JPH04323032A - Manufacture of laminated board - Google Patents
Manufacture of laminated boardInfo
- Publication number
- JPH04323032A JPH04323032A JP3093812A JP9381291A JPH04323032A JP H04323032 A JPH04323032 A JP H04323032A JP 3093812 A JP3093812 A JP 3093812A JP 9381291 A JP9381291 A JP 9381291A JP H04323032 A JPH04323032 A JP H04323032A
- Authority
- JP
- Japan
- Prior art keywords
- laminate
- polybenzimidazole resin
- laminated
- resin
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 31
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000004693 Polybenzimidazole Substances 0.000 claims abstract description 25
- 229920002480 polybenzimidazole Polymers 0.000 claims abstract description 25
- 239000011888 foil Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 5
- 238000011437 continuous method Methods 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- SXEHKFHPFVVDIR-UHFFFAOYSA-N [4-(4-hydrazinylphenyl)phenyl]hydrazine Chemical compound C1=CC(NN)=CC=C1C1=CC=C(NN)C=C1 SXEHKFHPFVVDIR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- FHESUNXRPBHDQM-UHFFFAOYSA-N diphenyl benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OC=2C=CC=CC=2)=CC=1C(=O)OC1=CC=CC=C1 FHESUNXRPBHDQM-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- -1 hexamethylsulfamide Chemical compound 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、耐熱性のプリント配線
板を製造するために用いる積層板の製造方法に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminate used for manufacturing heat-resistant printed wiring boards.
【0002】0002
【従来の技術】電気機器や電子機器、コンピューター、
通信機器等に用いられる耐熱性のプリント配線板として
は、エポキシ樹脂積層板を用いて作成したものが汎用さ
れている。そしてこのエポキシ樹脂積層板は、ガラス布
等の基材にエポキシ樹脂を含浸して乾燥すると共に所要
寸法に切断してプリプレグを作成し、そしてこのプリプ
レグを複数枚重ねると共にさらにその片側もしくは両側
に所要寸法に切断した銅箔を重ね、これを加熱加圧して
積層成形することによって、製造されている。[Prior art] Electrical equipment, electronic equipment, computers,
BACKGROUND ART Heat-resistant printed wiring boards used in communication equipment and the like are commonly made from epoxy resin laminates. This epoxy resin laminate is made by impregnating a base material such as glass cloth with epoxy resin, drying it, and cutting it to the required size to create a prepreg, then stacking multiple sheets of prepreg and adding the required amount to one or both sides of the prepreg. It is manufactured by stacking copper foils cut to size and then heating and pressing them to form a laminate.
【0003】0003
【発明が解決しようとする課題】しかし、エポキシ樹脂
は熱変形温度が比較的低いために、エポキシ樹脂積層板
にドリル加工して孔を明ける際に、孔の内周において剪
断発熱に伴ってエポキシ樹脂が溶けて、スミアー不良が
発生し易いという問題があった。また、上記のように製
造をおこなうにあたって、成形はバッチ作業になるため
に生産性が低いので、プリプレグと銅箔との積載物をス
テンレスプレートを介して15枚程度重ね、さらにこれ
を熱盤を介して20〜30段程度積み上げ、これを加圧
するという多段成形で積層成形がおこなわれているが、
このように多数枚の積層板を同時に積層すると各積層板
の厚みのバラツキが大きくなるという問題が生じるもの
であった。[Problems to be Solved by the Invention] However, since epoxy resin has a relatively low heat distortion temperature, when drilling holes in an epoxy resin laminate, the epoxy resin may shrink due to shear heat generation at the inner periphery of the hole. There was a problem in that the resin melted and smear defects were likely to occur. In addition, when manufacturing as described above, the productivity is low because molding is a batch process, so about 15 sheets of prepreg and copper foil are stacked on top of each other with stainless steel plates interposed between them, and then this is placed on a hot platen. Laminate molding is carried out by stacking 20 to 30 layers of materials and pressurizing them.
When a large number of laminates are laminated at the same time in this way, a problem arises in that the thickness of each laminate becomes highly uneven.
【0004】本発明は上記の点に鑑みてなされたもので
あり、積層板のスミアー不良の発生を低減できると共に
、生産性良くしかも厚み精度高く積層板を製造すること
ができるようにすることを目的とするものである。The present invention has been made in view of the above points, and aims to reduce the occurrence of smear defects in laminates, and to manufacture laminates with high productivity and high thickness accuracy. This is the purpose.
【0005】[0005]
【課題を解決するための手段】本発明に係る積層板の製
造方法は、長尺の基材1にポリベンツイミダゾール樹脂
2を含浸させ、この含浸済みの基材1を連続して送りつ
つ複数枚重ねると共にさらに長尺の金属箔3を重ね、こ
れをさらに連続して送りつつ無圧下で加熱してポリベン
ツイミダゾール樹脂2を硬化させるとともに上記各基材
1と金属箔3を積層一体化し、しかる後に所要寸法に切
断することを特徴とするものである。[Means for Solving the Problems] A method for manufacturing a laminate according to the present invention involves impregnating a long base material 1 with a polybenzimidazole resin 2, and continuously feeding a plurality of impregnated base materials 1. As the sheets are stacked, a long metal foil 3 is further stacked, which is further continuously fed and heated under no pressure to harden the polybenzimidazole resin 2, and the above-mentioned base materials 1 and the metal foil 3 are laminated and integrated, It is characterized in that it is then cut into required dimensions.
【0006】以下、本発明を詳細に説明する。ポリベン
ツイミダゾール樹脂2は例えばジアミノベンジジンとジ
フェニルイソフタレートを重合させて得られる芳香族系
の耐熱樹脂であり、このポリベンツイミダゾール樹脂2
は、NN′ジメチルホルムアミド、NN′ジメチルアセ
トアミド、Nメチルピロリドン、ヘキサメチルスルホア
ミド、ジメチルスルホオキサイド等の溶剤に溶解させて
、濃度が30〜60重量%程度のワニスとして用いるの
が好ましい。また基材1としてはガラス繊維、合成繊維
等の織布や不織布、ペーパー、その他、紙などを用いる
ことができ、ロールに巻いた長尺帯状のものとして使用
されるものである。さらに金属箔3としては、銅箔、ア
ルミニウム箔、鉄箔、ニッケル箔、亜鉛箔、その他の合
金箔等を単独であるいは組み合わせて用いることができ
、ロールに巻いた長尺帯状のものとして使用されるもの
である。この金属箔3の基材1に重ねられる側の面には
接着剤の層を設けるようにしてもよい。The present invention will be explained in detail below. The polybenzimidazole resin 2 is an aromatic heat-resistant resin obtained by polymerizing diaminobenzidine and diphenyl isophthalate, for example.
is preferably dissolved in a solvent such as NN'dimethylformamide, NN'dimethylacetamide, N-methylpyrrolidone, hexamethylsulfamide, dimethylsulfoxide, etc., and used as a varnish having a concentration of about 30 to 60% by weight. The base material 1 may be a woven fabric or non-woven fabric made of glass fiber, synthetic fiber, paper, or the like, and is used as a long strip wound into a roll. Further, as the metal foil 3, copper foil, aluminum foil, iron foil, nickel foil, zinc foil, other alloy foils, etc. can be used alone or in combination, and are used in the form of a long strip wound into a roll. It is something that An adhesive layer may be provided on the side of the metal foil 3 that is overlapped with the base material 1.
【0007】しかして、積層板を製造するにあたっては
、まず複数枚の基材1をロールから繰り出して連続して
送りつつ、ポリベンツイミダゾール樹脂2のワニスを入
れた含浸槽10に各基材1を浸漬させながら通過させる
ことによって、各基材1にポリベンツイミダゾール樹脂
2を含浸させる。このようにポリベンツイミダゾール樹
脂2を含浸させた基材1をさらに連続して送りつつ、ポ
リベンツイミダゾール樹脂2を溶剤に溶かしているとき
には乾燥ヒーター11に通して溶剤を蒸発させる。そし
てこのように連続して送られる複数枚の含浸済みの基材
1を乾燥させていない状態でラミネートロール12間に
通して重ね合わせ、さらにこのとき金属箔3をロールか
ら繰り出して連続して送りつつラミネートロール12間
に通して、重ね合わせた基材1の片側の外面あるいは両
側の外面に重ねる。このように複数枚のポリベンツイミ
ダゾール樹脂を含浸した基材1と金属箔3とを重ね合わ
せたものを連続して送りつつトンネル型加熱炉など加熱
炉13に送り込んで通す。各基材1と金属箔3とはその
自重等による接触圧で接触しているだけであり、無圧下
で加熱炉13に通してポリベンツイミダゾール樹脂2を
硬化させる。加熱炉13内での加熱条件は、温度を14
0〜180℃、時間を5〜30分間に設定するのが好ま
しい。このように基材1に含浸したポリベンツイミダゾ
ール樹脂2を硬化させることによって、複数枚の基材1
と金属箔3とを積層一体化させることができるものであ
り、これをカッター14で所要寸法毎に切断することに
よって、金属箔3を表面に張ったポリベンツイミダゾー
ル樹脂積層板Aを得ることができるものである。[0007] In manufacturing a laminate, first, a plurality of base materials 1 are unrolled from a roll and fed continuously, and each base material 1 is placed in an impregnating bath 10 containing a varnish of polybenzimidazole resin 2. Each base material 1 is impregnated with the polybenzimidazole resin 2 by passing the polybenzimidazole resin 2 through it while immersing it. The base material 1 impregnated with the polybenzimidazole resin 2 in this manner is further continuously fed, and when the polybenzimidazole resin 2 is dissolved in a solvent, it is passed through a drying heater 11 to evaporate the solvent. The plurality of impregnated base materials 1 that are continuously fed in this way are passed between laminating rolls 12 in an undried state and overlapped, and furthermore, at this time, the metal foil 3 is let out from the rolls and fed continuously. The material is then passed between laminating rolls 12 and superimposed on one or both outer surfaces of the stacked base materials 1. In this way, a plurality of polybenzimidazole resin-impregnated base materials 1 and metal foils 3 are stacked one on top of the other and are continuously fed into a heating furnace 13 such as a tunnel type heating furnace. Each base material 1 and the metal foil 3 are in contact only by contact pressure due to their own weight, etc., and the polybenzimidazole resin 2 is cured by passing through a heating furnace 13 under no pressure. The heating conditions in the heating furnace 13 are as follows:
Preferably, the temperature is 0 to 180°C and the time is set to 5 to 30 minutes. By curing the polybenzimidazole resin 2 impregnated into the base material 1 in this way, a plurality of base materials 1
and metal foil 3 can be laminated and integrated, and by cutting this into required dimensions with a cutter 14, it is possible to obtain a polybenzimidazole resin laminate A with metal foil 3 stretched on the surface. It is possible.
【0008】[0008]
【作用】上記のようにして得たポリベンツイミダゾール
樹脂積層板Aにあっては、ポリベンツイミダゾール樹脂
は熱変形温度が高いために、ドリル加工する際の剪断発
熱で溶けてスミアー不良が発生することを低減すること
ができる。また積層板Aは連続工法で生産性良く製造を
おこなうことができると共に、積層板Aは一枚ずつ積層
成形がされることになるために各積層板間の板厚のバラ
ツキを低減することができる。[Function] In the polybenzimidazole resin laminate A obtained as described above, since the polybenzimidazole resin has a high heat distortion temperature, it melts due to shear heat generated during drilling, resulting in smear defects. This can be reduced. In addition, laminate A can be manufactured with high productivity using a continuous method, and since laminate A is laminated one by one, it is possible to reduce variations in thickness between each laminate. can.
【0009】[0009]
【実施例】次に、本発明を実施例によって例証する。
実施例1
幅が105cm、厚みが0.15mmの長尺のガラス布
で形成される基材を図1のように連続して送りつつ、4
5重量%濃度のポリベンツイミダゾール樹脂のジメチル
アセトアミド溶液を含浸させた。この含浸済みの基材を
3枚連続して送りつつラミネートロール間に通すと共に
厚み0.035mmの接着剤付き銅箔で形成される長尺
の金属箔を図1のように連続してラミネートロール間に
通し、3枚の含浸済みの基材およびその上下に金属箔を
重ね、これを無圧のまま180℃の温度のトンネル型加
熱炉に15分を要して通して加熱硬化させた。そしてこ
の加熱硬化板を100cm毎にカッターで切断して厚み
が約0.6mmの両面銅張りポリベンツイミダゾール樹
脂積層板を得た。EXAMPLES The present invention will now be illustrated by examples. Example 1 While continuously feeding a base material made of a long glass cloth with a width of 105 cm and a thickness of 0.15 mm as shown in FIG.
It was impregnated with a 5% strength by weight solution of polybenzimidazole resin in dimethylacetamide. Three sheets of this impregnated base material are successively fed and passed between laminating rolls, and a long metal foil made of adhesive-coated copper foil with a thickness of 0.035 mm is successively passed through the laminating rolls as shown in Figure 1. Three impregnated base materials and metal foils were placed on top and bottom of the three impregnated base materials, and these were passed through a tunnel-type heating furnace at a temperature of 180° C. for 15 minutes without pressure to heat and harden them. This heat-cured plate was cut with a cutter every 100 cm to obtain a double-sided copper-clad polybenzimidazole resin laminate with a thickness of about 0.6 mm.
【0010】比較例1
縦105cm、横105cm、厚み0.15mmのガラ
ス布で形成される基材に45重量%濃度のエポキシ樹脂
のメチルオキシトール溶液を含浸させると共に乾燥させ
てプリプレグを作成した。このプリプレグを所要枚数重
ねると共にさらにその上下に縦105cm、横105c
m、厚み0.035mmの銅箔で形成される金属箔を重
ね、この重ねたものを厚み1mmのステンレスプレート
間に挟んで段内に15組を挿入し、30段プレスで、成
形圧力35kg/cm2 、温度170℃、時間120
分の条件で加熱加圧成形し、厚みが約0.6mmの両面
銅張りエポキシ樹脂積層板を得た。Comparative Example 1 A prepreg was prepared by impregnating a base material made of glass cloth with a length of 105 cm, width of 105 cm, and thickness of 0.15 mm with a 45% by weight solution of epoxy resin in methyloxytol and drying. Layer the required number of prepreg sheets and add 105cm in length and 105cm in width above and below.
m, metal foils made of copper foil with a thickness of 0.035 mm were stacked, and this stack was sandwiched between stainless steel plates with a thickness of 1 mm, 15 sets were inserted into the stages, and a molding pressure of 35 kg / cm2, temperature 170℃, time 120
A double-sided copper-clad epoxy resin laminate with a thickness of approximately 0.6 mm was obtained by heating and press-molding under conditions of 10 minutes.
【0011】実施例1及び比較例1で得た各積層板につ
いて、ドリル加工をおこなってスミアーの発生の有無を
検査したところ、比較例1の積層板ではスミアーが発生
したが、実施例1の積層板ではスミアーは発生しなかっ
た。また実施例1及び比較例1で得た各20枚の積層板
について、その厚みを測定したところ、比較例1の積層
板では0.55mm〜0.65mmの幅でばらついたが
、実施例1の積層板では0.59mm〜0.61mmの
幅であり、厚みのバラツキが小さくなった。When each of the laminates obtained in Example 1 and Comparative Example 1 was drilled and inspected for the occurrence of smear, it was found that smear occurred in the laminate of Comparative Example 1, but in the case of Example 1. No smear occurred on the laminate. Furthermore, when the thickness of each of the 20 laminates obtained in Example 1 and Comparative Example 1 was measured, the thickness of the laminate of Comparative Example 1 varied within a range of 0.55 mm to 0.65 mm; The width of the laminate was 0.59 mm to 0.61 mm, and the variation in thickness was small.
【0012】0012
【発明の効果】上記のように本発明は、長尺の基材にポ
リベンツイミダゾール樹脂を含浸させ、この含浸済みの
基材を連続して送りつつ複数枚重ねると共にさらに長尺
の金属箔を重ね、これをさらに連続して送りつつ無圧下
で加熱してポリベンツイミダゾール樹脂を硬化させると
ともに上記各基材と金属箔を積層一体化し、しかる後に
所要寸法に切断するようにしたので、ポリベンツイミダ
ゾール樹脂は熱変形温度が高く、積層板をドリル加工す
る際の剪断発熱で溶けてスミアー不良が発生することを
低減することができるものであり、また積層板は連続工
法で生産性良く製造することができると共に、積層板は
一枚ずつ積層成形がされることになるために各積層板間
の板厚のバラツキを低減して板厚精度を高めることがで
きるものである。Effects of the Invention As described above, the present invention impregnates a long base material with polybenzimidazole resin, continuously feeds the impregnated base material, stacks a plurality of sheets, and further coats a long metal foil. The polybenzimidazole resin was cured by being heated under no pressure while being continuously fed, and the above-mentioned base materials and metal foil were laminated and integrated, and then cut to the required dimensions, so the polybenzimidazole resin Imidazole resin has a high heat distortion temperature and can reduce the occurrence of smear defects caused by melting due to shear heat generated when drilling laminates, and laminates can be manufactured with high productivity using a continuous method. In addition, since the laminated plates are laminated and molded one by one, it is possible to reduce variations in plate thickness between each laminated plate and improve plate thickness accuracy.
【図1】本発明の製造工程の一例を示す概略図である。FIG. 1 is a schematic diagram showing an example of the manufacturing process of the present invention.
1 基材 2 ポリベンツイミダゾール樹脂 3 金属箔 1 Base material 2 Polybenzimidazole resin 3 Metal foil
Claims (1)
樹脂を含浸させ、この含浸済みの基材を連続して送りつ
つ複数枚重ねると共にさらに長尺の金属箔を重ね、これ
をさらに連続して送りつつ無圧下で加熱してポリベンツ
イミダゾール樹脂を硬化させるとともに上記各基材と金
属箔を積層一体化し、しかる後に所要寸法に切断するこ
とを特徴とする積層板の製造方法。[Claim 1] A long base material is impregnated with polybenzimidazole resin, and the impregnated base material is continuously fed and stacked, and then a long metal foil is further layered, and this is further continuously fed. A method for manufacturing a laminate, which comprises curing the polybenzimidazole resin by heating under no pressure while feeding it, laminating the above-mentioned base materials and metal foil together, and then cutting the resin into a required size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3093812A JPH04323032A (en) | 1991-04-24 | 1991-04-24 | Manufacture of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3093812A JPH04323032A (en) | 1991-04-24 | 1991-04-24 | Manufacture of laminated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04323032A true JPH04323032A (en) | 1992-11-12 |
Family
ID=14092816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3093812A Withdrawn JPH04323032A (en) | 1991-04-24 | 1991-04-24 | Manufacture of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04323032A (en) |
-
1991
- 1991-04-24 JP JP3093812A patent/JPH04323032A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19980711 |