JPH04324943A - Bonding device - Google Patents

Abstract

PURPOSE:To make a pressing tool swing with a fixed torque to perform a wire bonding or the like. CONSTITUTION:In a bonding device consisting of a swinging arm 3, which is made to swing in the vertical directions with an axis part 4 as the center, a pressing tool 2 held by this arm 3 and a swinging means which makes this arm 2 swing, this swinging means is constituted of a magnet 11 installed on a swinging member 5, which is made to swing integrally with this arm 3, and coils 13 provided on the side parts of this magnet 11. When the coils 13 is electrified, the arm 3 is made to swing by a fixed torque and a wire bonding or the like is performed by the tool 2.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for wire bonding, and more particularly to means for vertically swinging a swinging arm holding a pressing tool.

0002

2. Description of the Related Art A wire bonding device described in Japanese Patent Application Laid-open No. 138930/1983 is known. This device includes a swinging arm that is swingable in the vertical direction, a bonding tool held at the tip of the swinging arm, and a linear motor disposed at the rear of the swinging arm. In this device, a swing arm is oscillated in the vertical direction by energizing the coil of a linear motor, and a ball formed at the lower end of the wire is bonded to the pellet.

0003

[Problems to be Solved by the Invention] However, in the above conventional means, the relative position of the leg of the swinging arm facing the linear motor with respect to the linear motor changes as the swinging arm rotates. The electromagnetic force of the swing arm also changes, causing the rotational torque of the swing arm to fluctuate, resulting in a problem in which wire bonding cannot be performed properly.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a bonding apparatus that can solve the problems of the conventional means described above.

[0005]

[Means for Solving the Problems] The present invention provides a swinging arm that swings vertically around a shaft, a pressing tool held by the swinging arm, and a swinging tool that swings the swinging arm. a swinging member that swings integrally with the swinging arm; a magnet attached to the swinging member; and a coil disposed on the side of the magnet. It is composed of.

[0006]

[Operation] In the above structure, when the coil is energized, the swinging arm swings due to the electromagnetic force generated between the coil and the magnet, and the pressing tool performs wire bonding, etc. In this case, the electromagnetic force between the coil and the magnet does not change, so the rotational torque of the swing arm due to this electromagnetic force does not change, and bonding is performed satisfactorily with constant torque.

[0007]

【Example】

(Embodiment 1) Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a side view of the bonding apparatus, and FIG. 2 is an exploded view. This bonding apparatus includes a bonding section 1 mounted on an XY table 20.

The bonding section 1 includes a swinging arm 3 that holds a pressing tool 2, a shaft section 4 that pivotally supports this swinging arm 3, and a fan-shaped swinging member 5 that extends rearward from this shaft section 4.
and plates 6 provided on both sides of the swinging member 5 so as to sandwich the swinging member 5 therebetween. 7 is a pin that pivotally supports the shaft portion 4.

[0010] The pressing tool 2 has a cylindrical shape, and a wire 8 is inserted therethrough. A ball 9 is formed at the lower end of the wire 8, and this ball 9 is pressed against the substrate 10 for wire bonding. Further, a vibrator 15 for causing US vibration of the swing arm 3 and a vibration mode detector 16 are attached to the base end of the swing arm 3.

FIG. 3 is an exploded view of the swinging means, in which a magnet 11 and a linear scale 12 are attached to the side surface of the swinging member 5. Further, a coil 13 is attached to the inner surface of the plate 6. When the coil 13 is energized, the electromagnetic force causes the swing member 5 to swing vertically about the shaft portion 4 integrally with the swing arm 3 . 1
A sensor 4 is provided to sandwich the linear scale 12, and the sensor 14 and the linear scale 12 serve as detection means for detecting the amount of rotation of the swing arm 3.

Next, the detailed structure of the XY table 20 will be explained. In FIGS. 1 and 2, 21 is a base plate, and the bonding portion 1 is attached to this base plate 21. 22
is an X guide, a slider 23 is attached to this X guide 22, and the base plate 21 is fixed to this slider 23 with screws 24.

Reference numeral 25 denotes a coil portion fixed to the X guide 22 side, and this coil portion 25 holds a long plate-shaped magnet plate 26. This magnet plate 26 is fixed to the base plate 21. Therefore, when the coil portion 25 is energized, the base plate 21 slides in the X direction. 27 and 28 are linear scales and sensors for detecting the amount of movement of the base plate 21 in the X direction.

Reference numeral 29 denotes a slider on which the X guide 22 is placed, and is slidably mounted on the Y guide 30. 31 is a coil part in the Y direction, 32 is a magnet plate, 33
, 34 are linear scales and sensors, and 35 is a base. Therefore, when the coil portion 31 is energized, the base plate 21 slides in the Y direction.

Conventionally, an XY table for moving the bonding section 1 in the XY directions has been constructed of a ball screw or a nut. However, this bonding part 1
Since ball screws and nuts repeatedly slide back and forth at high speeds with short strokes many times, they tend to wear out in specific areas, which causes the problem that the accuracy of stopping positions gradually decreases. On the other hand, if the drive means for the XY table 20 is configured with a linear motor as described above,
This problem of the conventional means can be solved.

The present apparatus has the above-mentioned configuration, and its operation will be explained next. The XY table 20 is driven to position the pressing tool 2 at a predetermined position on the substrate 10. Next, when the coil 13 is energized, the swinging arm 3 swings and presses the ball 9 against the substrate 10 for bonding.

In this case, in order to bond the ball 9 well, the vibrator 15 is driven and the swinging arm 3 is vibrating in the US direction, but when the ball 9 lands on the substrate 10, the vibration mode changes. Since the detector 16 detects this, it becomes clear that the ball 9 has landed on the substrate 10. FIG. 4 shows the vibration mode of the swing arm 3, and the timing to when the vibration mode changes is the time of landing.

When it is determined that the ball 9 has landed, the amount of current applied to the coil 13 is reduced to reduce the torque, and the ball 9 is slowly pressed against the substrate 10 for bonding. By reducing the torque during bonding in this manner, it is possible to avoid unnecessary damage caused by the ball 9 strongly colliding with the substrate 10.

Furthermore, by arranging the coil 13 so as to sufficiently cover the magnet 11, the electromagnetic force between the magnet 11 and the coil 13 is kept constant regardless of the rotational position of the swinging member 5, and a constant torque is maintained. Good bonding can be performed while swinging the swinging arm 3.

(Embodiment 2) FIG. 5 shows another embodiment of the present invention. In this case, the swinging member 5 is connected to the link means 36.
When the coil 13 is energized, the swing arm 3 swings in the vertical direction, bonding the ball 9 to the substrate, as in the first embodiment.

Although the above embodiment has been explained by taking wire bonding as an example, the present invention can also be applied to inner lead bonding, outer lead bonding, or stud bump bonding in which leads are bonded to a semiconductor or a substrate.

[0022]

[Effects of the Invention] As explained above, the present invention provides a swinging arm that swings vertically around a shaft, a pressing tool held by this swinging arm, and a swinging arm that swings this swinging arm. In a bonding device comprising a swinging means, the swinging means is arranged on a swinging member that swings integrally with the swinging arm, a magnet attached to the swinging member, and a side of the magnet. Since the oscillating arm is constructed of a fixed coil, bonding can be performed satisfactorily while the oscillating arm is oscillated with a constant torque.

[Brief explanation of the drawing]

FIG. 1 is a side view of a bonding device according to the present invention.

[Figure 2
] Exploded view of the bonding device according to the present invention

[Fig. 3] Exploded view of the rocking means according to the present invention

[Figure 4] Vibration mode diagram according to the present invention

FIG. 5 is a perspective view of a bonding part of another embodiment according to the present invention.

[Explanation of symbols]

2 Press tool 3 Swing arm 4 Shaft part 5 Swinging member 11 Magnet 13 Coil

Claims (1)

[Claims] Claim 1: A swinging arm that swings vertically about a shaft, a pressing tool held by the swinging arm, and swinging means for swinging the swinging arm. a swinging member whose swinging means swings integrally with the swinging arm;
A bonding device comprising a magnet attached to the swinging member and a coil disposed on the side of the magnet.