JPH04332116A - Spin coater - Google Patents

Abstract

PURPOSE:To enable a dispense time to be reduced and a throughput of a high- viscosity macromolecular coat to be improved by allowing a dispense nozzle to be in slit shape. CONSTITUTION:A title item is provided with a tank 8 which is interlocked to a feed pipe 5 of a high-viscosity macromolecule P and can store the high- viscosity macromolecule temporarily and a slit-type high-viscosity macromolecular dropping device 7 with a slit nozzle 9 which is placed at a lower edge of this tank and is constructed so that it can discharge the high- viscosity macromolecule onto a wafer 1 which is placed horizontally from a slit of the above nozzle.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin coating apparatus used for forming a film of high viscosity polymer on the surface of a wafer.

0002

2. Description of the Related Art Conventionally, a spin coating apparatus having a schematic configuration as shown in FIG. 4 has been generally used in a polyimide film forming step of a semiconductor process. That is, this rotary coating apparatus includes a vacuum chuck 2 that attracts and holds a horizontally placed wafer 1, a rotary rod 3 that supports the vacuum chuck 2 and rotates around a vertical axis, and a vacuum chuck and a wafer. It includes a spin cup 4 disposed surrounding the spin cup 4, and a polyimide pipe 5 for supplying polyimide P. A nozzle 6 is installed at the lower end of the resist supply pipe 5.
is provided, and polyimide P is dropped from the opening 6a of the nozzle 6 and is supplied to the rotation center position on the surface of the wafer 2.

That is, using this spin coating device, a wafer 1 is coated.
When forming a polyimide film on the surface of the wafer, first, the wafer 1 is held by suction on the upper surface of the vacuum chuck 2, and polyimide P is supplied to the center of rotation on the wafer surface by dropping it from the nozzle 6. When the rod 3 supporting the vacuum chuck 2 is rotated at high speed, the supplied polyimide P is spread over the surface of the wafer 2 by centrifugal force, forming a thin polyimide film.

0004

However, in the conventional spin coating apparatus as described above, since the polyimide has a high viscosity, the resistance inside the pipe is large, and it takes a considerable amount of time to drip the required amount.

The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a spin coating device that can shorten the dropping time.

[0006]

[Means for Solving the Problems] A rotary coating device according to the present invention includes a vacuum chuck that suctions and rotates a wafer placed in a horizontal state, and a polyimide disposed above the chuck for supplying polyimide. It is equipped with a slit-type high-viscosity polymer dropping device that has a supply pipe, a tank connected to the lower end of the supply pipe and capable of storing polyimide, and a structure that allows the polyimide to be dropped through a slit.

[0007]

[Function] In this invention, since the polyimide is temporarily stored in the tank, the required amount can be supplied even during periods other than the dropping time, and since the polyimide is dropped through a slit, the dropping time can be shortened.

[0008]

[Embodiment] Fig. 1 is a sectional view showing a schematic configuration of a spin coating device according to an embodiment of the present invention, and Fig. 2 is an enlarged perspective view showing a slit-type high-viscosity polymer dropping device, which is the main part. 3 is an enlarged sectional view of the slit nozzle. In these figures, 1 to 5 are the same as those in FIG. The polyimide P is dripped and supplied from the slit. Furthermore, as shown in FIG. 2, the slit-type high-viscosity polymer dropping device 7 is connected to the top thereof with a polyimide supply pipe 5, a vacuum pipe 10, and an N2 pressure pipe 11. A movable valve 12 is arranged to block the. Further, as shown in FIG. 3, this slit nozzle is finely partitioned by partition walls 9a.

Next, its operation will be explained. First, the slit movable valve 12 is turned down to fill the tank 8 with polyimide P supplied through the polyimide supply pipe 5. At this time, the internal pressure is released from the vacuum pipe 10 to aid the supply. Then, while slowly rotating the rotating rod 3,
UP the slit movable valve 12 and press N2 from the N2 pressure pipe 11.
2 is pressurized and polyimide is added dropwise. When the rotating rod rotates once, the vacuum pipe 10 is pulled back for a short time to cause the slit movable valve 12 to go down. After this, the rod starts rotating at high speed to form a thick film.
Polyimide supply will begin immediately.

0010

As explained above, according to the present invention, the dropping time is significantly shortened compared to the conventional method, and the processing capacity of the apparatus is improved.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a schematic configuration of a spin coating apparatus according to an embodiment of the present invention.

FIG. 2 is an enlarged view of the slit-type polyimide dropping device, which is the main part of FIG. 1;

FIG. 3 is a sectional view of the slit nozzle portion at the lower end of FIG. 2;

FIG. 4 is a sectional view showing a schematic configuration of a conventional spin coating device.

[Explanation of symbols]

1 Wafer 2 Vacuum chuck 3 Rotating rod 5 Polyimide supply pipe 7 Slit type high viscosity polymer dropping device 8
Tank 9 Slit nozzle

Claims (1)

[Claims] Claim 1: A vacuum chuck that sucks and holds a horizontally placed wafer and rotates around a vertical axis; a supply pipe arranged above the chuck for supplying a high-viscosity polymer; and a lower end of the supply pipe. A slit-type high-viscosity polymer dropping device is connected to the tank and has a slit nozzle at the bottom of the tank. A rotary coating device characterized in that a droplet is applied onto a wafer from a slit nozzle.