JPH04329014A - Piezoelectric component - Google Patents
Piezoelectric componentInfo
- Publication number
- JPH04329014A JPH04329014A JP12661691A JP12661691A JPH04329014A JP H04329014 A JPH04329014 A JP H04329014A JP 12661691 A JP12661691 A JP 12661691A JP 12661691 A JP12661691 A JP 12661691A JP H04329014 A JPH04329014 A JP H04329014A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrodes
- piezoelectric substrate
- lead
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims description 14
- 239000010410 layer Substances 0.000 description 21
- 238000005516 engineering process Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 239000006258 conductive agent Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【産業上の利用分野】本発明は、例えばフィルタ、共振
子または発振子等として使用される圧電部品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to piezoelectric components used, for example, as filters, resonators, or oscillators.
【従来の技術】この種の圧電部品に関する従来技術文献
としては、特開平２ー１８０４１７号公報等が知られて
いる。この従来技術では、圧電基板の表面及び裏面に積
層される表カバー及び裏カバーのそれぞれが空洞層と封
止層とを含み、空洞層が振動部に対応する部分に空洞部
を有して圧電基板に密着しており、空洞部が振動部の表
電極及び裏電極から外れた位置に開口部を有している。
封止層は、上述の開口部を閉塞するように空洞層の上に
密着させる。この従来技術によれば、封止層を、樹脂塗
料印刷によって形成した場合でも、樹脂塗料が開口部を
通して空洞部内に侵入し、更に、振動部の電極に至る迄
、ある距離が確保できるので、振動部に対する樹脂塗料
の実質的な悪影響を回避できる。しかも、開口部は、振
動部の表電極及び裏電極から外れた位置にあるので、空
洞部の形状に制限されることがなくなり、封止が容易に
なる等の優れた作用効果が得られる。
＜発明が解決しようとする課題＞しかしながら、上述し
た従来技術においては、バネ性金属薄板を用いたキャッ
プ状端子金具を装着し、この端子金具を振動電極に導通
するリード電極に導通させる構造であったため、部品点
数が多くなること、表カバー及び端子金具の両者におい
て、振動部と端子金具とを接続するための構造が複雑に
なること、実装状態において端子金具が半田付け応力等
の外力の影響を受けて反りや破損等を発生し易いこと等
の問題点があった。そこで、本発明の課題は上述する従
来の問題点を解決し、部品点数が少なく、構造が簡単で
、振動電極を外部に引出すためのリード電極引回し経路
が短く、電極食われ現象等の生じにくい高信頼度の圧電
部品を提供することである。
＜課題を解決するための手段＞上述した課題解決のため
、本発明は、圧電基板と、表カバーと、裏カバーと、こ
れらを支持する支持体とを有する圧電部品であって、前
記圧電基板は、振動部を有し、前記振動部が表面及び裏
面に互いに対向して配置された表電極及び裏電極で構成
され、前記表電極が前記圧電基板を表裏方向に通る導体
によって裏面側に設けられたリード電極と導通し、前記
裏電極が裏面側に設けられた他のリード電極と導通して
おり、前記表カバー及び裏カバーは、一面側に空洞部を
有し、前記一面側が前記圧電基板の表面及び裏面に重ね
られ、前記空洞部が前記表電極及び裏電極の周りに振動
空間を形成しており、前記支持体は、外面に外部接続端
子を有し、前記外部接続端子が前記リード電極に導通し
ていることを特徴とする。
＜作用＞圧電基板は、表電極が圧電基板を表裏方向に通
る導体によって裏面側に設けられたリード電極と導通し
、裏電極が裏面側に設けられた他のリード電極と導通し
ており、支持体は外面に外部接続端子を有し、外部接続
端子がリード電極に導通しているから、従来と異なって
、金属薄板でなるキャップ状端子金具が不要である。
このため、部品点数が少なくなると共に、振動部取出構
造が簡単になる。キャップ状端子金具が不要であるため
に、キャップ状端子金具の反り、外力による接合部破損
等による信頼性低下を招くことがない。圧電基板は、表
電極が圧電基板を表裏方向に通る導体によって裏面側に
設けられたリード電極と導通し、裏電極が裏面側に設け
られた他のリード電極と導通しているから、表電極及び
裏電極を同一面である裏面側で引出すことができ支持体
との接続が容易となる。また、振動電極の外部引出経路
が短くなり、リードインダクタンスの減少、それに伴う
特性向上等の利点が得られる。支持体は、外面に外部接
続端子を有し、外部接続端子がリード電極に導通してい
るから、支持体に設けられた外部接続端子を利用して外
部回路と接続できる。このため、振動電極から導出され
ているリード電極の半田食われ現象等を防止できる。支
持体の外部接続端子は、厚膜として形成できるから、半
田食われの影響は実質的に無視できる。2. Description of the Related Art Japanese Patent Application Laid-Open No. 2-180417 is known as a prior art document regarding this type of piezoelectric component. In this conventional technology, each of the front cover and the back cover laminated on the front and back surfaces of the piezoelectric substrate includes a cavity layer and a sealing layer, and the cavity layer has a cavity in a portion corresponding to the vibrating part to generate a piezoelectric It is in close contact with the substrate, and the cavity has an opening at a position away from the front and back electrodes of the vibrating section. The sealing layer is brought into close contact with the cavity layer so as to close the above-mentioned opening. According to this conventional technology, even when the sealing layer is formed by resin paint printing, a certain distance can be secured for the resin paint to enter the cavity through the opening and reach the electrode of the vibrating part. Substantial adverse effects of the resin paint on the vibrating part can be avoided. Moreover, since the opening is located away from the front and back electrodes of the vibrating section, it is no longer limited by the shape of the cavity, and excellent effects such as easy sealing can be obtained. <Problems to be Solved by the Invention> However, in the above-mentioned prior art, a cap-shaped terminal fitting made of a thin spring metal plate is attached, and this terminal fitting is electrically connected to a lead electrode that is electrically connected to a vibrating electrode. Therefore, the number of parts increases, the structure for connecting the vibrating part and the terminal fitting becomes complicated for both the front cover and the terminal fitting, and the terminal fitting is susceptible to external forces such as soldering stress in the mounted state. There were problems such as being susceptible to warping and damage due to exposure to heat. Therefore, the object of the present invention is to solve the above-mentioned conventional problems, have a small number of parts, a simple structure, a short lead electrode routing path for extracting the vibrating electrode to the outside, and avoid the phenomenon of electrode erosion. The objective is to provide highly reliable piezoelectric components that are difficult to use. <Means for Solving the Problems> In order to solve the above-mentioned problems, the present invention provides a piezoelectric component having a piezoelectric substrate, a front cover, a back cover, and a support for supporting these, wherein the piezoelectric substrate has a vibrating part, the vibrating part is composed of a front electrode and a back electrode arranged opposite to each other on the front and back surfaces, and the front electrode is provided on the back side by a conductor passing through the piezoelectric substrate in the front and back direction. The back electrode is electrically connected to another lead electrode provided on the back side, and the front cover and the back cover have a cavity on one side, and the one side is connected to the piezoelectric The support body is superimposed on the front and back surfaces of the substrate, and the hollow portion forms a vibration space around the front electrode and the back electrode, and the support body has an external connection terminal on the outer surface, and the external connection terminal It is characterized by being electrically connected to the lead electrode. <Function> In the piezoelectric substrate, the front electrode is electrically connected to a lead electrode provided on the back surface side by a conductor passing through the piezoelectric substrate in the front and back direction, and the back electrode is electrically connected to another lead electrode provided on the back surface side. Since the support body has external connection terminals on its outer surface, and the external connection terminals are electrically connected to the lead electrodes, there is no need for a cap-shaped terminal fitting made of a thin metal plate, unlike in the past. Therefore, the number of parts is reduced and the vibrating part extraction structure is simplified. Since the cap-shaped terminal fitting is not required, there is no risk of deterioration in reliability due to warping of the cap-shaped terminal fitting or damage to the joint due to external force. In a piezoelectric substrate, the front electrode is electrically connected to the lead electrode provided on the back side by a conductor passing through the piezoelectric substrate in the front and back direction, and the back electrode is electrically connected to other lead electrodes provided on the back side. And the back electrode can be pulled out on the same back surface side, making it easy to connect to the support. Furthermore, the external lead path of the vibrating electrode is shortened, resulting in advantages such as a reduction in lead inductance and an accompanying improvement in characteristics. Since the support has an external connection terminal on its outer surface and the external connection terminal is electrically connected to the lead electrode, it can be connected to an external circuit using the external connection terminal provided on the support. Therefore, it is possible to prevent solder erosion of the lead electrode led out from the vibrating electrode. Since the external connection terminal of the support can be formed as a thick film, the influence of solder erosion can be substantially ignored.
【実施例】図１は本発明に係る圧電部品の分解斜視図、
図２は同じく正面図、図３は同じく正面断面図、図４は
図２のＡ１ーＡ１線上における断面図、図５は図２のＡ
２ーＡ２線上における断面図である。１は圧電基板、２
は表カバー、３は裏カバー、４は支持体、５は接着剤層
である。圧電基板１は、振動部６、７を有する。各振動
部６、７は、圧電基板１の表面及び裏面に互いに対向す
るように形成された表電極６１、７１及び裏電極（６２
、６３）、（７２、７３）を備えている。表電極６１、
７１は、リード電極８に共通に接続されている。リード
電極８には圧電基板１の両面に設けたコンデンサ電極９
も導通させてある。裏電極６２、７２は、コンデンサ電
極９と対向するコンデンサ電極１０を介して互いに導通
接続されており、裏電極６３、７３は、圧電基板１に形
成されたリード電極６４、７４によって圧電基板１の両
隅部の端部に導かれている。電極配置に関しては、図示
とは逆に、電極（６２、６３）、（７２、７３）を表電
極とし、電極６１、７１を裏電極とするような配置関係
をとることも可能である。更に、圧電基板１の裏面側に
は、表面側のリード電極８と対向するリード電極１１が
設けられている。表面側のリード電極８及び裏面側のリ
ード電極１１は、圧電基板１を表裏方向に通る導体１２
によって互いに接続されている。導体１２は主振動モー
ドに影響を与えない位置であって、リード電極８、１１
を相互接続できる位置であれば、任意の位置が選定でき
る。図示の導体１２は圧電基板１に設けられたスルーホ
ール内に導電剤を塗布して形成されている。スルーホー
ルは焼成前はグリーンシート打抜き、焼成後はレーザ加
工等によって形成できる。表電極６１、７１、裏電極（
６２、６３）、（７２、７３）及びリード電極６４、７
４、８、１１はスパッタ等の薄膜技術または厚膜技術に
よって形成できる。このように、圧電基板１は、表電極
６１、７１が圧電基板１を表裏方向に通る導体１２によ
って裏面側に設けられたリード電極１１と導通し、裏電
極６３、７３が裏面側に設けられたリード電極６４、７
４と導通しているから、表電極６１、７１及び裏電極６
３、７４を同一面である裏面側で引出すことができ支持
体との接続が容易となる。また、振動部６、７の外部引
出経路が短くなり、リードインダクタンスの減少、それ
に伴う特性向上等の利点が得られる。表カバー２は、空
洞層２１と封止層２２とを含み、裏カバー３も同様に、
空洞層３１と封止層３２とを含んでいる。空洞層２１、
３１は、一面側の振動部６、７に対応する部分に空洞部
（２１１、２１２）、（３１１、３１２）を有し、一面
側を圧電基板１に密着させてある。これにより振動部６
、７の周りに振動空間が形成される。空洞部（２１１、
２１２）、（３１１、３１２）は、振動部６、７の表電
極６１及び裏電極（６２、６３）、（７２、７３）から
外れた位置に、開口部２１３、３１３を有している。空
洞部（２１１、２１２）、（３１１、３１２）は、表電
極６１、７１及び裏電極（６２、６３）、（７２、７３
）で構成される振動部を包囲するように形成し、その一
部を狭い通路を通して、開口部２１３、３１３に連通さ
せてある。裏カバー３の空洞層３１及び封止層３２は、
リード電極６４、１１及び７４と対応する位置に、欠落
部３１４〜３１６、３２１〜３２３を設けてある。封止
層２２、３２は、絶縁樹脂でなり、空洞層２１、３１の
上に密着し、開口部２１３、３１３を閉塞している。封
止層２２、３２は紫外線硬化型樹脂によって形成するの
が望ましい。支持体４は、ガラス．エポキシ樹脂やアル
ミナ等でなり、接着層５によって裏カバー３を構成する
封止層３２の表面に接着されている。支持体４は裏カバ
ー３側だけに備えられており、表カバー２側には備えら
れていない。従って、薄型になる。支持体４の一端縁に
は、裏カバー３の空洞層３１及び封止層３２の端縁に設
けられた欠落部３１４〜３１６、３２１〜３２３に対応
する欠落部４１〜４３を設けてある。欠落部４１〜４３
の内部及びその周辺部には、外部接続端子１３〜１５が
被着されている。外部接続端子１３〜１５は厚膜形成技
術、メッキ技術またはその組合せによって形成する。組
立に当って、支持体１４の上に裏カバー３、圧電基板１
及び表カバー２の積層体を、接着層５を介して積層一体
化する。圧電基板１の裏面側に設けられたリード電極６
４、１１及び７４は、裏カバー３の空洞層３１及び封止
層３２の端縁に設けられた欠落部３１４〜３１６、３２
１〜３２３を介して、支持体４の欠落部４１〜４３の周
辺に設けられた外部接続端子１３〜１５と対向するよう
に配置する。そして、欠落部３１４〜３１６、３２１〜
３２３、欠落部４１〜４３に導電塗料や半田等による導
電剤１６〜１８（図２参照）を塗布し、リード電極６４
、１１及び７４を外部接続端子１３〜１５に導通接続さ
せる。上述のように、表電極６１、７１が圧電基板１を
表裏方向に通る導体１２によって裏面側に設けられたリ
ード電極１１と導通し、裏電極６３、７３が裏面側に設
けられた他のリード電極６４、７４と導通しており、支
持体４は外面に外部接続外部接続端子１３〜１５を有し
、外部接続外部接続端子１３〜１５がリード電極６４、
１１、７４に導通しているから、従来と異なって、金属
薄板でなるキャップ状端子金具が不要である。このため
、部品点数が少なくなると共に、振動電極取出構造が簡
単になる。キャップ状端子金具が不要であるために、キ
ャップ状端子金具の反り、外力による接合部破損等によ
る信頼性低下を招くことがない。しかも、支持体４は、
外面に外部接続端子１３〜１５を有し、外部接続端子１
３〜１５がリード電極６４、１１、７４に導通している
から、支持体４に設けられた外部接続端子１３〜１５を
用いて外部回路と接続できる。このため、振動部６、７
から導出され薄膜で構成されているリード電極６４、１
１、７４の半田食われ現象等を防止できる。支持体４の
外部接続端子１３〜１５は、厚膜として形成できるから
、半田食われの影響は実質的に無視できる。[Example] FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention.
2 is a front view, FIG. 3 is a front sectional view, FIG. 4 is a sectional view taken along line A1-A1 in FIG. 2, and FIG.
FIG. 2 is a sectional view taken along line 2-A2. 1 is a piezoelectric substrate, 2
3 is a front cover, 3 is a back cover, 4 is a support, and 5 is an adhesive layer. The piezoelectric substrate 1 has vibrating parts 6 and 7. Each of the vibrating parts 6 and 7 includes front electrodes 61 and 71 and a back electrode (62
, 63) and (72, 73). surface electrode 61,
71 is commonly connected to the lead electrode 8. The lead electrode 8 includes a capacitor electrode 9 provided on both sides of the piezoelectric substrate 1.
is also conductive. The back electrodes 62 and 72 are conductively connected to each other via the capacitor electrode 10 facing the capacitor electrode 9, and the back electrodes 63 and 73 are connected to the piezoelectric substrate 1 by lead electrodes 64 and 74 formed on the piezoelectric substrate 1. It is led to the ends of both corners. Concerning the electrode arrangement, contrary to the illustration, it is also possible to adopt an arrangement in which the electrodes (62, 63) and (72, 73) are used as front electrodes, and the electrodes 61 and 71 are used as back electrodes. Further, on the back side of the piezoelectric substrate 1, a lead electrode 11 is provided that faces the lead electrode 8 on the front side. The lead electrode 8 on the front side and the lead electrode 11 on the back side are conductors 12 that pass through the piezoelectric substrate 1 in the front and back directions.
are connected to each other by. The conductor 12 is located at a position that does not affect the main vibration mode, and the lead electrodes 8, 11
Any location can be selected as long as the two can be interconnected. The illustrated conductor 12 is formed by applying a conductive agent into a through hole provided in the piezoelectric substrate 1. The through holes can be formed by punching a green sheet before firing and by laser processing after firing. Front electrodes 61, 71, back electrodes (
62, 63), (72, 73) and lead electrodes 64, 7
4, 8, and 11 can be formed by thin film technology such as sputtering or thick film technology. In this way, in the piezoelectric substrate 1, the front electrodes 61 and 71 are electrically connected to the lead electrode 11 provided on the back surface side by the conductor 12 passing through the piezoelectric substrate 1 in the front and back direction, and the back electrodes 63 and 73 are provided on the back surface side. Lead electrodes 64, 7
4, the front electrodes 61, 71 and the back electrode 6
3 and 74 can be pulled out on the same side, which is the back side, making it easier to connect them to the support. Furthermore, the external lead-out paths of the vibrating parts 6 and 7 are shortened, resulting in advantages such as a reduction in lead inductance and an accompanying improvement in characteristics. The front cover 2 includes a cavity layer 21 and a sealing layer 22, and the back cover 3 similarly includes:
It includes a cavity layer 31 and a sealing layer 32. hollow layer 21,
31 has hollow portions (211, 212) and (311, 312) on one side corresponding to the vibrating parts 6 and 7, and has one side in close contact with the piezoelectric substrate 1. As a result, the vibrating section 6
, 7, a vibration space is formed around them. Hollow part (211,
212), (311, 312) have openings 213, 313 at positions away from the front electrode 61 and back electrodes (62, 63), (72, 73) of the vibrating parts 6, 7. The cavity parts (211, 212), (311, 312) are connected to the front electrodes 61, 71 and the back electrodes (62, 63), (72, 73).
), and a portion thereof is communicated with the openings 213 and 313 through a narrow passage. The cavity layer 31 and sealing layer 32 of the back cover 3 are
Missing portions 314 to 316 and 321 to 323 are provided at positions corresponding to lead electrodes 64, 11 and 74. The sealing layers 22 and 32 are made of insulating resin, are in close contact with the cavity layers 21 and 31, and close the openings 213 and 313. It is desirable that the sealing layers 22 and 32 be formed of ultraviolet curing resin. The support 4 is made of glass. It is made of epoxy resin, alumina, or the like, and is bonded to the surface of the sealing layer 32 that constitutes the back cover 3 through an adhesive layer 5 . The support body 4 is provided only on the back cover 3 side and not on the front cover 2 side. Therefore, it becomes thin. One end edge of the support body 4 is provided with cutout parts 41 to 43 corresponding to the cutout parts 314 to 316 and 321 to 323 provided at the end edges of the cavity layer 31 and the sealing layer 32 of the back cover 3. Missing parts 41 to 43
External connection terminals 13 to 15 are attached inside and around the periphery. The external connection terminals 13 to 15 are formed by thick film formation technology, plating technology, or a combination thereof. During assembly, the back cover 3 and piezoelectric substrate 1 are placed on the support 14.
The laminate of the front cover 2 and the front cover 2 are laminated and integrated via the adhesive layer 5. Lead electrode 6 provided on the back side of piezoelectric substrate 1
4, 11, and 74 are missing parts 314 to 316, 32 provided at the edges of the cavity layer 31 and the sealing layer 32 of the back cover 3.
The terminals 1 to 323 are arranged to face the external connection terminals 13 to 15 provided around the missing parts 41 to 43 of the support body 4 through the terminals 1 to 323. And missing parts 314 to 316, 321 to
323, apply conductive agents 16 to 18 (see FIG. 2) such as conductive paint or solder to the missing parts 41 to 43, and connect the lead electrodes 64.
, 11 and 74 are electrically connected to the external connection terminals 13 to 15. As described above, the front electrodes 61 and 71 are electrically connected to the lead electrode 11 provided on the back side by the conductor 12 passing through the piezoelectric substrate 1 in the front and back directions, and the back electrodes 63 and 73 are electrically connected to the other leads provided on the back side. The support body 4 has external connection terminals 13 to 15 on its outer surface, and the external connection terminals 13 to 15 are electrically connected to the lead electrodes 64 and 74.
11 and 74, unlike the conventional case, there is no need for a cap-shaped terminal fitting made of a thin metal plate. Therefore, the number of parts is reduced and the structure for taking out the vibrating electrode is simplified. Since the cap-shaped terminal fitting is not required, there is no risk of deterioration in reliability due to warping of the cap-shaped terminal fitting or damage to the joint due to external force. Moreover, the support body 4 is
It has external connection terminals 13 to 15 on the outer surface, and external connection terminal 1
Since the terminals 3 to 15 are electrically connected to the lead electrodes 64, 11, and 74, the external connection terminals 13 to 15 provided on the support 4 can be used to connect to an external circuit. For this reason, the vibrating parts 6, 7
The lead electrode 64, 1 is made of a thin film and is derived from
1, 74 solder eating phenomenon etc. can be prevented. Since the external connection terminals 13 to 15 of the support body 4 can be formed as thick films, the influence of solder erosion can be substantially ignored.
【発明の効果】以上述べたように、本発明によれば、次
のような効果が得られる。
（ａ）圧電基板は、表電極が圧電基板を表裏方向に通る
導体によって裏面側に設けられたリード電極と導通し、
裏電極が裏面側に設けられた他のリード電極と導通して
おり、支持体は外面に外部接続端子を有し、外部接続端
子がリード電極に導通しているから、従来と異なって、
金属薄板でなるキャップ状端子金具が不要で、部品点数
が少なく、電極取出構造が簡単で、キャップ状端子金具
の反り、外力による接合部破損等による信頼性低下を招
くことのない圧電部品を提供できる。
（ｂ）圧電基板は、表電極が圧電基板を表裏方向に通る
導体によって裏面側に設けられたリード電極と導通し、
裏電極が裏面側に設けられた他のリード電極と導通して
いるから、振動電極の外部引出経路が短く、特性の優れ
た圧電部品を提供できる。
（ｃ）支持体は、外面に外部接続端子を有し、外部接続
端子がリード電極に導通しているから、振動電極から導
出されているリード電極の半田食われ現象等を防止し得
る高信頼度の圧電部品を提供できる。[Effects of the Invention] As described above, according to the present invention, the following effects can be obtained. (a) The piezoelectric substrate has a front electrode electrically connected to a lead electrode provided on the back side by a conductor passing through the piezoelectric substrate in the front and back direction,
The back electrode is electrically connected to other lead electrodes provided on the back side, the support has external connection terminals on the outer surface, and the external connection terminals are electrically connected to the lead electrodes, which is different from conventional methods.
We provide a piezoelectric component that does not require a cap-shaped terminal fitting made of a thin metal plate, has a small number of parts, has a simple electrode extraction structure, and does not cause a decrease in reliability due to warping of the cap-shaped terminal fitting or damage to the joint due to external force. can. (b) The piezoelectric substrate has a front electrode electrically connected to a lead electrode provided on the back side by a conductor passing through the piezoelectric substrate in the front and back direction,
Since the back electrode is electrically connected to the other lead electrode provided on the back side, the external extraction path of the vibrating electrode is short, and a piezoelectric component with excellent characteristics can be provided. (c) The support has external connection terminals on the outer surface, and the external connection terminals are electrically connected to the lead electrodes, so they are highly reliable and can prevent solder erosion of the lead electrodes led out from the vibrating electrodes. We can provide a wide variety of piezoelectric components.
【図１】本発明に係る圧電部品の分解斜視図である。FIG. 1 is an exploded perspective view of a piezoelectric component according to the present invention.
【図２】本発明に係る圧電部品の正面図である。FIG. 2 is a front view of a piezoelectric component according to the present invention.
【図３】本発明に係る圧電部品の正面断面図である。FIG. 3 is a front sectional view of a piezoelectric component according to the present invention.
【図４】図２のＡ１ーＡ１線上における断面図である。FIG. 4 is a sectional view taken along line A1-A1 in FIG. 2;
【図５】図２のＡ２ーＡ２線上における断面図である。5 is a sectional view taken along line A2-A2 in FIG. 2. FIG.
Claims (2)
、これらを支持する支持体とを有する圧電部品であって
、前記圧電基板は、振動部を有し、前記振動部が表面及
び裏面に互いに対向して配置された表電極及び裏電極を
含み、前記表電極が前記圧電基板を表裏方向に通る導体
によって裏面側に設けられたリード電極と導通し、前記
裏電極が裏面側に設けられた他のリード電極と導通して
おり、前記表カバー及び裏カバーは、一面側に空洞部を
有し、前記一面側が前記圧電基板の表面及び裏面に重ね
られ、前記空洞部が振動部の周りに振動空間を形成して
おり、前記支持体は、外面に外部接続端子を有し、前記
外部接続端子が前記リード電極に導通していることを特
徴とする圧電部品。1. A piezoelectric component having a piezoelectric substrate, a front cover, a back cover, and a support for supporting these, wherein the piezoelectric substrate has a vibrating part, and the vibrating part is attached to the front and back surfaces. includes a front electrode and a back electrode arranged opposite to each other, the front electrode is electrically connected to a lead electrode provided on the back side by a conductor passing through the piezoelectric substrate in the front and back direction, and the back electrode is provided on the back side. The front cover and the back cover have a cavity on one side, and the one side is overlapped with the front and back sides of the piezoelectric substrate, and the cavity is connected to the vibrating part. A piezoelectric component having a vibration space formed therearound, wherein the support body has an external connection terminal on an outer surface, and the external connection terminal is electrically connected to the lead electrode.
空洞層と封止層とを含み、前記空洞層が前記空洞部を有
し、前記空洞部が前記表電極及び前記裏電極から外れた
位置に開口部を有し、前記封止層が前記空洞層の上に密
着し前記開口部を閉塞していることを特徴とする請求項
１に記載の圧電部品。[Claim 2] Each of the front cover and the back cover includes:
The cavity layer includes a cavity layer and a sealing layer, the cavity layer has the cavity part, the cavity part has an opening part at a position away from the front electrode and the back electrode, and the sealing layer has the cavity part. The piezoelectric component according to claim 1, wherein the piezoelectric component is closely attached to the layer and closes the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12661691A JPH04329014A (en) | 1991-04-30 | 1991-04-30 | Piezoelectric component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12661691A JPH04329014A (en) | 1991-04-30 | 1991-04-30 | Piezoelectric component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04329014A true JPH04329014A (en) | 1992-11-17 |
Family
ID=14939614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12661691A Pending JPH04329014A (en) | 1991-04-30 | 1991-04-30 | Piezoelectric component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04329014A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11312945A (en) * | 1998-04-27 | 1999-11-09 | Tdk Corp | Piezoelectric parts |
| US6160462A (en) * | 1997-08-12 | 2000-12-12 | Ngk Spark Plug Co., Ltd. | Energy trapping type piezoelectric filter with identical piezoelectric substrates |
| EP1058382A3 (en) * | 1999-06-03 | 2002-01-23 | TDK Corporation | Piezoelectric device and manufacturing method thereof |
-
1991
- 1991-04-30 JP JP12661691A patent/JPH04329014A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6160462A (en) * | 1997-08-12 | 2000-12-12 | Ngk Spark Plug Co., Ltd. | Energy trapping type piezoelectric filter with identical piezoelectric substrates |
| JPH11312945A (en) * | 1998-04-27 | 1999-11-09 | Tdk Corp | Piezoelectric parts |
| EP1058382A3 (en) * | 1999-06-03 | 2002-01-23 | TDK Corporation | Piezoelectric device and manufacturing method thereof |
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