JPH0432126B2

JPH0432126B2 -

Info

Publication number: JPH0432126B2
Application number: JP60083027A
Authority: JP
Priority date: 1985-04-18
Filing date: 1985-04-18
Publication date: 1992-05-28
Also published as: JPS61243119A

Description

[Detailed description of the invention]

〈産業上の利用分野〉本発明は、小型精密モーター等に使われるプリ
ント基板素材に適した珪素鋼板の製造方法に関す
る。〈従来の技術とその問題点〉近年、各種電子機器の発達が著しく、OA機器
やVTR等の需要が増大して、それら機器の小型
化、高性能化および低価格化が競争されるように
なつている。このような機器の部品である小型精密モータに
は、プリント基板が使用されることが多い。プリ
ント基板は、通常、紙フエノール等の樹脂板に銅
箔等によつて電子回路を配線したものである。このプリント基板をモータ部品として使用する
場合、更に構造用フレームとして、１〜1.2mmの
鉄板が重ね合わされて使用される。樹脂のプリント基板には磁束が通り難いので磁
路を構成するステータ部分が必要であるが、通
常、このフレームがその役割も兼ねている。しか
し、別に電磁鋼板を重ね合わせてステータとして
設計されることもある。このような電子回路配線機能、フレーム機能、
ステータ機能を合わせ持つ基板があれば、低価格
化、小型化ができるのみならず、ステータとロー
タとの間の樹脂基板が省略できるので、エアギヤ
ツプが小さくなり、高効率化も期待される。これに対し、最近、紙フエノール等の樹脂基板
の代わりに、鉄基板が用いられている。その場
合、製造上の諸問題より、めつき鋼板が用いられ
るが、地金が軟鋼板ではモータの特性が不十分で
ある。そこで地金を珪素鋼板にすることが考えられる
が、珪素鋼板に通常塗布、焼付されている無機質
や半有機質の絶縁被膜は、その上にエポキシ樹脂
等を塗布し、銅箔貼り付け、エツチングおよび部
品の半田付けといつた通常の基板作製工程で剥離
しやすいという欠点がある。これに対し、一部の
基板メーカでは絶縁被膜を研削除去しているが、
その場合も作製工程で珪素鋼板表面が錆びて樹脂
が剥離する問題が起きている。また、基板加工工
程中での基板使用面の反対面での錆の発生も問題
である。これらの電磁特性、強度、耐剥離性および耐食
性をすべて具備したプリント基板は、従来とは異
なつた全く新しい素材で対処する必要がある。そこで、本発明者らは先に、特願昭59−262613
号でSi0.5〜3.5重量％を含み、表面にSn，Zn，
Ni，Cr，Cu，Alのうちから１種または２種以上
を鍍金した電磁特性がよく、かつ樹脂との密着性
に優れた小型精密モーター用プリント基板に適し
た珪素鋼板の出願を行つた。該鋼板を通常の圧延、焼鈍、鍍金の工程で製造
した場合、鋼板のSi含有量が多くなると、電磁特
性は向上するものの、焼鈍時に鋼板表面に酸化層
を生成し、そのまま鍍金すると鍍金層の密着性が
劣化することがある。この傾向は鋼板のSi含有量
が１重量％以上であらわれ、特に1.5重量％以上
で顕著になる。したがつて、該鋼板の珪素含有量が多い場合は
焼鈍後、鍍金する前に砥粒付ブラシによる研削や
酸洗等による酸化層除去処理が必要であつた。こ
の酸化層除去工程は生産性を低下させ、生産価格
を上昇させるので好ましくない。〈発明の目的〉したがつて、本発明の目的は、従来技術のよう
に、珪素含有量の多い鋼板において、焼鈍後鍍金
する前に、地金と鍍金層との密着性向上のための
酸化層除去処置を必要としないプリント基板素材
に適した珪素鋼板の製造方法を提供しようとする
にある。〈発明の構成〉通常、焼鈍は750〜1050℃の温度で連続的に処
理される。本発明者らは、特願昭59−262613号で
述べたSn，Zn，Ni，Cr，Cu，Alのなかから融
点が上記焼鈍温度より高いNi，Cr，Cuを、圧延
後、焼鈍する前に該珪素鋼板に鍍金し、しかる後
焼鈍することにより、Si含有量が１重量％以上の
鋼板でも、特別に酸化層除去処理をしなくても、
地鉄と鍍金層との密着性が優れていることを見出
し、本発明を完成するに至つた。すなわち、本発明はSi1.0〜3.5重量％を含有す
る珪素鋼素材を熱間圧延し、冷間圧延して冷延板
とした後、該冷延板表面にNi，CrおよびCuのう
ちから選らばれる１種以上を５〜80ｇ／m²鍍金
し、次いで焼鈍を施すことを特徴とするプリント
基板素材に適した珪素鋼板の製造方法を提供する
ものである。以下、本発明を更に詳細に説明する。まず、Si含有量の限定理由を説明する。小型精密モーターに使用されるプリント基板
は、磁気特性が良いことが必要で、特願昭59−
262613号で記載したように、鋼板中の珪素量が多
くなるにつれてモータの無負荷電流は低下し、Si
含有量が0.5％以上の鋼板ならば、モーターの無
負荷電流を通常のSiが少ない鋼板に比べて大幅に
減少できる。従つて、Siを0.5重量％以上含有す
ることが望ましい。しかし、Si含有量が１重量％
未満の鋼板の場合は、通常の圧延、焼鈍、鍍金の
工程があつても地鉄と鍍金層との密着性の劣化は
認められないので、本発明ではSi含有量下限を１
重量％とした。一方Si含有量が3.5重量％を越えると鋼板が脆
くなり、圧延が困難となるので、3.5重量％以下
とした。鍍金の種類は前述のように、本発明において
は、鍍金後焼鈍に付されるため、前記焼鈍温度よ
り融点の高いNi，Cr，Cuのうちから１種または
２種以上を鍍金する。鍍金の目付量はプリント基
板作成上、樹脂との密着性の点から５ｇ／m²以上
必要である。目付量が多くても樹脂密着性に何ら
影響は無い。しかし、経済性の点から上限は80
ｇ／m²程度と考えられる。次いで、更に詳細に本発明の製造工程について
説明する。製綱、熱延、冷延は通常の方法でよい。要は、
Si1.0〜3.5重量％を含み、所定厚さの鋼板に圧延
することである。鋼板厚さは通常0.5〜1.5mmであ
る。圧延された鋼板は、焼鈍することなしにその
まま通常の鍍金処理される。これは前述のように
Siを１％以上含む鋼板を焼鈍後鍍金処理すると、
焼鈍時に生成した表面の酸化膜が鍍金層と地鉄と
の密着性を劣化させるからである。本発明者らは、焼鈍前に鍍金をすることでこの
問題を解決した。鍍金の方法は電気鍍金が普通で
あるが、特に限定する必要はない。鍍金された珪
素鋼板は通常の方法で焼鈍され、プリント基板用
素材に供される。焼鈍は通常750〜1050℃の温度
範囲での連続焼鈍であるが、箱焼鈍でも良く、温
度も特に限定する必要はない。〈実施例〉次に本発明を実施例について説明する。 1.0〜3.5重量％の範囲内の種々のSi含有量を有
する厚さ１mmの鋼板にNi，Cr，Cuを５ｇ／m²以
上するに当り、 (1) 通常の焼鈍後、通常の電気鍍金する方法およ
び、 (2) 冷延後、電気鍍金し、しかる後に焼鈍する方
法で処理し、両者の鍍金密着性を調べた。密着性は鋼板を180°折り曲げ、その曲げ部分の
剥離を調べて評価した。結果を第１表に示す。密着性で○は剥離のないこと、△は微少な剥
離、×は剥離したことを示す。第１表より上記(1)の冷延、焼鈍、鍍金方法では
密着性が悪いが、上記(2)の冷延、鍍金、焼鈍によ
る本発明方法により、大幅に密着性が改善される
ことがわかる。しかし、鍍金量が少ない場合は、
鍍金後、焼鈍する工程で鍍金層と地鉄の密着性は
良くなるが、その後プリント基板作成時、樹脂と
の密着性が悪かつた。また、比較として1.01重量％のSiを含有する厚
さ１mmの鋼板上に、鍍金なしで絶縁性樹脂層を形
成してプリント基板を作製したが、鋼板と樹脂部
の密着性が不十分であつた。 <Industrial Application Field> The present invention relates to a method for manufacturing a silicon steel plate suitable as a printed circuit board material used in small precision motors and the like. <Conventional technology and its problems> In recent years, various electronic devices have developed significantly, and the demand for OA equipment, VTRs, etc. has increased, and there has been competition to make these devices smaller, higher in performance, and lower in price. It's summery. Printed circuit boards are often used for small precision motors that are components of such devices. A printed circuit board is usually a resin board made of paper phenol or the like, on which electronic circuits are wired using copper foil or the like. When this printed circuit board is used as a motor component, 1 to 1.2 mm thick iron plates are superimposed and used as a structural frame. Since it is difficult for magnetic flux to pass through resin printed circuit boards, a stator part is required to form a magnetic path, and this frame usually also serves this role. However, a stator may also be designed by stacking electromagnetic steel plates. Such electronic circuit wiring function, frame function,
If there is a board that also has stator functions, not only will it be possible to reduce the price and size, but the resin board between the stator and rotor can be omitted, reducing the air gap and increasing efficiency. In contrast, recently, iron substrates have been used instead of resin substrates such as paper phenol. In this case, due to manufacturing problems, a plated steel plate is used, but if the base metal is a mild steel plate, the motor characteristics will be insufficient. Therefore, it is possible to use a silicon steel plate as the base metal, but instead of the inorganic or semi-organic insulating coating that is usually coated and baked on the silicon steel plate, epoxy resin etc. is applied on it, copper foil is pasted, etched, etc. It has the disadvantage that it easily peels off during normal board manufacturing processes such as soldering parts. In contrast, some board manufacturers remove the insulating coating by polishing.
In that case as well, there is a problem that the surface of the silicon steel plate rusts during the manufacturing process and the resin peels off. Another problem is the occurrence of rust on the surface opposite to the surface on which the substrate is used during the substrate processing process. Printed circuit boards that have all of these electromagnetic properties, strength, peel resistance, and corrosion resistance require completely new materials that are different from conventional materials. Therefore, the present inventors first applied for patent application No. 59-262613.
Contains 0.5 to 3.5% by weight of Si, and the surface contains Sn, Zn,
We have filed an application for a silicon steel sheet plated with one or more of Ni, Cr, Cu, and Al, which has good electromagnetic properties and excellent adhesion to resin, and is suitable for printed circuit boards for small precision motors. When the steel sheet is manufactured through normal rolling, annealing, and plating processes, the electromagnetic properties improve as the Si content of the steel sheet increases, but an oxide layer is generated on the surface of the steel sheet during annealing, and if plated as is, the plating layer deteriorates. Adhesion may deteriorate. This tendency appears when the Si content of the steel sheet is 1% by weight or more, and becomes particularly noticeable when the Si content is 1.5% by weight or more. Therefore, when the silicon content of the steel sheet is high, it is necessary to remove the oxide layer by grinding with an abrasive brush, pickling, etc. after annealing and before plating. This oxide layer removal step is undesirable because it reduces productivity and increases production costs. <Object of the Invention> Therefore, the object of the present invention is to oxidize a steel plate with a high silicon content to improve the adhesion between the base metal and the plating layer after annealing and before plating, unlike the prior art. The object of the present invention is to provide a method for manufacturing a silicon steel sheet suitable for use as a printed circuit board material that does not require layer removal treatment. <Structure of the Invention> Usually, annealing is performed continuously at a temperature of 750 to 1050°C. Among Sn, Zn, Ni, Cr, Cu, and Al mentioned in Japanese Patent Application No. 59-262613, the present inventors have developed Ni, Cr, and Cu, which have melting points higher than the above annealing temperature, after rolling and before annealing. By plating the silicon steel plate and then annealing it, even steel plates with a Si content of 1% by weight or more can be coated without special oxide layer removal treatment.
It was discovered that the adhesion between the base iron and the plating layer was excellent, and the present invention was completed. That is, the present invention hot-rolls a silicon steel material containing 1.0 to 3.5% by weight of Si, cold-rolls it into a cold-rolled sheet, and then coats the surface of the cold-rolled sheet with one of Ni, Cr, and Cu. The present invention provides a method for manufacturing a silicon steel sheet suitable for a printed circuit board material, which comprises plating one or more selected materials at 5 to 80 g/m ² and then annealing. The present invention will be explained in more detail below. First, the reason for limiting the Si content will be explained. Printed circuit boards used in small precision motors must have good magnetic properties, and a patent application was filed in 1984.
As described in No. 262613, as the amount of silicon in the steel sheet increases, the no-load current of the motor decreases.
A steel plate with a Si content of 0.5% or more can significantly reduce the motor's no-load current compared to a normal steel plate with low Si content. Therefore, it is desirable to contain Si in an amount of 0.5% by weight or more. However, the Si content is 1% by weight.
In the case of a steel plate with a Si content of less than
It was expressed as weight%. On the other hand, if the Si content exceeds 3.5% by weight, the steel plate becomes brittle and rolling becomes difficult, so the Si content was set to 3.5% by weight or less. Regarding the type of plating, as described above, in the present invention, since annealing is performed after plating, one or more of Ni, Cr, and Cu having a melting point higher than the annealing temperature is used for plating. The basis weight of the plating is required to be 5 g/m ² or more from the viewpoint of adhesion to the resin when making a printed circuit board. Even if the basis weight is large, there is no effect on resin adhesion. However, from an economic point of view, the upper limit is 80
It is thought to be about g/ ^m2 . Next, the manufacturing process of the present invention will be explained in more detail. Conventional methods may be used for steel making, hot rolling, and cold rolling. In short,
It contains 1.0 to 3.5% by weight of Si and is rolled into a steel plate of a predetermined thickness. The steel plate thickness is usually 0.5-1.5mm. The rolled steel plate is subjected to normal plating treatment without being annealed. This is as mentioned above
When a steel plate containing 1% or more of Si is annealed and then plated,
This is because the oxide film formed on the surface during annealing deteriorates the adhesion between the plating layer and the base steel. The present inventors solved this problem by plating before annealing. The plating method is usually electroplating, but there is no need to limit it in particular. The plated silicon steel plate is annealed in a conventional manner and used as a material for printed circuit boards. Annealing is usually continuous annealing in a temperature range of 750 to 1050°C, but box annealing may also be used, and the temperature does not need to be particularly limited. <Example> Next, the present invention will be described with reference to an example. When adding 5 g/ ^m2 or more of Ni, Cr, Cu to a 1 mm thick steel plate with various Si contents in the range of 1.0 to 3.5 wt%, (1) Normal electroplating after normal annealing. (2) Cold rolling, electroplating, and subsequent annealing were used to examine the plating adhesion between the two methods. Adhesion was evaluated by bending the steel plate 180° and examining peeling at the bent portion. The results are shown in Table 1. In terms of adhesion, ◯ indicates no peeling, △ indicates slight peeling, and × indicates peeling. Table 1 shows that the adhesion is poor with the cold rolling, annealing, and plating method described in (1) above, but the adhesion is significantly improved by the method of the present invention using cold rolling, plating, and annealing described in (2) above. Recognize. However, if the amount of plating is small,
After plating, the adhesion between the plating layer and the base metal was improved during the annealing process, but the adhesion with the resin was poor when the printed circuit board was subsequently produced. In addition, as a comparison, a printed circuit board was fabricated by forming an insulating resin layer without plating on a 1 mm thick steel plate containing 1.01% by weight of Si, but the adhesion between the steel plate and the resin part was insufficient. Ta.

【表】【table】

【表】〈発明の効果〉本発明の冷延、鍍金、焼鈍という工程を有する
方法により、小型精密モーター用に適した鍍金珪
素鋼板が、特に鍍金前処理として、特別な酸化膜
除去工程をしなくても生産可能となり、生産性向
上、コストダウンが果たされた。[Table] <Effects of the invention> By the method of the present invention, which includes the steps of cold rolling, plating, and annealing, a plated silicon steel sheet suitable for use in small precision motors can be produced without a special oxide film removal process as a pre-plating treatment. It has become possible to produce even without it, improving productivity and reducing costs.

Claims

[Claims]

1 A silicon steel material containing 1.0 to 3.5% by weight of Si is hot-rolled and then cold-rolled to form a cold-rolled plate, and then 1 selected from Ni, Cr and Cu is applied to the surface of the cold-rolled plate.
A method for producing a silicon steel sheet suitable for use as a printed circuit board material, which comprises plating 5 to 80 g/m ² or more and then annealing.