JPH04324976A - Image sensor mounting structure and method - Google Patents
Image sensor mounting structure and methodInfo
- Publication number
- JPH04324976A JPH04324976A JP3095761A JP9576191A JPH04324976A JP H04324976 A JPH04324976 A JP H04324976A JP 3095761 A JP3095761 A JP 3095761A JP 9576191 A JP9576191 A JP 9576191A JP H04324976 A JPH04324976 A JP H04324976A
- Authority
- JP
- Japan
- Prior art keywords
- image sensor
- chip
- organic material
- sensor chip
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000011368 organic material Substances 0.000 claims abstract description 28
- 239000004020 conductor Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 21
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000012780 transparent material Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、イメージセンサの実装
構造及び実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image sensor mounting structure and mounting method.
【０００２】なお、本明細書の効果が、最も顕著に認め
られるボトムタイプのセンサを例に挙げて説明する。[0002] The effects of this specification will be explained by taking as an example a bottom type sensor, where the effects are most noticeable.
【０００３】0003
【従来の技術】センサには、光電変換素子（以下、受光
素子と記す）への光の入り方によって、２種類の方式が
考えられる。すなわち、図７に示したように直接受光素
子（２）に光が入る方式（トップタイプ）及び、図８の
ように光がチップ（２）基板材質を通過して受光素子（
１）に入る方式（以下、ボトムタイプと記す）である。2. Description of the Related Art Two types of sensors can be considered depending on how light enters a photoelectric conversion element (hereinafter referred to as a light receiving element). In other words, as shown in FIG. 7, there is a method (top type) where light enters the light receiving element (2) directly, and as shown in FIG. 8, the light passes through the substrate material of the chip (2) and enters the light receiving element (2).
1) (hereinafter referred to as the bottom type).
【０００４】従来のボトムタイプの実装構造は、図４及
び図５に示したように、表面に受光素子（１）が形成さ
れたイメージセンサチップ（２）と、有機材料（７）の
流れ止め及び、必要に応じては透明支持体（３）上の導
体パターンと外部回路の接続手段の位置決め機構を持つ
ダム材（９）とが、該センサからの入出力のための導体
パターン（５’）の形成された透明支持体（３）上に固
定され、該ダム材で囲まれた該イメージセンサ及び該導
体パターンの電気的接続部が有機材料で覆われ、更に異
方性導電ゴムのような、導体パターンと外部回路の接続
体が形成されているものであった。As shown in FIGS. 4 and 5, the conventional bottom-type mounting structure includes an image sensor chip (2) on which a light receiving element (1) is formed, and an organic material (7) that prevents the flow of the organic material (7). And if necessary, a dam member (9) having a positioning mechanism for connecting the conductor pattern on the transparent support (3) and an external circuit is connected to the conductor pattern (5') for inputting and outputting from the sensor. ), the image sensor surrounded by the dam material and the electrical connection portion of the conductor pattern are covered with an organic material, and are further covered with an organic material such as anisotropic conductive rubber. In addition, a connection body between the conductor pattern and an external circuit was formed.
【０００５】また、上記の実装工程は、図６に示したよ
うに、
■表面の導体パターン（５’）の形成された透明支持体
（３）に一種または複数の有機材料（８）塗布し、そこ
へ表面に受光素子（１）が形成されたイメージセンサチ
ップ（２）を貼付ける工程（ａ）
■金属の細線（４）によって該イメージセンサチップと
該導体パターンの電気的接続をとる工程（ｂ）■■の工
程で被覆する有機材料（７）の流れ止め及び、必要に応
じては透明支持体上の導体パターンと外部回路の接続手
段の位置決め機構を持つダム材（９）を該透明支持体に
貼り付ける工程（ｃ）
■少なくとも該イメージセンサ及び該導体パターンの電
気的接続部が有機材料で被覆する工程（ｄ）を含んだも
のであった。[0005] In addition, the above mounting process, as shown in FIG. , a step of pasting thereon an image sensor chip (2) with a light receiving element (1) formed on its surface (a) ■ a step of making an electrical connection between the image sensor chip and the conductive pattern using a thin metal wire (4) (b) A dam material (9) that prevents the flow of the organic material (7) to be coated in the process of ■■ and, if necessary, has a positioning mechanism for the conductor pattern on the transparent support and the connection means for the external circuit. Step (c) of attaching it to a transparent support (2) At least the step (d) of covering the electrical connection portions of the image sensor and the conductor pattern with an organic material was included.
【０００６】[0006]
【発明が解決しようとする課題】しかし、従来技術にお
いては、以下に記すような問題点が認められる。
Ｉ．イメージセンサから外部回路への接続をとるために
透明支持体表面に導体パターンを形成する必要が生じる
。[Problems to be Solved by the Invention] However, the following problems are recognized in the prior art. I. In order to connect the image sensor to an external circuit, it is necessary to form a conductive pattern on the surface of the transparent support.
【０００７】・このことで透明支持体の加工コストがア
ップする。- This increases the processing cost of the transparent support.
【０００８】・導体パターンとして金ペーストが有力だ
がボンディング用には高温焼成が必要で、このために透
明支持体の材質が耐熱性の高いガラスに限定されてしま
う。
ＩＩ．ダム材についての材料制約が生じる。具体的には
、透明支持体材料との貼合わせの上で、両者の熱膨張係
数差により生じる応力緩和が必要になる。その結果、多
くの場合ダム材としてゴム弾性を有するものを選択せざ
るを得ない。Gold paste is effective as a conductor pattern, but high temperature firing is required for bonding, which limits the material of the transparent support to glass, which has high heat resistance. II. Material constraints arise regarding dam materials. Specifically, upon lamination with a transparent support material, it is necessary to relieve stress caused by the difference in thermal expansion coefficient between the two. As a result, in many cases, a material having rubber elasticity must be selected as the dam material.
【０００９】・このことは、作業上ダム材の取り扱いを
困難にし、また、自動化がしにくいというように、実装
時の負荷を増やすことになる。[0009] This makes it difficult to handle the dam material during work, and also increases the load during mounting, making it difficult to automate.
【００１０】本発明は、この様な問題点を解決するもの
で、その目的とするところは、■チップと外部回路との
接続のための導体パターンを有する剛体基板を用いるこ
とで、透明支持体の材質選択の自由度を広げ、低コスト
化を図る■取り扱いが困難なダム材の使用をやめ、工程
の自動化・合理化を実現させる■使用部品点数の削減に
より、構造がシンプルで、実装工程の短いものにさせる
と、いうような特徴をもつイメージセンサを提供するこ
とにある。[0010] The present invention is intended to solve these problems, and its purpose is to: (1) use a rigid substrate having a conductor pattern for connection between the chip and an external circuit; - Increase flexibility in material selection and reduce costs ■ Eliminate the use of dam materials that are difficult to handle and realize process automation and rationalization ■ Reduce the number of parts used to simplify the structure and reduce the mounting process. The short answer is to provide an image sensor with the following characteristics.
【００１１】[0011]
【課題を解決するための手段】本発明のイメージセンサ
の実装構造は、表面に光電変換素子が形成されたイメー
ジセンサチップと、表面に該センサからの入出力のため
の導体パターンの形成された剛体基板が、透明支持体上
に固定され、少なくとも該イメージセンサ及び該導体パ
ターンの電気的接続部が有機材料で覆われていることを
特徴とし、かつ、前記イメージセンサチップの基板が透
明材料であることを特徴とし、さらに、前記有機材料の
屈折率が前記イメージセンサチップの基板の屈折率と等
しいか大きいことを特徴とする。[Means for Solving the Problems] The image sensor mounting structure of the present invention includes an image sensor chip having a photoelectric conversion element formed on its surface, and a conductive pattern formed on the surface for inputting and outputting from the sensor. A rigid substrate is fixed on a transparent support, and at least the electrical connection portions of the image sensor and the conductive pattern are covered with an organic material, and the substrate of the image sensor chip is made of a transparent material. The method is characterized in that the refractive index of the organic material is equal to or larger than the refractive index of the substrate of the image sensor chip.
【００１２】また本発明のイメージセンサの実装方法は
、イメージセンサの実装工程において、少なくとも、■
表面に光電変換素子が形成されたイメージセンサチップ
と、表面に該センサからの入出力のための導体パターン
の形成された剛体基板を、一種または複数の有機材料に
よって透明支持体上に固定する工程
■該イメージセンサチップと該導体パターンの電気的接
続をとる工程
■少なくとも該イメージセンサ及び該導体パターンの電
気的接続部が有機材料で被覆する工程
を含んでいることを特徴とし、かつ、前記イメージセン
サチップの基板及びイメージセンサチップの固定用の前
記有機材料が透明材料であることを特徴とし、さらに、
前記有機材料の屈折率が前記イメージセンサチップの基
板の屈折率と等しいか大きいことを特徴とする。[0012] Furthermore, the image sensor mounting method of the present invention includes at least (i)
A step of fixing an image sensor chip with a photoelectric conversion element formed on its surface and a rigid substrate formed with a conductive pattern on its surface for inputting and outputting from the sensor onto a transparent support using one or more organic materials. (2) A step of establishing an electrical connection between the image sensor chip and the conductor pattern; (2) A step of coating at least the electrical connection portion of the image sensor and the conductor pattern with an organic material; The sensor chip substrate and the organic material for fixing the image sensor chip are transparent materials, and further,
The refractive index of the organic material is equal to or greater than the refractive index of the substrate of the image sensor chip.
【００１３】[0013]
【実施例】以下、実施例に従って、本発明を更に詳しく
説明する。
〈１〉本発明をボトム方式の密着型イメージセンサに適
用した。EXAMPLES The present invention will be explained in more detail below with reference to Examples. <1> The present invention was applied to a bottom type contact image sensor.
【００１４】実装構造は図１及び図２に示したように、
受光素子（１）を表面に形成した石英製のセンサチップ
（２）と、表面に金めっきを施した導体パターン（５）
を有するガラエポ基板（６）が、バリウムホウケイ酸系
のガラス（例えば、コーニング社製７０５９）の透明支
持体（３）に固定され、該チップと該導体パターンを直
径３５μｍのアルミニウム細線（４）で接続し電気的な
導通をとり、更に、チップ及び電気的接続部の保護用の
有機材料（７）として、付加重合型のシリコーンを用い
たものである。The mounting structure is as shown in FIGS. 1 and 2.
A quartz sensor chip (2) with a light receiving element (1) formed on its surface, and a conductor pattern (5) whose surface is gold plated.
A glass epoxy substrate (6) having the following characteristics is fixed to a transparent support (3) made of barium borosilicate glass (for example, Corning 7059), and the chip and the conductor pattern are connected to each other by thin aluminum wires (4) with a diameter of 35 μm. Addition-polymerized silicone is used as an organic material (7) for connection and electrical conduction, and for protecting the chip and electrical connections.
【００１５】また、製造工程については、図３に示した
ように、受光素子（１）を表面に形成した石英製のセン
サチップ（２）と、表面に金めっきを施した導体パター
ン（５）を有するガラエポ基板（６）を、前者固定用の
有機材料（８）として紫外線硬化型のウレタン変性アク
リレート、後者固定用の有機材料（８’）として室温硬
化型のエポキシ樹脂を用い、ポリカーボネート製の透明
支持体（３）に固定した。（ａ）この後、該チップと該
導体パターンを直径３５μｍのアルミニウム細線（４）
を用いてウエッシボンディングで接続し、電気的な導通
をとった。（ｂ）更に、チップ及び電気的接続部の保護
用の有機材料（７）として、付加重合型のシリコーンを
用いチップ及びボンディング部に塗布し熱硬化させた。
（ｃ）という手順を経ている。Regarding the manufacturing process, as shown in FIG. 3, a sensor chip (2) made of quartz with a light receiving element (1) formed on its surface, and a conductive pattern (5) whose surface is plated with gold. A glass epoxy substrate (6) having a polycarbonate substrate (6) was used, an ultraviolet curable urethane-modified acrylate was used as the organic material (8) for fixing the former, a room temperature curable epoxy resin was used as the organic material (8') for fixing the latter, and polycarbonate was used. It was fixed on a transparent support (3). (a) After this, the chip and the conductor pattern are connected using a thin aluminum wire (4) with a diameter of 35 μm.
They were connected using wedge bonding to establish electrical continuity. (b) Further, as an organic material (7) for protecting the chip and the electrical connection parts, addition polymerization type silicone was applied to the chip and the bonding parts and cured by heat. The procedure (c) has been followed.
【００１６】本実施例によって、
■工程の工数 ：従来の２／３
■部品点数 ：従来の４／５
■透明支持体 ：従来の１／４のコストといった効果
が現われ、その結果、更に全工程の自動化が可能になり
、かつ、接続信頼性の高いイメージセンサが得られた。[0016] According to this embodiment, the following effects were achieved: (1) Process man-hours: 2/3 of the conventional cost; (2) Number of parts: 4/5 of the conventional cost; (2) Transparent support: 1/4 of the conventional cost; An image sensor with high connection reliability was obtained.
【００１７】なお、以下の実施例でも、同様な効果が得
られる。Note that similar effects can be obtained in the following embodiments.
【００１８】〈２〉上記〈１〉において、チップ及び電
気的接続部の保護用の有機材料として、ウレタン変性ア
クリレートを用いた。<2> In <1> above, urethane-modified acrylate was used as the organic material for protecting the chip and electrical connections.
【００１９】〈３〉上記〈１〉において、センサチップ
及び剛体基板の固定用有機材料として、紫外線硬化型の
エポキシ系接着剤を用いた。<3> In <1> above, an ultraviolet curing epoxy adhesive was used as the organic material for fixing the sensor chip and the rigid substrate.
【００２０】〈４〉上記〈１〉において、剛体基板用の
材料としてアクリル板を用いた。<4> In <1> above, an acrylic plate was used as the material for the rigid substrate.
【００２１】〈５〉上記〈１〉において、２本のセンサ
チップを用いて同様なセンサブロックを作成した。<5> A sensor block similar to that in <1> above was created using two sensor chips.
【００２２】〈６〉上記〈１〉において、透明支持体の
材料としてソーダガラスを用いた。<6> In <1> above, soda glass was used as the material for the transparent support.
【００２３】[0023]
【発明の効果】以上に述べたように、本発明によれば。[Effects of the Invention] As described above, according to the present invention.
【００２４】■チップと外部回路との接続を剛体基板上
の導体パターンで行なうため、透明支持体の加工費が削
減可能となり、透明支持体の材料の選定範囲が広がって
安価な材料の採用が可能
■取り扱いが困難なダム材を使用しないため、工程の自
動化・合理化が実現
■使用部品点数の削減により、構造がシンプルで、薄く
小型になる
■実装工程が短い
と、いった効果がイメージセンサにもたらされ、薄くコ
ンパクトで、品質・特性の安定したイメージセンサを得
ることができた。■Since the chip and the external circuit are connected using a conductor pattern on a rigid substrate, the processing cost of the transparent support can be reduced, and the selection range of materials for the transparent support has been expanded, allowing the use of inexpensive materials. Possible ■ Automation and streamlining of the process is realized because dam materials that are difficult to handle are not used ■ The structure is simple, thin and compact due to the reduction in the number of parts used ■ The short mounting process makes it possible to improve the image sensor As a result, we were able to obtain an image sensor that is thin, compact, and has stable quality and characteristics.
【図１】本発明のイメージセンサの構造を示す断面図。FIG. 1 is a sectional view showing the structure of an image sensor of the present invention.
【図２】本発明のイメージセンサ全体を示す斜視図。FIG. 2 is a perspective view showing the entire image sensor of the present invention.
【図３】本発明のイメージセンサの実装方法を示す工程
断面図。FIG. 3 is a process cross-sectional view showing a method for mounting an image sensor according to the present invention.
【図４】従来のイメージセンサの構造を示す断面図。FIG. 4 is a cross-sectional view showing the structure of a conventional image sensor.
【図５】従来のイメージセンサ全体を示す斜視図。FIG. 5 is a perspective view showing the entire conventional image sensor.
【図６】従来のイメージセンサの実装方法を示す工程断
面図。FIG. 6 is a process cross-sectional view showing a conventional image sensor mounting method.
【図７】トップタイプのイメージセンサの概念を示すチ
ップ断面図。FIG. 7 is a chip cross-sectional view showing the concept of a top-type image sensor.
【図８】ボトムタイプのイメージセンサの概念を示すチ
ップ断面図。FIG. 8 is a chip cross-sectional view showing the concept of a bottom type image sensor.
１ 受光素子 ２ チップ ３ 透明支持体 ４ 金属細線 ５ 導体パターン ５’ 導体パターン ６ 剛体基板 ７ 有機材料 ８ 有機材料 ８’ 有機材料 ９ ダム材 1 Photo receiving element 2 Chip 3 Transparent support 4 Thin metal wire 5 Conductor pattern 5’ Conductor pattern 6 Rigid substrate 7. Organic materials 8. Organic materials 8’ Organic material 9 Dam material
Claims (6)
センサチップと、表面に該センサからの入出力のための
導体パターンの形成された剛体基板が、透明支持体上に
固定され、少なくとも該イメージセンサ及び該導体パタ
ーンの電気的接続部が有機材料で覆われていることを特
徴とするイメージセンサの実装構造。1. An image sensor chip having a photoelectric conversion element formed on its surface, and a rigid substrate having a conductive pattern formed on its surface for inputting and outputting from the sensor, fixed on a transparent support, A mounting structure for an image sensor, characterized in that the image sensor and the electrical connection portion of the conductive pattern are covered with an organic material.
料であることを特徴とする請求項１記載のイメージセン
サの実装構造。2. The image sensor mounting structure according to claim 1, wherein the substrate of the image sensor chip is made of a transparent material.
サチップの基板の屈折率と等しいか大きいことを特徴と
する請求項１記載のイメージセンサの実装構造。3. The image sensor mounting structure according to claim 1, wherein the refractive index of the organic material is equal to or greater than the refractive index of the substrate of the image sensor chip.
くとも、 ■表面に光電変換素子が形成されたイメージセンサチッ
プと、表面に該センサからの入出力のための導体パター
ンの形成された剛体基板を、一種または複数の有機材料
によって透明支持体上に固定する工程 ■該イメージセンサチップと該導体パターンの電気的接
続をとる工程 ■少なくとも該イメージセンサ及び該導体パターンの電
気的接続部が有機材料で被覆する工程 を含んでいることを特徴とするイメージセンサの実装方
法。4. In the image sensor mounting process, at least: (1) an image sensor chip having a photoelectric conversion element formed on its surface; and a rigid substrate having a conductive pattern formed on its surface for inputting and outputting from the sensor; A step of fixing the image sensor chip onto a transparent support using one or more organic materials ■ A step of establishing an electrical connection between the image sensor chip and the conductor pattern ■ Covering at least the electrical connection portion of the image sensor and the conductor pattern with an organic material A method for mounting an image sensor, the method comprising the step of:
ージセンサチップの固定用の前記有機材料が透明材料で
あることを特徴とする請求項４記載のイメージセンサの
実装方法。5. The image sensor mounting method according to claim 4, wherein the substrate of the image sensor chip and the organic material for fixing the image sensor chip are transparent materials.
サチップの基板の屈折率と等しいか大きいことを特徴と
する請求項４記載のイメージセンサの実装方法。6. The image sensor mounting method according to claim 4, wherein the refractive index of the organic material is equal to or greater than the refractive index of the substrate of the image sensor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3095761A JPH04324976A (en) | 1991-04-25 | 1991-04-25 | Image sensor mounting structure and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3095761A JPH04324976A (en) | 1991-04-25 | 1991-04-25 | Image sensor mounting structure and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04324976A true JPH04324976A (en) | 1992-11-13 |
Family
ID=14146474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3095761A Pending JPH04324976A (en) | 1991-04-25 | 1991-04-25 | Image sensor mounting structure and method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04324976A (en) |
-
1991
- 1991-04-25 JP JP3095761A patent/JPH04324976A/en active Pending
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