JPH0432847Y2 - - Google Patents

Description

[Detailed Description of the Invention] Technical Field This invention relates to a 1-magnification optical sensor used in a reading device in a facsimile machine, a digital copying machine, etc.

PRIOR ART In recent years, in order to downsize the optical system of some facsimile machines, some use a 1x optical sensor as a reading device. Its basic structure is that a sensor photosensitive part and an electrode wiring part are formed on an insulating substrate made of quartz, glass, ceramics, etc. The conventional 1-magnification optical sensor has the following drawbacks.
First, if the substrate is made of quartz or ceramics, it will be expensive. Furthermore, in the case of glass, although it is inexpensive, it requires coating with Si ₃ N ₄ to block alkali ions Na ⁺ . On the other hand, even glass is expensive for Pyrex. Furthermore, when focusing an optical system, these substrates are fragile and cannot be brought into direct contact with the positioning surface, requiring a support, which increases costs and directly affects the machining accuracy of the support. This will affect the focus. Moreover, the thickness of this support increases the thickness of the entire sensor unit, which also hinders miniaturization. Since these substrates are insulators, in order to shield the electrode wiring from noise, it is necessary to coat the electrodes with an insulating film and then laminate the shielding conductor, making the process cumbersome. becomes. Furthermore, when mounting a sensor drive circuit on a flexible PC board and attaching it to the surface of the substrate opposite to the surface on which the sensor photosensitive area is formed, the sensor drive circuit is attached because the substrate is an insulator. In some cases, a noise shield layer for the drive circuit must be separately laminated on the circuit.

Purpose This idea was developed with these points in mind, and is to make it low cost, compact, and easily shield the signal current from noise, and also to easily position the focal point of the optical system. The aim is to obtain a life-size optical sensor that can perform

Structure: In order to achieve the above object, this invention forms an insulating layer on at least one surface of the entire surface of a metal substrate, forms a sensor photosensitive part and a wiring electrode on this insulating layer, and has a surface dimension of the metal substrate. A circuit board with small surface dimensions is provided, a sensor drive circuit is mounted on this circuit board, this circuit board is adhesively fixed to the surface of the metal substrate opposite to the surface on which the sensor photosensitive portion is formed, and the metal The present invention is characterized in that the substrate is connected to a reference potential of the sensor drive circuit.

An embodiment of this invention will be described below based on the drawings. First, in this embodiment, as shown in FIG. 2a, a metal substrate 1 is used as the substrate. As this metal, Al, stainless steel, etc. are used. An insulating layer 2 is formed on at least one surface of such a metal substrate 1. In this embodiment, as shown in FIG.
has been formed. This insulating layer 2 is formed by oxidizing the substrate 1 itself by a method such as plasma oxidation or anodic oxidation, or by forming an insulating film on the surface of the substrate 1 by a sputtering method, a glow discharge CVD method, or the like. Then, as shown in FIG.
Sensor photosensitive part 3 and wiring electrode 4 are removed during the processing process.
and form. Here, these sensor photosensitive parts 3 and wiring electrodes 4 are arranged in the longitudinal direction of the substrate 1 to form an array, as shown in FIG. 6 and the like. On the other hand, a circuit board 6 on which a sensor drive circuit 5 is mounted
is provided. This circuit board 6 is made of, for example, a flexible PC board _6F , and as shown in FIG. It is bonded and fixed with an adhesive 7, and is connected to the wiring electrode 4 by being curved around the metal substrate 1, as shown in FIG. Here, the inner peripheral surface of the circuit board 6 has a wiring conductor 6a connected to the lead-out pad of the wiring electrode 4, as shown in FIG. In other words, the wiring conductor 6a is exposed. Incidentally, when the metal substrate 1 does not have the insulating layer 2b on the lower surface side, a circuit board 6 having an insulating coat 6b formed on the inner circumferential surface of the wiring conductor 6a may be used, as shown in FIG. Further, as the circuit board 6, a normal PC board 6p may be used as shown in FIG. In this case, the wiring electrode 4 side and the sensor drive circuit 5 side may be connected by thermocompression bonding another flexible tape 8.

For the device that has undergone such a process, the sensor drive circuit 5 is connected to the facsimile main body 9 through a power line, a video line, and a clock line, as shown in FIG.
A ground line serving as a reference potential is connected to the conductor portion of the metal substrate 1 directly below the insulating layer 2b.

According to such a configuration, since the substrate 1 is a metal plate, it is possible to connect the ground line of the sensor drive circuit 5 to the metal substrate 1 to provide noise shielding to both the sensor side and the sensor drive circuit side. It is possible to improve noise resistance at low cost. In addition, since the substrate 1 is a metal plate, the price is low and costs can be reduced.
There is no need to worry about Na ⁺ ions like glass.

By the way, such a sensor unit
The sensor photosensitive part 3 is at the focal point of a 1-magnification lens such as SLA (light converging optical fiber) or DMLA (roof mirror lens array...lens array using a roof-shaped prism).
It is necessary to perform mechanical positioning so that the This type of positioning is generally done by positioning the sensor surface with respect to a certain reference plane, but in this respect, because the materials of conventional ceramics, quartz, etc. It cannot be pressed against a reference surface, and is carried out via another support. However, according to this embodiment, the substrate 1 is made of metal such as Al, so there is no such concern, and the surface of the substrate 1 can be directly pressed against the reference surface, making installation easy and improving the positional accuracy. In order to increase the area of the substrate 1 in contact with the reference surface, the size of the substrate 1 is increased (for this reason, the size of the circuit board 6
Even in the case where the surface dimension is smaller than that of the metal substrate 1 (see FIG. 6, etc.), since the cost per unit area of the substrate 1 is low, it hardly affects the increase in cost. In FIG. 6, the portions at both ends in the longitudinal direction indicated by diagonal lines are the mounting surfaces 10 relative to the reference surface. If these two mounting surfaces 10 do not have enough area, as shown in FIGS. 7 and 8, holes 11 are formed in the metal substrate 1 through which the flexible PC board 6 _F or the flexible tape 9 is passed. The outer portion of this hole 11 may also be brought into contact with the reference surface as the mounting surface 10. Furthermore, in order to facilitate attachment to the reference surface, the mounting surface 1 is attached as shown in FIGS. 9 and 10.
Drill a mounting screw hole 12 in the 0 part and attach the SLA13
The reference surface 15 of the optical system unit 14 having the same structure may be brought into contact with the reference surface 15 of the optical system unit 14 and fixed with the screw 16. The formation of the screw holes 12 in the substrate 1 is also easy because the substrate 1 is a metal plate. In this way, since the substrate 1 can be brought into direct contact with the mounting reference surface 15, a separate support body is not required, cost can be reduced, and compactness can be maintained.

Effects This invention uses a metal substrate as described above, so it is inexpensive and can reduce costs, and there is no need to worry about Na ⁺ ions, etc.
Positioning can be performed by directly contacting the optical system mounting reference surface with this board, which eliminates the need for a separate support, making it possible to maintain a thin and compact structure at low cost, and making it easy to attach to the reference surface. It is possible to increase the contact area with the reference surface and improve positioning accuracy. Furthermore, by connecting the reference potential of the sensor drive circuit to this metal substrate, both the sensor side and the sensor drive circuit side can be Noise shielding can be easily performed at one time, and noise resistance can be improved at low cost.

[Brief explanation of the drawing]

The drawing shows one embodiment of this invention.
The figure is a vertical side view showing the gist, Figures 2 a to e are vertical side views showing the process order, Figure 3 is a vertical side view, and Figure 4 is a vertical side view showing the process order.
The figure is a vertical side view showing a modification, FIG. 5 is a vertical side view showing a different modification, FIG. 6 is a perspective view, FIG. 7 is a perspective view showing a modification of the installation, and FIG. 8 is a longitudinal cross-section. A side view, FIG. 9 is a perspective view showing a different modification of attachment, and FIG. 10 is a longitudinal sectional side view thereof. DESCRIPTION OF SYMBOLS 1...Metal substrate, 2...Insulating layer, 3...Sensor photosensitive part, 4...Wiring electrode, 5...Sensor drive circuit, 6...Circuit board.

Claims (1)

[Scope of utility model registration request] An insulating layer is formed over the entire surface on at least one side of a metal substrate, a sensor photosensitive part and a wiring electrode are formed on the insulating layer, and a circuit board having a surface dimension smaller than that of the metal substrate is provided. A sensor drive circuit is mounted on the sensor drive circuit, and this circuit board is adhesively fixed to the surface of the metal substrate opposite to the surface on which the sensor photosensitive portion is formed, and the metal substrate is connected to a reference potential of the sensor drive circuit. A life-sized optical sensor featuring