JPH04329885A - Etching method of external parts - Google Patents

Etching method of external parts

Info

Publication number
JPH04329885A
JPH04329885A JP10162291A JP10162291A JPH04329885A JP H04329885 A JPH04329885 A JP H04329885A JP 10162291 A JP10162291 A JP 10162291A JP 10162291 A JP10162291 A JP 10162291A JP H04329885 A JPH04329885 A JP H04329885A
Authority
JP
Japan
Prior art keywords
resist film
treated
parts
etching
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10162291A
Other languages
Japanese (ja)
Inventor
Teruo Suzuki
輝夫 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP10162291A priority Critical patent/JPH04329885A/en
Publication of JPH04329885A publication Critical patent/JPH04329885A/en
Pending legal-status Critical Current

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  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To obtain the processing method which can form patterns and marks on the surfaces of external ornamental parts having stereoscopic structures by photoetching. CONSTITUTION:A jig plate 4 which is formed with a recessed part 2 on a base plate to the same shape as the outside shape of a rear cap 1 for a wrist watch which is the material to be treated and can set the material to be treated inserted into the recessed part 2 so as to make its surface flush with the front surface of the recessed part 2, is used as the jig to be exclusively used for the parts to be treated. A dry resist film having 25 to 75 micron film thickness is laminated on the surface of such plate to form a resist film 3; thereafter, the film is subjected to a photoetching stage to form the patterns and marks on the surface of the external ornamental parts. The good continuous resist film consisting of the resist film sticking to the surface of the jig and the surface of the parts to be treated is obtd. in this way. Since the material to be treated is fixed into the recessed part of the base plate even in the subsequent etching stage and the resist film simultaneously exhibits a good matching effect, there is an effect in the etching of the external ornamental parts having the stereoscopic structures with which the etching is heretofore difficult.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、腕時計等の外装部品表
面に微細な模様、マーク類をフォトエッチング加工によ
り形成する方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming fine patterns or marks on the surface of an exterior component such as a wristwatch by photo-etching.

【0002】0002

【従来の技術】ケース、裏蓋などの時計用外装部品のマ
ーキングは、従来機械的な打刻あるいは、フォトエッチ
ング法により形成していたが、デザイン的に繊細なマー
キングについては、フォトエッチング法が用いられてい
た。フォトエッチング法は、液状レジストを被処理材の
必要とする部分もしくは、全体を浸漬、スプレー塗布、
はけ塗りなどによりコーティングし所望とするエッチン
グパターンのフィルムを介し焼きつけ、現像した後塩化
第二鉄溶液などでエッチングする方法がとられていた。 またドライフィルムレジストを使用するものとしては、
文字板などラミネート可能な部品形状のもに限られてい
た。
[Prior Art] Markings on external parts of watches such as cases and back covers have traditionally been formed by mechanical stamping or photo-etching, but for markings with delicate designs, photo-etching has been used. It was used. The photo-etching method involves dipping, spraying, or spraying a liquid resist onto the required part or the entire part of the material to be treated.
The method used was to coat the film by brushing or the like, bake it through a film with a desired etching pattern, develop it, and then etch it with a ferric chloride solution or the like. Also, for those using dry film resist,
It was limited to parts that could be laminated, such as dials.

【0003】0003

【発明が解決しようとする課題】しかし、従来のフォト
エッチング加工においては、液状レジストは、ピンホー
ルが生じやすく、また外装部品の様な立体構造を持つも
のについては、レジストを均一にコートすることが困難
で溜まりが部分的に生じ、現像不良やレジスト膜の密着
不良が生じる問題があった。これらに対しドライフィル
ムレジストは、ピンホールが少なく均一なレジスト膜を
コートすることが可能な反面、立体構造を持つ外装部品
などには、ラミネートされない部分が生じ被処理部品の
形状が極めて制約されるという課題があった。そこで、
この発明の目的は、従来のこのような課題を解決するた
めフォトレジストを用いたフォトエッチング加工により
ケース、裏蓋などの腕時計用外装部品への模様、マーク
類を形成可能な加工方法を得ることにある。
[Problems to be Solved by the Invention] However, in conventional photo-etching processing, liquid resist tends to cause pinholes, and it is difficult to uniformly coat resist on items with three-dimensional structures such as exterior parts. There was a problem in that it was difficult to do so, and accumulations occurred in some areas, resulting in poor development and poor adhesion of the resist film. Dry film resist, on the other hand, can coat a uniform resist film with fewer pinholes, but on the other hand, for exterior parts with three-dimensional structures, there are parts that are not laminated, and the shape of the processed parts is extremely restricted. There was a problem. Therefore,
The purpose of the present invention is to provide a processing method capable of forming patterns and marks on exterior parts of a wristwatch such as a case and a back cover by photo-etching using a photoresist in order to solve these conventional problems. It is in.

【0004】0004

【課題を解決するための手段】上記課題を解決するため
に、この発明は、被処理部品の専用治具とドライフィル
ムレジストの膜厚を選定することにより、従来困難であ
った立体構造を持つ外装部品のエッチングを可能にした
ものである。即ち、専用治具として基板上に設けた凹部
が被処理材外形とほぼ同じ形状を有しかつ、凹部に挿入
した被処理材の表面と凹部上面がほぼ同一面になるよう
セット可能な治具板で該凹部に被処理材をセットした部
品とのギャップは、凹部上面壁部を基準に2mm以下、
被処理材表面と凹部上面の高さの差異は、2mm以下に
することが好ましい。その後これら表面に、膜厚25〜
75ミクロンのドライフィルムレジストをラミネートし
、所望とするエッチングパターンのフィルムを介し焼き
つけ、現像した後、エッチングする事により上記課題を
解決したものである。
[Means for Solving the Problems] In order to solve the above problems, the present invention provides a three-dimensional structure, which has been difficult to achieve in the past, by selecting a dedicated jig for the part to be processed and the film thickness of the dry film resist. This enables etching of exterior parts. That is, as a special jig, the recess provided on the substrate has approximately the same shape as the outer shape of the material to be processed, and the jig can be set so that the surface of the material to be processed inserted into the recess and the upper surface of the recess are approximately on the same plane. The gap between the plate and the part in which the material to be treated is set in the recess shall be 2 mm or less based on the upper wall of the recess.
The difference in height between the surface of the material to be treated and the upper surface of the recess is preferably 2 mm or less. After that, a film thickness of 25~
The above problem was solved by laminating a 75 micron dry film resist, baking the desired etching pattern through the film, developing it, and then etching it.

【0005】[0005]

【作用】上記のように構成された専用治具に被処理部品
をセットしドライフィルムレジストをラミネートするこ
とによりドライフィルムレジストが治具表面と被処理部
品表面に密着した良好な連続したレジスト膜が得られ、
その後のエッチング加工工程においても被処理材が基板
凹部内に固定されると同時にレジスト膜が良好なマスキ
ング効果を示す。ドライフィルムレジストの膜厚及び凹
部と被処理部品とのギャップ値の限定理由は、上記値を
越えるとレジスト膜が現像、エッチング工程で破れエッ
チング不良となるためである。また、ドライフィルムレ
ジストの膜厚が厚くなるとエッチングパターン解像度が
悪くなるため上限を75ミクロンにしたものである。
[Function] By setting the parts to be processed in the dedicated jig configured as above and laminating the dry film resist, a good continuous resist film is formed in which the dry film resist adheres to the jig surface and the surface of the parts to be processed. obtained,
In the subsequent etching process, the material to be processed is fixed within the recessed portion of the substrate, and at the same time, the resist film exhibits a good masking effect. The reason for limiting the film thickness of the dry film resist and the gap value between the recess and the processed part is that if the above values are exceeded, the resist film will be torn during the development and etching steps, resulting in poor etching. Further, as the thickness of the dry film resist becomes thicker, the resolution of the etching pattern deteriorates, so the upper limit is set to 75 microns.

【0006】[0006]

【実施例】以下、この発明の実施例を図に基づいて説明
する。図1において、SUS304材からなる腕時計用
裏蓋1を被処理部品の専用治具のガラスエポキシ基板よ
りなる治具板4の上に設けた凹部2にセットした。セッ
トした裏蓋と基板凹部上面壁部とのギャップは、1.0
〜1.5mm、被処理材表面と凹部上面の高さの差異は
、MAX2.0mmであった。この様に裏蓋をセットし
た治具板表面に膜厚50ミクロンのドライフィルムレジ
ストをロールコータにより熱圧着しレジスト膜3を施し
、露光−現像−エッチングの公知のフォトエッチング工
程を経て所望とするエッチングパターンを裏蓋表面に形
成した後レジスト膜を剥離した。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the present invention will be described below with reference to the drawings. In FIG. 1, a wristwatch back cover 1 made of SUS304 material was set in a recess 2 provided on a jig plate 4 made of a glass epoxy substrate of a jig dedicated to processing parts. The gap between the set back cover and the top wall of the board recess is 1.0
~1.5 mm, and the difference in height between the surface of the treated material and the upper surface of the recess was MAX 2.0 mm. A dry film resist with a thickness of 50 microns is bonded by thermocompression using a roll coater to the surface of the jig plate on which the back cover is set in this way to form a resist film 3, and the desired shape is formed through a known photo-etching process of exposure, development, and etching. After forming an etching pattern on the back cover surface, the resist film was peeled off.

【0007】   この様にしてして得られた裏蓋は、フォトエッチン
グ加工工程中レジスト膜の損傷などによるエッチング飛
びも無く品質的に満足出来る外装部品のエッチング加工
を得る事が出来た。
[0007] With the back cover obtained in this manner, it was possible to obtain an etching process for the exterior component that was satisfactory in terms of quality, with no skipping of etching due to damage to the resist film during the photoetching process.

【0008】[0008]

【発明の効果】この発明は、以上説明したように被処理
部品の専用治具として基板上に設けた凹部が被処理材外
形とほぼ同じ形状を有しかつ、凹部に挿入した被処理材
の表面と凹部上面がほぼ同一面になるようセット可能な
治具板を使用しこれら表面に膜厚25〜75ミクロンの
ドライレジストフィルムをラミネートしレジスト膜を形
成する事によりレジスト膜が治具表面と被処理部品表面
に密着した良好な連続したレジスト膜が得られ、その後
のエッチング加工工程においても被処理材が基板凹部内
に固定されると同時にレジスト膜が良好なマスキング効
果を示すため、従来困難であった立体構造を持つ外装部
品のエッチング加工に効果がある。
Effects of the Invention As explained above, the recess provided on the substrate as a dedicated jig for the parts to be processed has approximately the same shape as the outer shape of the part to be processed, and the part to be processed is inserted into the recess. Using a jig plate that can be set so that the surface and the upper surface of the recess are almost on the same plane, a dry resist film with a thickness of 25 to 75 microns is laminated on these surfaces to form a resist film, so that the resist film is the same as the jig surface. A good continuous resist film that adheres to the surface of the part to be processed can be obtained, and in the subsequent etching process, the material to be processed is fixed in the recess of the substrate and at the same time the resist film shows a good masking effect, which is difficult to do in the past. This method is effective for etching exterior parts with three-dimensional structures.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明の実施例において腕時計用裏蓋1を基板
凹部2にセットしドライフィルムレジスト膜3をコート
した状態を断面で示した説明図である。
FIG. 1 is an explanatory cross-sectional view showing a state in which a wristwatch back cover 1 is set in a substrate recess 2 and coated with a dry film resist film 3 in an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1  腕時計用裏蓋 2  基板上に設けた凹部 3  ドライフィルムレジスト膜 4  治具板 1 Watch back cover 2 Recess provided on the board 3 Dry film resist film 4 Jig plate

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  被処理部品の専用治具として、基板上
に設けた凹部が被処理材外形とほぼ同じ形状を有しかつ
、凹部に挿入した被処理材の表面と凹部上面がほぼ同一
面になるようセット可能な治具板を使用し、これら表面
に膜厚25〜75ミクロンのドライレジストフィルムを
ラミネートしレジスト膜を形成し、その後フォトエッチ
ング加工工程を経て外装部品表面に模様、マーク類を形
成することを特徴とする外装部品のエッチング方法。
Claim 1: A jig dedicated to processing parts, in which a recess provided on a substrate has approximately the same shape as the outer shape of the workpiece, and the surface of the workpiece inserted into the recess and the top surface of the recess are approximately flush with each other. Using a jig plate that can be set so that A method for etching exterior parts, characterized by forming.
JP10162291A 1991-05-07 1991-05-07 Etching method of external parts Pending JPH04329885A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10162291A JPH04329885A (en) 1991-05-07 1991-05-07 Etching method of external parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10162291A JPH04329885A (en) 1991-05-07 1991-05-07 Etching method of external parts

Publications (1)

Publication Number Publication Date
JPH04329885A true JPH04329885A (en) 1992-11-18

Family

ID=14305501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10162291A Pending JPH04329885A (en) 1991-05-07 1991-05-07 Etching method of external parts

Country Status (1)

Country Link
JP (1) JPH04329885A (en)

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