JPH04314504A - How to process small parts using a dicing saw - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for processing small parts having grooves linearly continuous in one direction using a dicing saw for cutting semiconductor substrates and the like.

0002

2. Description of the Related Art FIG. 6 is an explanatory diagram showing an example of a method for mass producing small parts having grooves. In the conventional mass production method, after etching a base material 3 of predetermined dimensions to form grooves 2 and dividing grooves 4, the base material 3 is etched along the dividing grooves 4 using a processing machine such as a dicing saw. was divided into a plurality of small parts (chips) 1.

0003

[Problems to be Solved by the Invention] As described above, the conventional processing method requires a processing step such as etching and a machining step for dividing each part, and requires two types of equipment. Further, in the etching process, as shown in FIG. 7, there were problems in that the corners of the grooves 2 were not at right angles and a radius remained, and that the flatness of the bottoms of the grooves 2 could not be ensured sufficiently. Furthermore, if the material to be processed differs, a correspondingly different etching solution must be used.

The present invention has been made to solve the above problems, and its purpose is to provide a method for accurately machining small parts having grooves using one type of machining device.

[0005]

[Means for Solving the Problems] In order to solve the above problems, a processing method according to the present invention involves cutting a groove extending linearly in one direction into a base material using a dicing saw, and then using a dicing saw to cut a groove extending linearly in one direction. It is characterized by full cutting of the base material in a direction different from the groove.

[0006] To cut the groove, after cutting the dicing saw blade into the base material to a predetermined depth, the cutting position is adjusted to the width of the groove with the dicing saw blade separated from the base material. It is desirable to repeat the process of shifting the dicing saw blade in the same direction and making the blade of the dicing saw cut into the base material to a predetermined depth again.

[0007]

[Operation] Small parts having grooves continuous in one direction can be manufactured with the processing accuracy of a dicing saw using only one type of processing device, a dicing saw.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an explanatory diagram of a method of processing a small part according to the present invention, and FIG. 2 is a perspective view showing an example of the shape of the small part after processing is completed. FIG. 1 shows a method for manufacturing the grooved rectangular part shown in FIG. 2 from a base material 3 of predetermined dimensions.

As shown in FIG. 1(a), the blade 5 of the dicing saw is cut into a substrate 3 to be processed, such as a semiconductor substrate, a ceramic substrate, or a baked plate, to a predetermined depth while cutting in one direction. A groove 2 extending linearly is formed. Next, the orientation of the base material 3 is changed by 90 degrees and the base material 3 is cut with the blade 5 of a dicing saw, thereby obtaining the small parts shown in FIG. 2.

Next, as shown in FIG.
The case of forming a relatively wide groove with a dicing saw with a depth of about 0.8 mm will be described with reference to FIG. 3. A dicing saw is commonly used for separating semiconductor chips, etc., and its blade 5 is extremely narrow, for example, 10 μm.
However, since the groove width to be machined is wide, a blade 5 with a blade width of 0.5 mm is used here. Further, since the dicing saw is originally used for cutting chips from a semiconductor substrate, the rotational driving force of the blade 5 is not so large. Therefore, the depth of each cut into the base material 3 is set to about 0.4 mm.

Then, the grooves are processed in the order shown in FIGS. 3(a) to 3(f). First, the base material 3 is cut to a depth of 0.4 mm with a blade 5 having a blade width of 0.5 mm (a). After that, the blade is lifted once and the next cutting depth (0.4 mm) is set, and the cutting groove is formed to the desired depth (0.8 mm) (b). Next, lift the blade 5 of the dicing saw and remove the base material 3.
The blade 5 or the base material 3 is moved in the width direction of the groove 2 while being separated from the groove 2, and the same cutting process is repeated (c
~f). After the groove machining is completed, the blade 5 of the dicing saw is replaced with a narrower blade if necessary, and the base material 3 is fully cut and divided into individual small parts (chips).

FIG. 4 is an explanatory diagram of another processing method according to the present invention. After cutting grooves 2 and dividing grooves 4 into the base material 3 with a dicing saw, the direction of the base material 3 or the blade 5 of the dicing saw is changed to completely cut the base material 3 to obtain the small parts 1. be.

[0013] In a similar process, FIGS. 4(a) and (
A groove-shaped part shown in b) can be created.

[0014]

[Effects of the Invention] As explained above, according to the processing method according to the present invention, a small part having a continuous groove in one direction can be manufactured with the processing accuracy of a dicing saw using only one type of processing device, which is a dicing saw. be able to.

[Brief explanation of the drawing]

[Fig. 1] An explanatory diagram of the method for processing small parts according to the present invention.

[
Figure 2: Perspective view showing an example of the shape of small parts after processing is completed

[Figure 3] Machining process diagram for wide grooves

[Fig. 4] Explanatory diagram of another processing method according to the present invention

[Figure 5]
A perspective view showing an example of the shape of small parts

[Fig. 6] Explanatory diagram showing an example of a conventional small parts mass production method

[Figure 7] Explanatory diagram showing problems with the conventional small parts mass production method

[Explanation of symbols]

1...Small parts, 2...Groove portion, 3...Base material, 4...Groove for division,
5... Dicing saw blade.

Claims (2)

[Claims] 1. After cutting a groove extending linearly in one direction into a base material to be processed using a dicing saw, the base material is cut in a direction different from the groove using the dicing saw. A method for processing small parts using a dicing saw, which is characterized by full cutting. 2. The groove is cut by cutting the dicing saw blade into the base material to a predetermined depth, and then changing the cutting position with the dicing saw blade separated from the base material. 2. The method of processing small parts using a dicing saw according to claim 1, further comprising repeating the steps of shifting the groove in the width direction and again cutting the base material with the blade of the dicing saw to a predetermined depth. .