists the temperature increase by the soldering iron tip 12. After soldering, the soldering iron tip 12 is separated from the board, the heat generating part 30 is turned off, and only air is blown.
Blow cold air onto the soldered area to promote heat dissipation from the soldered area.
【0013】このように、本実施例の装置によれば、半
田ゴテ部のコテ先からの熱伝導による半田付け部の加熱
に加え、送風装置より熱風を吹き付けることにより半田
付け部の昇温を助けることができ、また冷却時には冷風
を吹き付けることにより半田付け部の放熱を促進するこ
とができるので、作業時間の短縮が図れる。As described above, according to the apparatus of this embodiment, in addition to heating the soldering part by heat conduction from the tip of the soldering iron, the temperature of the soldering part can be increased by blowing hot air from the blower. Furthermore, by blowing cold air during cooling, heat dissipation from the soldered parts can be promoted, reducing work time.
【0014】上記の実施例では、半田ゴテ部10と送風
装置20とが一体的に構成されている場合について説明
したが、本発明はこれに限られるものではなく、半田ゴ
テ部と送風装置とを分離して構成してもよい。図2はそ
の構成例を示すものであり、図2において101は半田
ゴテ部、201,202は送風装置である。図2に示す
ように、送風装置201は天井等からつり下げるように
したものであり、送風装置202は床等にスタンドを用
いて配置したものである。なお、それぞれの送風装置2
01,202には、送風装置20と同様に発熱部が内蔵
されていることは言うまでもない。[0014] In the above embodiment, a case has been described in which the soldering iron section 10 and the blower device 20 are integrally constructed, but the present invention is not limited to this, and the soldering iron section and the blower device are integrated. may be configured separately. FIG. 2 shows an example of the configuration. In FIG. 2, 101 is a soldering iron part, and 201 and 202 are air blowers. As shown in FIG. 2, a blower device 201 is suspended from a ceiling or the like, and a blower device 202 is placed on a floor or the like using a stand. In addition, each blower device 2
Needless to say, the air blower 01 and 202 have a built-in heat generating part like the blower 20.
【0015】また、上記の実施例では、雰囲気ガスとし
て空気を用いた場合について説明したが、雰囲気ガスと
しては不活性ガス、たとえば窒素ガスやヘリウムガス等
を使用してもよい。これにより半田の酸化を防止するこ
とができる。Further, in the above embodiment, the case where air is used as the atmospheric gas has been described, but an inert gas such as nitrogen gas or helium gas may also be used as the atmospheric gas. This can prevent solder from oxidizing.
【0016】[0016]
【発明の効果】以上説明したように本発明によれば、半
田付け作業の加熱・冷却工程にかかる作業時間が大幅に
短縮され、特に熱容量の大きな被接合部への半田付け作
業を効率良く行うことができる半田付け装置を提供する
ことができる。[Effects of the Invention] As explained above, according to the present invention, the working time required for the heating and cooling process of the soldering work is significantly shortened, and the soldering work, in particular, to the parts to be joined having a large heat capacity can be efficiently performed. It is possible to provide a soldering device that can perform soldering.
【図1】本発明の一実施例である半田ゴテ装置の概略構
成図である。FIG. 1 is a schematic configuration diagram of a soldering iron device that is an embodiment of the present invention.
【図2】本実施例の変形例を示す図である。FIG. 2 is a diagram showing a modification of the present embodiment.
10 半田ゴテ部 12 コテ先部 14 把持部 20 送風装置 22 送風源 24 送風口 26 通風路 30 発熱部 10 Soldering iron part 12 Tip of the iron 14 Gripping part 20 Blower device 22 Air source 24 Ventilation port 26 Ventilation duct 30 Heat generating part
Claims (2)
ることにより半田付けを行う半田付け装置において、前
記コテ先部に雰囲気ガスを送り出す送風手段を設け、且
つ該送風手段又はその通風路に半田を溶かす熱を発生さ
せる発熱手段を設けたことを特徴とする半田付け装置。1. A soldering device that performs soldering by bringing a soldering iron tip into contact with a part to be joined and heating the soldering iron tip, wherein a blowing means for sending atmospheric gas to the soldering iron tip is provided, and the blowing means or its ventilation A soldering device characterized in that a heat generating means for generating heat to melt solder is provided in a path.
とを特徴とする請求項1記載の半田付け装置。2. The soldering apparatus according to claim 1, wherein the atmospheric gas is an inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187091A JPH04309457A (en) | 1991-04-06 | 1991-04-06 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187091A JPH04309457A (en) | 1991-04-06 | 1991-04-06 | Soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04309457A true JPH04309457A (en) | 1992-11-02 |
Family
ID=14312020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10187091A Withdrawn JPH04309457A (en) | 1991-04-06 | 1991-04-06 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04309457A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07135063A (en) * | 1993-11-09 | 1995-05-23 | Kuroda Denki Kk | Soldering method of connecting terminal for resin coating wire |
| JP2008279473A (en) * | 2007-05-09 | 2008-11-20 | Kazuto Fujimoto | Soldering iron |
-
1991
- 1991-04-06 JP JP10187091A patent/JPH04309457A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07135063A (en) * | 1993-11-09 | 1995-05-23 | Kuroda Denki Kk | Soldering method of connecting terminal for resin coating wire |
| JP2008279473A (en) * | 2007-05-09 | 2008-11-20 | Kazuto Fujimoto | Soldering iron |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980711 |