JPH04324665A - Lead of soldering-strength-increased structure - Google Patents
Lead of soldering-strength-increased structureInfo
- Publication number
- JPH04324665A JPH04324665A JP3094556A JP9455691A JPH04324665A JP H04324665 A JPH04324665 A JP H04324665A JP 3094556 A JP3094556 A JP 3094556A JP 9455691 A JP9455691 A JP 9455691A JP H04324665 A JPH04324665 A JP H04324665A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- soldering
- flat
- strength
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、ハンダ付けに関し、特
にフラットＩＣのハンダ付けに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to soldering, and more particularly to soldering flat ICs.
【０００２】0002
【従来の技術】従来のフラットＩＣのハンダ付けに関し
て図面を参照して説明する。2. Description of the Related Art Conventional soldering of flat ICs will be explained with reference to the drawings.
【０００３】図５は従来例のフラットＩＣのリードの斜
視図、図６は図５のフラットＩＣのリードのハンダ付け
後のＣ−Ｃ断面図である。FIG. 5 is a perspective view of a lead of a conventional flat IC, and FIG. 6 is a cross-sectional view taken along line CC of the lead of the flat IC shown in FIG. 5 after soldering.
【０００４】図５、図６において、従来例のリードを有
するフラットＩＣは、従来のリード２ｃと、本体３とか
ら構成されており、従来例のフラットＩＣのリードの構
造は、図３のような構造になっており、フラットＩＣを
実装部にハンダ付けすると、図４に示す従来のハンダフ
ィレット５のようにフィレットが従来のリード２ｃの４
方向面にしか出来ない。In FIGS. 5 and 6, a conventional flat IC with leads is composed of a conventional lead 2c and a main body 3, and the lead structure of the conventional flat IC is as shown in FIG. When the flat IC is soldered to the mounting part, the fillet will fit into the conventional solder fillet 5 of the conventional lead 2c, as shown in FIG.
It can only be done in the direction.
【０００５】[0005]
【発明が解決しようとする課題】上述したように従来の
フラットＩＣのハンダ付けは、リードの４方向面にしか
フィレットが出来ず、ハンダ付け強度が少ないという欠
点がある。As described above, the conventional soldering of flat ICs has the disadvantage that fillets are formed only on the four directions of the leads, and the soldering strength is low.
【０００６】本発明の目的は、フラットＩＣのリード中
央部にピホールを有することにより、上記の欠点を解消
し、ハンダ付け強度を強めるためのフィルットの部分を
増したハンダ付け強度アップ構造のリードを提供するこ
とにある。An object of the present invention is to eliminate the above-mentioned drawbacks by having a pihole in the center of the lead of a flat IC, and to provide a lead having a structure that increases the soldering strength by increasing the fill portion to strengthen the soldering strength. It is about providing.
【０００７】[0007]
【課題を解決するための手段】第一の発明のハンダ付け
強度アップ構造のリードは、フラットＩＣを実装部の実
装面にハンダ付けして取り付けるフラットＩＣのリード
において、リードの中央部に実装部の実装面方向に貫通
した穴を有している。[Means for Solving the Problems] A lead having a structure for increasing soldering strength according to the first invention is a flat IC lead in which a flat IC is attached by soldering to the mounting surface of a mounting part, and the mounting part is located in the center of the lead. It has a hole that penetrates in the direction of the mounting surface.
【０００８】第二の発明のハンダ付け強度アップ構造の
リードは、上記第一の発明のハンダ付け強度アップ構造
のリードにおいて、リードの中央部の貫通した穴の代り
に、リードの側面に実装部の実装面方向に貫通した凸凹
部を有している。[0008] The lead having a structure for increasing soldering strength according to the second invention has a mounting portion on the side surface of the lead instead of the through hole in the center of the lead in the lead having a structure for increasing soldering strength according to the first invention. It has an uneven portion penetrating in the direction of the mounting surface.
【０００９】[0009]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments Next, embodiments of the present invention will be described with reference to the drawings.
【００１０】図１は第一の発明の一実施例のハンダ付け
強度アップ構造のリードの斜視図、図２は図１のハンダ
付け強度アップ構造のリードのハンダ付け後のＡ−Ａ断
面図である。FIG. 1 is a perspective view of a lead having a structure for increasing soldering strength according to an embodiment of the first invention, and FIG. 2 is a sectional view taken along line A-A after soldering of the lead having a structure for increasing soldering strength shown in FIG. be.
【００１１】図１、図２において、本第一の発明の実施
例のリードを有するフラットＩＣは、ピンホール１ａと
、リードａ２ａと、本体３とから構成されており、フラ
ットＩＣのハンダ付け強度アップ構造にしたリードの構
造は、図１に示すようにリードａ２ａの中央にフラット
ＩＣの実装部の実装面方向に貫通した穴であるピンホー
ル１ａが明いている。そして、このリードａ２ａを実装
部にハンダ付けをすると、図２のように従来のハンダフ
ィレット５にハンダフィレット４が追加され、フィレッ
トの部分が増加する。1 and 2, the flat IC with leads according to the embodiment of the first invention is composed of a pinhole 1a, a lead a2a, and a main body 3, and the soldering strength of the flat IC is As shown in FIG. 1, the lead structure has a pinhole 1a, which is a hole penetrating in the direction of the mounting surface of the flat IC mounting section, in the center of the lead a2a. Then, when this lead a2a is soldered to the mounting portion, a solder fillet 4 is added to the conventional solder fillet 5 as shown in FIG. 2, and the fillet portion increases.
【００１２】図３は第二の発明の一実施例のハンダ付け
強度アップ構造のリードの斜視図、図４は図３のハンダ
付け強度アップ構造のリードのハンダ付け後のＢ−Ｂ断
面図である。FIG. 3 is a perspective view of a lead having a structure for increasing soldering strength according to an embodiment of the second invention, and FIG. 4 is a sectional view taken along line B-B after soldering of the lead having a structure for increasing soldering strength shown in FIG. be.
【００１３】図３、図４において、本第二の発明の実施
例のリードを有するフラットＩＣは、切欠き部１ｂと、
リードｂ２ｂと、本体３とから構成されており、フラッ
トＩＣのハンダ付け強度アップ構造にしたリードの構造
は、図３に示すようにリードｂ２ｂのサイドにフラット
ＩＣの実装部の実装面方向に切り欠かれた切欠き部１ｂ
がある。そして、このリードｂ２ｂを実装部にハンダ付
けをすると、上記の図２と同様、図４のように従来のハ
ンダフィレット５にハンダフィレット４が追加され、フ
ィレットの部分が増加する。In FIGS. 3 and 4, the flat IC with leads according to the embodiment of the second invention has a notch 1b,
The lead structure is made up of a lead b2b and a main body 3, and has a structure that increases the soldering strength of the flat IC.As shown in FIG. Missing notch 1b
There is. Then, when this lead b2b is soldered to the mounting portion, a solder fillet 4 is added to the conventional solder fillet 5 as shown in FIG. 4, similar to FIG. 2 above, and the fillet portion increases.
【００１４】[0014]
【発明の効果】以上説明したように、本発明のハンダ付
け強度アップ構造のリードは、フラットＩＣのリード中
央部にピホールを有することにより、ハンダ付け強度を
強めるためのフィレットの部分を増やすことができると
いう効果がある。[Effects of the Invention] As explained above, the lead having a structure for increasing soldering strength of the present invention has a pihole in the central part of the lead of a flat IC, so that it is possible to increase the fillet portion to strengthen the soldering strength. There is an effect that it can be done.
【図１】第一の発明の一実施例のハンダ付け強度アップ
構造のリードの斜視図である。FIG. 1 is a perspective view of a lead having a structure for increasing soldering strength according to an embodiment of the first invention.
【図２】図１のハンダ付け強度アップ構造のリードのハ
ンダ付け後のＡ−Ａ断面図である。FIG. 2 is a cross-sectional view taken along the line AA after soldering of the lead of the soldering strength-enhancing structure shown in FIG. 1;
【図３】第二の発明の一実施例のハンダ付け強度アップ
構造のリードの斜視図である。FIG. 3 is a perspective view of a lead having a structure for increasing soldering strength according to an embodiment of the second invention.
【図４】図３のハンダ付け強度アップ構造のリードのハ
ンダ付け後のＢ−Ｂ断面図である。FIG. 4 is a cross-sectional view taken along line BB after soldering of the lead of the soldering strength-enhancing structure shown in FIG. 3;
【図５】従来例のフラットＩＣのリードの斜視図である
。FIG. 5 is a perspective view of a lead of a conventional flat IC.
【図６】図５のフラットＩＣのリードのハンダ付け後の
Ｃ−Ｃ断面図である。6 is a sectional view taken along line CC of the flat IC shown in FIG. 5 after the leads are soldered; FIG.
【符号の説明】 １ａ ピンホール １ｂ 切欠き部 ２ａ リードａ ２ｂ リードｂ ２ｃ 従来のリード ３ 本体 ４ ハンダフィレット ５ 従来のハンダフィレット[Explanation of symbols] 1a Pinhole 1b Notch part 2a Lead a 2b Lead b 2c Traditional lead 3 Main body 4 Solder fillet 5. Conventional solder fillet
Claims (2)
ダ付けして取り付けるフラットＩＣのリードにおいて、
前記リードの中央部に前記実装部の実装面方向に貫通し
た穴を有することを特徴とするハンダ付け強度アップ構
造のリード。[Claim 1] A lead for a flat IC that is attached by soldering the flat IC to the mounting surface of the mounting section,
A lead having a structure for increasing soldering strength, characterized in that the lead has a hole penetrating in the direction of the mounting surface of the mounting part in the center part of the lead.
構造のリードにおいて、前記リードの中央部の貫通した
穴の代りに、前記リードの側面に前記実装部の実装面方
向に貫通した凸凹部を有することを特徴とするハンダ付
け強度アップ構造のリード。2. A lead having a structure for increasing soldering strength according to claim 1, wherein instead of a penetrating hole in the center of the lead, a concave-convex portion is provided on a side surface of the lead that penetrates in a direction toward the mounting surface of the mounting portion. A lead with a structure that increases soldering strength.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3094556A JPH04324665A (en) | 1991-04-25 | 1991-04-25 | Lead of soldering-strength-increased structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3094556A JPH04324665A (en) | 1991-04-25 | 1991-04-25 | Lead of soldering-strength-increased structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04324665A true JPH04324665A (en) | 1992-11-13 |
Family
ID=14113596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3094556A Pending JPH04324665A (en) | 1991-04-25 | 1991-04-25 | Lead of soldering-strength-increased structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04324665A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010068577A3 (en) * | 2008-12-12 | 2010-08-19 | Intel Corporation | Anchor pin lead frame |
| EP4641632A1 (en) * | 2024-04-24 | 2025-10-29 | Nexperia B.V. | A semiconductor package and a method of manufacturing the semiconductor package |
-
1991
- 1991-04-25 JP JP3094556A patent/JPH04324665A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010068577A3 (en) * | 2008-12-12 | 2010-08-19 | Intel Corporation | Anchor pin lead frame |
| GB2478071A (en) * | 2008-12-12 | 2011-08-24 | Intel Corp | Anchor pin lead frame |
| CN102171822A (en) * | 2008-12-12 | 2011-08-31 | 英特尔公司 | Anchor pin lead frame |
| EP4641632A1 (en) * | 2024-04-24 | 2025-10-29 | Nexperia B.V. | A semiconductor package and a method of manufacturing the semiconductor package |
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