JPH043325U - - Google Patents

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Publication number
JPH043325U
JPH043325U JP4348090U JP4348090U JPH043325U JP H043325 U JPH043325 U JP H043325U JP 4348090 U JP4348090 U JP 4348090U JP 4348090 U JP4348090 U JP 4348090U JP H043325 U JPH043325 U JP H043325U
Authority
JP
Japan
Prior art keywords
heat
elastic body
sensitive element
insulating substrate
sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4348090U
Other languages
English (en)
Other versions
JP2528396Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990043480U priority Critical patent/JP2528396Y2/ja
Publication of JPH043325U publication Critical patent/JPH043325U/ja
Application granted granted Critical
Publication of JP2528396Y2 publication Critical patent/JP2528396Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Fixing For Electrophotography (AREA)

Description

【図面の簡単な説明】
第１図は本考案の感熱素子の斜視図、第２図は
同図の断面図、第３図と第４図は弾性体の２実施
例の斜視図、第５図は本考案の一実施例の断面図
、第６図は同上の斜視図、第７図は一般的な熱応
答特性図である。 １……絶縁性基板、２……感熱膜、３……電極
、４……集熱膜、６……感熱素子、７……弾性体
、８……凹部、１０……切込溝、１１……保持体
。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁性基板の一面に感熱膜と電極とを形成する
    と共に絶縁性基板の他面に金属等の集熱膜を形成
    した感熱素子と、該感熱素子の前記集熱膜面を表
    面にして、該表面が面一になるように取り付けら
    れた弾性体と、前記感熱素子が表面に向くように
    前記弾性体を保持する保持体と、少なくとも前記
    弾性体の表面を被覆する薄膜の絶縁テープとを備
    えたことを特徴とする温度センサ。
JP1990043480U 1990-04-25 1990-04-25 温度センサ Expired - Fee Related JP2528396Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990043480U JP2528396Y2 (ja) 1990-04-25 1990-04-25 温度センサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990043480U JP2528396Y2 (ja) 1990-04-25 1990-04-25 温度センサ

Publications (2)

Publication Number Publication Date
JPH043325U true JPH043325U (ja) 1992-01-13
JP2528396Y2 JP2528396Y2 (ja) 1997-03-12

Family

ID=31555923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990043480U Expired - Fee Related JP2528396Y2 (ja) 1990-04-25 1990-04-25 温度センサ

Country Status (1)

Country Link
JP (1) JP2528396Y2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5494833B2 (ja) * 2011-01-07 2014-05-21 株式会社村田製作所 温度センサおよび温度センサ取り付け構造
CN115398192A (zh) * 2020-03-31 2022-11-25 株式会社村田制作所 温度传感器以及温度传感器阵列
WO2024117119A1 (ja) 2022-11-29 2024-06-06 三菱マテリアル株式会社 温度センサ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042627A (ja) * 1983-08-19 1985-03-06 Ishizuka Denshi Kk 温度検出装置
JPS63120233A (ja) * 1986-11-07 1988-05-24 Matsushita Electric Ind Co Ltd 表面温センサ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6042627A (ja) * 1983-08-19 1985-03-06 Ishizuka Denshi Kk 温度検出装置
JPS63120233A (ja) * 1986-11-07 1988-05-24 Matsushita Electric Ind Co Ltd 表面温センサ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5494833B2 (ja) * 2011-01-07 2014-05-21 株式会社村田製作所 温度センサおよび温度センサ取り付け構造
CN115398192A (zh) * 2020-03-31 2022-11-25 株式会社村田制作所 温度传感器以及温度传感器阵列
WO2024117119A1 (ja) 2022-11-29 2024-06-06 三菱マテリアル株式会社 温度センサ
EP4628862A1 (en) 2022-11-29 2025-10-08 Mitsubishi Materials Corporation Temperature sensor

Also Published As

Publication number Publication date
JP2528396Y2 (ja) 1997-03-12

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