JPH04314370A - Superconducting multilayer device and its manufacturing method - Google Patents

Superconducting multilayer device and its manufacturing method

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Publication number
JPH04314370A
JPH04314370A JP3105218A JP10521891A JPH04314370A JP H04314370 A JPH04314370 A JP H04314370A JP 3105218 A JP3105218 A JP 3105218A JP 10521891 A JP10521891 A JP 10521891A JP H04314370 A JPH04314370 A JP H04314370A
Authority
JP
Japan
Prior art keywords
superconducting
layer
single crystal
crystal
superconductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3105218A
Other languages
Japanese (ja)
Inventor
Hideaki Numata
秀昭 沼田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP3105218A priority Critical patent/JPH04314370A/en
Publication of JPH04314370A publication Critical patent/JPH04314370A/en
Pending legal-status Critical Current

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  • Containers, Films, And Cooling For Superconductive Devices (AREA)

Abstract

PURPOSE:To eliminate grain boundary which causes magnetic and electrical noises by using a single crystalline superconductive film when constituting a superconductive laminated element by laminating a superconductive layer and an insulating layer. CONSTITUTION:A single crystalline superconductive contact layer 13 and a single crystalline insulating layer 14 are laminated on a first single crystalline superconductive wiring 12, and a single crystalline superconductive wiring 15 is further arranged thereon. Therefore, grain boundary is eliminated inside a superconductive wiring and remaining magnetic field is reduced, thereby improving normal operativity and reliability of a superconductive laminated element.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、超伝導層と絶縁層を積
層して構成される超伝導積層素子の構造とその製造方法
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of a superconducting multilayer element formed by laminating a superconducting layer and an insulating layer, and a method for manufacturing the same.

【0002】0002

【従来の技術】従来の超伝導層と絶縁層の積層構造が、
例えばアイトリプルイートランザクション  オン  
マグネティクス誌,21巻,第2号,1985年3月号
の102頁に述べられている。すなわち、多結晶超伝導
配線層上に多結晶絶縁層を重ねた積層構造が用いられて
いた。また、その製造方法は、多結晶超伝導配線層上に
結晶的に不連続な多結晶絶縁層を積層していた。
[Prior art] The conventional laminated structure of superconducting layer and insulating layer is
For example, iTriple E transaction on
It is described on page 102 of Magnetics Magazine, Volume 21, No. 2, March 1985 issue. That is, a stacked structure in which a polycrystalline insulating layer is stacked on a polycrystalline superconducting wiring layer has been used. In addition, in the manufacturing method, a crystallically discontinuous polycrystalline insulating layer is laminated on a polycrystalline superconducting wiring layer.

【0003】0003

【発明が解決しようとする課題】従来の超伝導配線層内
には結晶粒界が存在し、臨界温度以下の温度で結晶粒内
が超伝導層になった後も結晶粒界部に常伝導領域が残っ
た。そのため、超伝導配線層を臨界温度以下にしても結
晶粒界常伝導領域に磁束が捕束され、超伝導配線層の実
効的マイスナ効果が弱められていた。捕束磁束は、超伝
導回路の磁気雑音源になり、また、その熱的運動により
電気的雑音源になり、超伝導回路の正常動作あるいは信
頼性を損ねていた。
[Problem to be solved by the invention] Grain boundaries exist in conventional superconducting wiring layers, and even after the inside of the crystal grains becomes a superconducting layer at a temperature below the critical temperature, normal conduction occurs at the grain boundaries. area remained. Therefore, even if the temperature of the superconducting wiring layer is lower than the critical temperature, magnetic flux is trapped in the grain boundary normal conduction region, weakening the effective Meissner effect of the superconducting wiring layer. The trapped magnetic flux becomes a source of magnetic noise in the superconducting circuit, and its thermal motion becomes a source of electrical noise, impairing the normal operation or reliability of the superconducting circuit.

【0004】本発明の目的は、超伝導配線層の捕束磁束
を排除し、磁気雑音,電気的雑音の低減を図った超伝導
積層素子とその製造方法を提供することにある。
[0004] An object of the present invention is to provide a superconducting multilayer device and a method for manufacturing the same, which eliminates the trapped magnetic flux of the superconducting wiring layer and reduces magnetic noise and electrical noise.

【0005】[0005]

【課題を解決するための手段】本発明は、超伝導層と絶
縁層を積層して構成される超伝導積層素子において、第
1の単結晶超伝導配線層上に重ねて、単結晶超伝導コン
タクト層と、この単結晶超伝導コンタクト層と同じ厚さ
の単結晶絶縁層とが互いに隣接するように配置され、更
に単結晶超伝導コンタクト層と単結晶絶縁層の両方かま
たはいずれか一方の上に重ねて、第2の単結晶超伝導配
線層を配置したことを特徴とする。
[Means for Solving the Problems] The present invention provides a superconducting multilayer element configured by laminating a superconducting layer and an insulating layer. A contact layer and a single crystal insulating layer having the same thickness as the single crystal superconducting contact layer are arranged adjacent to each other; It is characterized in that a second single-crystal superconducting wiring layer is disposed overlying it.

【0006】また本発明は、超伝導層と絶縁層を積層し
て構成される超伝導積層素子の製造方法において、第1
の単結晶超伝導配線層を形成する工程と、単結晶超伝導
コンタクト層領域を残して第1の単結晶超伝導配線層の
一部を薄くする工程と、薄くなった第1の単結晶超伝導
配線層上に、単結晶超伝導コンタクト層と同じ厚さの単
結晶絶縁層をエピタキシャル成長させる工程と、単結晶
超伝導コンタクト層と単結晶絶縁層の両方かまたはいず
れか一方の上に重ねて、第2の単結晶超伝導配線層をエ
ピタキシャル成長させる工程と含むことを特徴とする。
[0006] The present invention also provides a method for manufacturing a superconducting multilayer element formed by laminating a superconducting layer and an insulating layer.
a step of forming a single crystal superconducting wiring layer, a step of thinning a part of the first single crystal superconducting wiring layer leaving a single crystal superconducting contact layer region, and a step of forming a thin first single crystal superconducting wiring layer; A step of epitaxially growing a single crystal insulating layer having the same thickness as the single crystal superconducting contact layer on the conductive wiring layer, and overlaying the single crystal superconducting contact layer and/or the single crystal insulating layer. , a step of epitaxially growing a second single-crystal superconducting wiring layer.

【0007】[0007]

【作用】超伝導多結晶膜では、ある大きさの単結晶粒が
不規則に寄せ集まっている巨視的な膜を構成している。 互に隣接する単結晶粒の境界領域、いわゆる粒界では互
の結晶性が不連続であり、結晶表面のエネルギー準位や
、結晶転位によるポテンシャルの乱れが生じ超伝導性が
失われるか、または、結晶粒に比べて弱い超伝導性しか
発現しない。そのため、超伝導多結晶膜を臨界温度以下
の環境においた場合、結晶粒内は超伝導になっても粒界
に常伝導状態が残る。マイスナ効果によって、結晶粒内
から磁場は排除されるが粒界には磁場が残る。このいわ
ゆる磁束捕束現象を避けるためには、磁束捕束中心とな
る粒界を除くことが効果的である。磁気的雑音あるいは
電気的雑音の原因の一つである残留磁場を効果的に低減
するためには、素子に用いられる全ての超伝導体から残
留磁界を排除する必要がある。
[Operation] A superconducting polycrystalline film constitutes a macroscopic film in which single crystal grains of a certain size are irregularly gathered. In the boundary regions of adjacent single crystal grains, so-called grain boundaries, mutual crystallinity is discontinuous, and energy levels on the crystal surface and potentials due to crystal dislocations are disturbed, resulting in loss of superconductivity, or , exhibits only weak superconductivity compared to crystal grains. Therefore, when a superconducting polycrystalline film is placed in an environment below the critical temperature, even though the inside of the crystal grains becomes superconductive, the grain boundaries remain in a normal conductive state. Due to the Meissner effect, the magnetic field is removed from within the crystal grains, but the magnetic field remains at the grain boundaries. In order to avoid this so-called magnetic flux trapping phenomenon, it is effective to eliminate grain boundaries that are the center of magnetic flux trapping. In order to effectively reduce residual magnetic fields, which are one of the causes of magnetic or electrical noise, it is necessary to eliminate residual magnetic fields from all superconductors used in devices.

【0008】本発明の超伝導積層素子では、第1の超伝
導配線に単結晶超伝導層を用い、更に第2の超伝導配線
に、そして第1,第2の超伝導配線を連結する超伝導コ
ンタクト層にも単結晶膜を用いた。その結果、結晶粒界
が消滅し、そこでの磁束捕束、及びそれに起因する残留
磁界を除去することができた。そのため磁気的雑音,電
気的雑音が減少し、超伝導回路の正常動作性,信頼性が
向上した。
In the superconducting multilayer device of the present invention, a single crystal superconducting layer is used for the first superconducting wiring, and a superconducting layer is further used for the second superconducting wiring and connecting the first and second superconducting wirings. A single crystal film was also used for the conductive contact layer. As a result, the grain boundaries disappeared, and the magnetic flux trapped there, as well as the residual magnetic field caused by it, could be removed. As a result, magnetic noise and electrical noise are reduced, and the normal operation and reliability of superconducting circuits are improved.

【0009】本発明の超伝導積層素子の製造方法では、
第1の超伝導配線として単結晶超伝導層を形成し、更に
その上に重ねた絶縁層をエピタキシャル成長により単結
晶化し、更にその上に重ねた第2の超伝導配線層をエピ
タキシャル成長により単結晶化した。その結果、結晶粒
界が消滅し、それに起因する捕束磁束,残留磁界を除去
することができた。その結果、磁気的雑音,電気的雑音
が減少し、超伝導回路の正常動作性,信頼性が向上した
[0009] In the method for manufacturing a superconducting multilayer device of the present invention,
A single crystal superconducting layer is formed as the first superconducting wiring, an insulating layer layered on top of it is made into a single crystal by epitaxial growth, and a second superconducting wiring layer layered thereon is made into a single crystal by epitaxial growth. did. As a result, the grain boundaries disappeared, and the trapped magnetic flux and residual magnetic field caused by them could be removed. As a result, magnetic noise and electrical noise are reduced, and the normal operation and reliability of the superconducting circuit are improved.

【0010】0010

【実施例】図1は本発明である超伝導積層素子の一実施
例を説明するための断面図である。例えば、
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view for explaining an embodiment of a superconducting multilayer device according to the present invention. for example,

【0011
0011
]

【数1】[Math 1]

【0012】を主表面とするサファイアを基板11に用
いて、例えば厚さ200nmのニオブ単結晶膜が第1の
単結晶超伝導配線層12として配置されている。第1の
単結晶超伝導配線層上に重ねて、例えば厚さ200nm
のニオブ単結晶超伝導コンタクト層13と、例えば厚さ
200nmのサファイア単結晶絶縁層14が配置されて
いる。単結晶超伝導コンタクト層13と単結晶絶縁層1
4の両方または一方の上に重ねて、例えば厚さ200n
mのニオブ単結晶膜を用いた第2の単結晶超伝導配線層
15が配置されている。
A niobium single crystal film having a thickness of, for example, 200 nm is disposed as a first single crystal superconducting wiring layer 12 using sapphire having a main surface as the substrate 11 . Overlaid on the first single crystal superconducting wiring layer to a thickness of, for example, 200 nm.
A niobium single crystal superconducting contact layer 13 and a sapphire single crystal insulating layer 14 having a thickness of, for example, 200 nm are arranged. Single crystal superconducting contact layer 13 and single crystal insulating layer 1
For example, the thickness is 200n.
A second single crystal superconducting wiring layer 15 using a niobium single crystal film of m is disposed.

【0013】本実施例の超伝導積層素子において、ジョ
セフソン素子が含まれてもよいし、また抵抗体を含むこ
とは可能である。また、基板には、バルクのニオブ単結
晶を用いて、基板と第1の単結晶超伝導配線層を兼ねた
素子構造にしてもよい。
The superconducting multilayer device of this embodiment may include a Josephson element, and may also include a resistor. Alternatively, a bulk niobium single crystal may be used for the substrate to form an element structure that serves both as the substrate and the first single-crystal superconducting wiring layer.

【0014】図2は、本発明の製造方法の一実施例を説
明するための超伝導積層素子の製造工程断面図である。
FIG. 2 is a cross-sectional view of a superconducting multilayer device manufacturing process for explaining an embodiment of the manufacturing method of the present invention.

【0015】まず、図2(a)に示すように、例えばFirst, as shown in FIG. 2(a), for example,


0016】
[
0016

【数2】[Math 2]

【0017】を主表面とするサファイアを基板21に用
いて、例えば厚さ400nmのニオブ単結晶膜を第1の
単結晶超伝導配線層22として、例えば分子線エピタキ
シャル法で成長した。
Using sapphire having the main surface as the substrate 21, a 400 nm thick niobium single crystal film was grown as the first single crystal superconducting wiring layer 22 by, for example, the molecular beam epitaxial method.

【0018】次に、図2(b)に示すように、例えばC
F4 ガスを用いた反応性イオンエッチング法で単結晶
超伝導コンタクト層23の領域を残して、第1の単結晶
超伝導配線層22を例えば深さ200nmエッチングし
た。
Next, as shown in FIG. 2(b), for example, C
The first single-crystal superconducting wiring layer 22 was etched to a depth of 200 nm, for example, by a reactive ion etching method using F4 gas, leaving a region of the single-crystal superconducting contact layer 23.

【0019】次に、図2(c)に示すように、例えば厚
さ200nmのサファイア単結晶膜を例えば分子線エピ
タキシャル法で成長し、単結晶絶縁層24を形成した。
Next, as shown in FIG. 2(c), a sapphire single crystal film having a thickness of, for example, 200 nm was grown by, for example, molecular beam epitaxial method to form a single crystal insulating layer 24.

【0020】次に、図2(d)に示すように、例えばポ
リスチレンを塗布し、例えば200℃で30分加熱して
試料表面を平坦にした後、例えば反応性イオンエッチン
グ法でエッチバックし、単結晶超伝導コンタクト層23
の表面を露出させた。
Next, as shown in FIG. 2(d), for example, polystyrene is applied, heated at 200° C. for 30 minutes to flatten the sample surface, and then etched back using, for example, reactive ion etching. Single crystal superconducting contact layer 23
exposed the surface.

【0021】最後に、図2(e)に示すように、例えば
分子線エピタキシャル法で、例えば厚さ200nmのニ
オブ単結晶膜を第2の単結晶超伝導配線層25として成
長し、例えば反応性イオンエッチング法を用いて形状加
工を行った。
Finally, as shown in FIG. 2E, a 200 nm thick niobium single crystal film is grown as a second single crystal superconducting wiring layer 25 by, for example, molecular beam epitaxial method. The shape was processed using the ion etching method.

【0022】[0022]

【発明の効果】本発明の超伝導積層素子とその製造方法
によれば、素子内の超伝導配線内の結晶粒界を排除し、
結晶粒界に起因する捕束磁束,残留磁界が消滅し、超伝
導回路の正常動作性,信頼性の向上を可能にした。
[Effects of the Invention] According to the superconducting multilayer device and its manufacturing method of the present invention, grain boundaries in superconducting wiring within the device are eliminated,
The trapped magnetic flux and residual magnetic field caused by grain boundaries are eliminated, making it possible to improve the normal operation and reliability of superconducting circuits.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明である超伝導積層素子の一実施例を示す
断面図である。
FIG. 1 is a sectional view showing an embodiment of a superconducting multilayer device according to the present invention.

【図2】本発明である製造方法の一実施例を示す製造工
程断面図である。
FIG. 2 is a manufacturing process sectional view showing an embodiment of the manufacturing method of the present invention.

【符号の説明】[Explanation of symbols]

11,21  基板 12,22  第1の単結晶超伝導配線層13,23 
 単結晶超伝導コンタクト層14,24  単結晶絶縁
11, 21 Substrate 12, 22 First single crystal superconducting wiring layer 13, 23
Single crystal superconducting contact layer 14, 24 Single crystal insulating layer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】超伝導層と絶縁層を積層して構成される超
伝導積層素子において、第1の単結晶超伝導配線層上に
重ねて、単結晶超伝導コンタクト層と、この単結晶超伝
導コンタクト層と同じ厚さの単結晶絶縁層とが互いに隣
接するように配置され、更に単結晶超伝導コンタクト層
と単結晶絶縁層の両方かまたはいずれか一方の上に重ね
て、第2の単結晶超伝導配線層を配置したことを特徴と
する超伝導積層素子。
Claim 1: A superconducting multilayer element configured by laminating a superconducting layer and an insulating layer, in which a single crystal superconducting contact layer and a single crystal superconducting contact layer are superposed on a first single crystal superconducting wiring layer; A conductive contact layer and a single crystal insulating layer of the same thickness are arranged adjacent to each other, and a second A superconducting multilayer device characterized by having a single crystal superconducting wiring layer arranged therein.
【請求項2】超伝導層と絶縁層を積層して構成される超
伝導積層素子の製造方法において、第1の単結晶超伝導
配線層を形成する工程と、単結晶超伝導コンタクト層領
域を残して第1の単結晶超伝導配線層の一部を薄くする
工程と、薄くなった第1の単結晶超伝導配線層上に、単
結晶超伝導コンタクト層と同じ厚さの単結晶絶縁層をエ
ピタキシャル成長させる工程と、単結晶超伝導コンタク
ト層と単結晶絶縁層の両方かまたはいずれか一方の上に
重ねて、第2の単結晶超伝導配線層をエピタキシャル成
長させる工程と含むことを特徴とする超伝導積層素子の
製造方法。
2. A method for manufacturing a superconducting multilayer device formed by laminating a superconducting layer and an insulating layer, comprising the steps of forming a first single crystal superconducting wiring layer and forming a single crystal superconducting contact layer region. A step of thinning a part of the first single-crystal superconducting wiring layer while leaving a part of the first single-crystal superconducting wiring layer thin, and forming a single-crystal insulating layer with the same thickness as the single-crystal superconducting contact layer on the thinned first single-crystal superconducting wiring layer. and a step of epitaxially growing a second single-crystal superconducting wiring layer over both or either of the single-crystal superconducting contact layer and the single-crystal insulating layer. A method for manufacturing a superconducting multilayer device.
JP3105218A 1991-04-11 1991-04-11 Superconducting multilayer device and its manufacturing method Pending JPH04314370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3105218A JPH04314370A (en) 1991-04-11 1991-04-11 Superconducting multilayer device and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3105218A JPH04314370A (en) 1991-04-11 1991-04-11 Superconducting multilayer device and its manufacturing method

Publications (1)

Publication Number Publication Date
JPH04314370A true JPH04314370A (en) 1992-11-05

Family

ID=14401532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3105218A Pending JPH04314370A (en) 1991-04-11 1991-04-11 Superconducting multilayer device and its manufacturing method

Country Status (1)

Country Link
JP (1) JPH04314370A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6215868A (en) * 1985-07-13 1987-01-24 Agency Of Ind Science & Technol Manufacture of contact for integrated circuit
JPS6341087A (en) * 1986-08-07 1988-02-22 Nippon Telegr & Teleph Corp <Ntt> Manufacture of superconductive thin film

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6215868A (en) * 1985-07-13 1987-01-24 Agency Of Ind Science & Technol Manufacture of contact for integrated circuit
JPS6341087A (en) * 1986-08-07 1988-02-22 Nippon Telegr & Teleph Corp <Ntt> Manufacture of superconductive thin film

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