JPH0433158B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a hybrid IC mounting structure in which electronic components are mounted on a flexible substrate.

[Prior Art] The conventional mounting structure of a hybrid IC in which electronic components are mounted on a flexible substrate is as shown in FIG. It has a bonded structure. In this structure, electronic components 2 are arranged in a plane on the surface of a base 4, and as the number of electronic components increases, the plane area on which the electronic components are mounted increases proportionally, resulting in a large plane. The disadvantage is that it is a hybrid IC.

[Objective] The present invention solves the above-mentioned drawbacks and provides a compact hybrid IC.

[Summary] The mounting structure of the hybrid IC of the present invention includes a flexible substrate on which a plurality of electronic components are mounted on a wiring pattern formed on the surface of an insulating member and an external terminal is formed on one end, and the flexible substrate is housed. the flexible substrate is wound and stored in the housing, and is sealed with a molding agent;
Further, the external terminal is led out from the storage portion and supported and fixed to the protrusion.

[Example] Examples of the present invention will be shown below. FIG. 2 is a cross-sectional view showing the finished product with external terminals taken out only in one direction, with a chip component 6a mounted on the flexible board 5.
This figure shows a structure in which 6 g of solder is soldered with solder 7, wound into a spiral shape, and further placed in the storage section 9a of the case 9. 11 is a molding agent, 10
Reference numeral 8 indicates an adhesive, and 8 indicates an external terminal supported and fixed to a protrusion 9b formed protruding from the outer wall of the housing portion 9a of the case 9. The external terminal 8 is formed at one end of the flexible substrate 5.

As shown in the plan view of FIG. 3A and the front cross-sectional view of FIG. Electronic components such as mini-mold ICs 6a
Make an electronic circuit board by attaching ~6g with solder 7. Note that the wiring pattern is omitted in FIG. 3A. Next, it is wound spirally from the opposite side of the board where the external terminal 8 is formed, and the fourth
Storage section 9a of plastic case 9 shown in the figure
Insert into. Thereafter, the external terminals 8 of the flexible substrate 5 and the protruding portions 9b of the case 9 are adhesively fixed with an adhesive 10, and a molding agent 11 is further filled to obtain the finished product shown in FIG. 2. Fig. 5 is a sectional view showing the finished product with external terminals taken out from two sides.
and spacer 2.
0 and a shield material 21.
12 is a flexible substrate, 13a to 13h are electronic components, 14 is solder, 17 is a case, 18 is an adhesive, and 19 is a molding agent. The manufacturing method is
First, as shown in the plan view of FIG. 6, electronic components 13a to 13h such as chip resistors, capacitors, transistors, and mini-molded ICs are soldered to a flexible substrate 12 having a lead pattern formed on a polyimide material. Make the electronic board attached in step 14. In addition, in FIG. 6, the wiring pattern is omitted. External terminals 15 and 16 are patterned on both sides of the flexible substrate 12 used for this purpose. Next, as shown in the sectional view of FIG. 7, the flexible substrate 12 is bent at the center, and a spacer 20 and a shield material 21 made of aluminum foil or the like are set. Thereafter, the external terminals 15 and 16 are wound spirally from the opposite side, and then processed in the same manner as when the external terminal 8 is taken out only on one side, resulting in the finished product shown in FIG. 5. . The purpose of the spacer 20 used for this is to prevent shorts between electronic components and to provide a shielding effect between electronic circuits.As shown in the cross-sectional view of FIG. is coated with an insulating material 23 such as polyester. This spacer can also be used even if the external terminal 8 is taken out only on one side. FIG. 9 is a perspective view of a completed product showing an example in which electronic components that require heat radiation are used.
It has 4. 5 is a flexible substrate, 8 is an external terminal, 9 is a case, and 11 is a molding agent.
As shown in the plan view of FIG. 10, the heat sink 24 is an electronic component 6b attached to the flexible board 5
It is glued and fixed to the top surface of.

〔effect〕

As described above, according to the present invention, the flexible board on which a plurality of electronic components are mounted is wound and stored in the storage section of the case, so that it is possible to avoid the conventional technology in which, for example, a plurality of electronic components are simply arranged in a plane. Compared to hybrid IC mounting structures, it is possible to provide a compact hybrid IC mounting structure that is more space-efficient in plan view. In addition, since the flexible circuit board wound and stored in the storage section of the case is sealed with a molding agent, the flexible circuit board and electronic components are fixed within the storage section, so for example, the flexible circuit board can be sealed with a molding agent. Compared to a structure in which the flexible circuit board and electronic components are simply rolled up and stored in the storage section, when external stress is applied to the case, the flexible circuit board and electronic components may move, or the electronic components may come into direct contact with each other. At the same time, it has the effect that cracks do not occur in the wiring pattern, and the joints of electronic components do not peel off or get damaged. Furthermore, since the external terminal formed at one end of the flexible board is led out from the storage part of the case and supported and fixed to the protrusion that protrudes from the outer wall of the storage part, for example, the external terminal of the flexible board can be connected to the external terminal of the flexible board. When mounting on a base board, etc., the external terminal part alone is easily deformed, making it difficult to position and fix it to the base board, and this solves the assembly problem. The external terminal supported and fixed on the protrusion has the effect that it can be easily positioned with respect to the base substrate and can be mounted efficiently.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a conventional hybrid IC. FIG. 2 is a hybrid diagram showing an embodiment of the present invention.
Cross-sectional view of the finished IC. FIG. 3 is a plan view and a sectional view of an electronic board used in an embodiment of the present invention. FIG. 4 is a perspective view of a case used in an embodiment of the present invention. FIG. 5 is a sectional view of a hybrid IC showing another embodiment of the present invention. FIG. 6 is a plan view of an electronic board used in another embodiment of the present invention. FIG. 7 is a sectional view for explaining another embodiment of the present invention. FIG. 8 is a sectional view of a spacer used in another embodiment of the present invention. FIG. 9 is a perspective view of a hybrid IC showing another embodiment of the present invention. FIG. 10 is a plan view of an electronic board used in another embodiment of the present invention. 1...Flexible board, 2...Electronic component, 3
... Solder, 4... Board, 5... Flexible board, 6a to 6g... Electronic component, 7... Solder, 8
...external terminal, 9...case, 9a...storage section,
9b... Protruding portion, 10... Adhesive, 11... Molding agent, 12... Flexible substrate, 13a-1
3b...Electronic component, 14...Solder, 15...External terminal, 16...External terminal, 17...Case, 1
8... Adhesive, 19... Molding agent, 20... Spacer, 21... Shielding agent, 22... Aluminum foil, 23... Insulating agent.

Claims (1)

[Scope of Claims] 1. A flexible substrate on which a plurality of electronic components are mounted on a wiring pattern formed on the surface of an insulating member and an external terminal is formed at one end, a storage section for storing the flexible substrate, and the storage section. and a protruding part protruding from an outer wall of the storage part, the flexible substrate being wound and stored in the storage part and sealed with a molding agent,
A mounting structure for a hybrid IC, characterized in that the external terminal is led out from the storage portion and supported and fixed to the protrusion.