JPH0431386U - - Google Patents

Info

Publication number
JPH0431386U
JPH0431386U JP7371090U JP7371090U JPH0431386U JP H0431386 U JPH0431386 U JP H0431386U JP 7371090 U JP7371090 U JP 7371090U JP 7371090 U JP7371090 U JP 7371090U JP H0431386 U JPH0431386 U JP H0431386U
Authority
JP
Japan
Prior art keywords
ring
flanges
clamp
center ring
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7371090U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7371090U priority Critical patent/JPH0431386U/ja
Publication of JPH0431386U publication Critical patent/JPH0431386U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Joints With Pressure Members (AREA)
  • Flanged Joints, Insulating Joints, And Other Joints (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案クランプ継手の一実施例の構成
を示す断面図、第2図a,bはそれぞれ本考案に
おけるセンターリングの正面図及びその断面図、
第3図は本考案クランプを用いた半導体製造装置
の真空排気部の構成例を示す説明図、第4図は従
来クランプ継手の一例の構成を示す断面図、第5
図は従来クランプ継手を用いた半導体製造装置の
真空排気部の構成例を示す説明図である。 1……フランジ、2……管部、3……Oリング
、4……センターリング、4a……Oリング、5
……クランプ、6……(金)網、7a……本考案
クランプ継手、8……管。
FIG. 1 is a cross-sectional view showing the structure of an embodiment of the clamp joint of the present invention, and FIGS. 2 a and b are a front view and a cross-sectional view of the center ring of the present invention, respectively.
FIG. 3 is an explanatory diagram showing an example of the configuration of a vacuum evacuation section of a semiconductor manufacturing apparatus using the clamp of the present invention, FIG. 4 is a sectional view showing the configuration of an example of a conventional clamp joint, and FIG.
The figure is an explanatory diagram showing an example of the configuration of a vacuum evacuation section of a semiconductor manufacturing apparatus using a conventional clamp joint. 1...Flange, 2...Pipe section, 3...O ring, 4...Center ring, 4a...O ring, 5
... Clamp, 6 ... (gold) mesh, 7a ... Clamp joint of the present invention, 8 ... Pipe.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 対向するフランジ1,1を有する管部2,2と
、両フランジ1,1間に挿設したOリング3と、
このOリング3を保持するセンターリング4と、
両フランジ1,1の外周を締付けるクランプ5と
よりなるクランプ継手において、前記センターリ
ング4に網6を取付けてなるクランプ継手。
Pipe parts 2, 2 having opposing flanges 1, 1, and an O-ring 3 inserted between both flanges 1, 1,
A center ring 4 that holds this O-ring 3;
This clamp joint consists of a clamp 5 that tightens the outer periphery of both flanges 1, 1, and a net 6 is attached to the center ring 4.
JP7371090U 1990-07-10 1990-07-10 Pending JPH0431386U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7371090U JPH0431386U (en) 1990-07-10 1990-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7371090U JPH0431386U (en) 1990-07-10 1990-07-10

Publications (1)

Publication Number Publication Date
JPH0431386U true JPH0431386U (en) 1992-03-13

Family

ID=31612766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7371090U Pending JPH0431386U (en) 1990-07-10 1990-07-10

Country Status (1)

Country Link
JP (1) JPH0431386U (en)

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