JPH04324995A - Case structure of electronic equipment - Google Patents

Abstract

PURPOSE:To obtain an electronic equipment case structure which can be sharply lessened in size and weight. CONSTITUTION:A first and a second wiring board, 14 and 15 are enveloped or insert-molded respectively in a lower case 1 and an upper case 2 which form a case when the cases 1 and 2 are injection-molded. Electronic components are mounted on one side of the first wiring board 14 where a required wiring pattern has been formed, and the side of the board 14 concerned is made to face the inside of the case and the other side is exposed out of the case. Electronic components are mounted on one side of the second wiring board 15 where a required wiring pattern has been formed, and only the side of the board 15 concerned is exposed inside the case.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a housing structure for an electronic device incorporating a control wiring board.

0002

2. Description of the Related Art FIG. 10 is a sectional view showing the casing structure of a conventional electronic device. In the figure, 1 is a lower case made of resin, 2 is an upper case made of resin combined on this lower case, 3 is a first board on which electronic components 4 are mounted, and screws 5 are attached to the inner surface of the lower case 1. is fixed. A second board 6 is provided on the board 3 and has an electronic component 4 mounted thereon, and is electrically connected to the board 3 via a connector 7 . 8 is an LED fixed to the inner surface of the upper case 2 with a fixture 9 and connected to the board 3 with a lead wire 10;
It is located in an opening 2a formed in a part of the case, and the operating state of the circuit can be confirmed from the outside. Reference numeral 11 denotes a volume for circuit adjustment, which is fixed to the inner surface of the lower case 1 with a fixture 12 and connected to the board 3 with a lead wire 12, through an opening 1a formed in a part of the case. Can be operated from outside.

[0003] As described above, the cases 1 and 2 constituting the housing are manufactured by injection molding one or more types of resin. On the other hand, various electronic components 4 are mounted on the wiring boards 3 and 6, and are fixed inside the housing with screws 5 or the like in the final assembly process.

[0004] Also, volume 1, which requires external operation,
Electrical components such as Type 1 and the LED 8 that identify functions on the circuit from the outside are fixed to the inner surface of the casing with fixtures and connected to the wiring board with lead wires.

[0005]

[Problems to be Solved by the Invention] In the conventional configuration as described above, the wiring board on which electronic components are mounted is fixed inside the housing with screws, etc., which increases the installation space and reduces the size of electronic equipment. - There was a problem that it was difficult to reduce the weight.

[0006] Furthermore, since the electrical components that can be operated or identified from the outside are fixed to the inner surface of the housing using fixtures, and the electrical components and the wiring board are connected with lead wires,
There is a problem in that the number of assembly steps increases due to the increase in the number of parts.

[0007] The present invention has been made to solve these problems, and aims to provide a housing structure for electronic equipment that can be significantly reduced in size and weight.

[0008]

[Means for Solving the Problems] The housing structure of an electronic device according to the present invention has a wiring board that is insert-molded in a case and exposed inside the case.

Furthermore, the wiring board is exposed to the inside and outside of the case.

Furthermore, the wiring board has electronic components mounted on the surface exposed to the inside of the case, and electrical components that can be operated or identified from the outside of the case mounted on the surface exposed to the outside of the case through the opening. .

[0011]

[Operation] A desired wiring pattern is formed on the inner surface of the casing constructed as described above.

[0012] Further, a desired wiring pattern exposed inside and out is formed on a part of the casing.

Further, electronic components and electrical components are mounted on a wiring pattern formed in a part of the casing, and the electrical components are operated or identified from the outside.

[0014]

【Example】

Example 1. FIG. 1 is a sectional view showing a housing structure in an embodiment of the present invention, FIGS. 2, 3 and 5 are partial sectional views thereof,
4 and 6 are partially enlarged sectional views of FIGS. 3 and 5, respectively. In the figure, 14 is a first wiring board consisting of a single layer or multiple layers integrated by insert formation during injection molding of the lower case 1, and an electronic component 4 is mounted on one side on which a desired wiring pattern is formed. One side is exposed inside the case and the other side is exposed outside the case. Figure 2
shows a state in which the wiring board 14 is integrated into the lower case 1,
FIG. 3 shows a state in which the electronic component 4 is mounted in the state shown in FIG. Note that the wiring board 14 can have an electromagnetic shielding effect by using a copper foil layer as the outermost layer exposed to the outside of the case. Reference numeral 15 denotes a second wiring board consisting of a single layer or multiple layers, which is integrated by insert molding during injection molding of the upper case 2 to be fitted onto the lower case 1, and has a desired wiring pattern as shown in FIG. Electronic components 4 are formed on one side.
is implemented, and only one side is exposed inside the case. The second wiring board 15 has an inclined portion 1 on the end surface as shown in FIG. 6 in order to increase the bonding strength with the upper case 2.
4a. 16 is a connector that electrically connects the wiring board 14 and the wiring board 15; 17 is a cover that protects one exposed surface of the wiring board 14, and is fixed to the bottom surface of the lower case 1 with adhesive. Note that this cover may be omitted depending on the use of the electronic device.

According to the casing structure configured as described above, since the wiring boards 14 and 15 are insert-molded in the case, the installation space for the wiring boards is reduced, and the size and weight can be reduced. Further, since the wiring boards 14 and 15, for which manufacturing technology has been established for a long time, are integrated with the case, a high-density wiring pattern can be easily formed in a part of the case. As a result, it becomes possible to mount electronic components in the housing at high density.

Example 2. FIG. 7 is a sectional view showing a housing structure in another embodiment of the present invention, and FIG. 8 is a partially enlarged sectional view thereof. In the figure, 18 is a third wiring board consisting of a single layer or multiple layers integrated by insert molding during injection molding of the lower case 1, and electronic components 4 are mounted on both sides on which a desired wiring pattern is formed. , one side is exposed inside the case and the other side is exposed outside the case. Reference numeral 19 denotes a fourth wiring board consisting of a single layer or multiple layers that is integrated by insert molding during injection molding of case 2 of upper case 2, and has a desired wiring pattern formed on one surface exposed inside the case. Electronic components 4 are mounted on the other surface exposed to the outside of the case through openings 2b and 2c formed in the upper case 2, and electrical components such as an LED 8 that displays the circuit operating status and a volume 11 for circuit adjustment. has been implemented. The LED 8 and volume 11 are provided corresponding to the openings 2b and 2c, respectively, and can be operated or identified from outside the case. Note that the fourth wiring board 19 has a sloped portion 19a on the end surface as shown in FIG. 8 in order to increase the bonding strength with the upper case 2.
have.

According to the casing structure configured as described above, it is possible to significantly reduce the size and weight of electrical equipment as in the first embodiment, and also to place electronic components on one side of the wiring board and electrical components on the other side. By mounting the components, there is no need for fixtures for the electrical components, lead wires for electrically connecting the wiring board and the electrical components, etc., and the number of assembly steps can be reduced.

In the first and second embodiments described above, the wiring board is located on the bottom surface of the lower case 1, but as shown in FIG.
If 0 and 21 are arranged, even higher density packaging is possible.

In each of the embodiments, electronic and electrical components may be mounted on the wiring board either before or after the wiring board is insert-molded into the case.

[0020]

As described above, according to the present invention, by insert-molding the wiring board into the case, the installation space for the wiring board is reduced, and the electronic device can be significantly reduced in size and weight.

[0021]Moreover, by mounting electronic parts and electric parts on a wiring board, there is no need for fixtures or lead wires, making it possible to miniaturize electronic equipment and significantly reduce assembly costs.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a housing structure of an electronic device according to a first embodiment of the present invention.

FIG. 2 is a partial cross-sectional view showing Embodiment 1 of the present invention.

FIG. 3 is a partial cross-sectional view showing Embodiment 1 of the present invention.

FIG. 4 is a partially enlarged sectional view showing Embodiment 1 of the present invention.

FIG. 5 is a partial cross-sectional view showing Embodiment 1 of the present invention.

FIG. 6 is a partially enlarged sectional view showing Embodiment 1 of the present invention.

FIG. 7 is a sectional view showing a housing structure of an electronic device according to a second embodiment of the present invention.

FIG. 8 is a partially enlarged sectional view showing a second embodiment of the present invention.

FIG. 9 is a partial sectional view showing a modification of the invention.

FIG. 10 is a cross-sectional view showing the casing structure of a conventional electronic device.

[Explanation of symbols]

1 Upper case 2 Lower case 2a Opening 2b Opening 4 Electronic parts 8 LED (electrical parts) 11 Volume (electrical parts) 14 First wiring board 15 Second wiring board 18 Third wiring board 19 Fourth wiring board 20 Wiring board 21　Wiring board

Claims (3)

[Claims] 1. A housing structure for an electronic device, comprising a case and a wiring board insert-molded into the case and exposed inside the case. 2. A housing structure for an electronic device according to claim 1, wherein the wiring board is exposed on the inside and outside of the case. [Claim 3] The wiring board has electronic components mounted on the surface exposed inside the case, and electrical components that can be operated or identified from outside the case mounted on the surface exposed outside the case through the opening. The housing structure for an electronic device according to claim 2, characterized in that: